YSI Prog E
YSI Prog E
YSi
Programming Manual
V2.2
EPP6138100
Safety instructions
Safety instructions
w
Be sure to read these safety instructions before using YAMAHA surface mounters or related products.
Contents
CE marking i
1. Safety ii
1.1 To ensure safety ii
1.1.1 Defining safety ii
1.1.2 Causes of injuries and accidents ii
1.2 Using safety gear ii
1.3 Restrictions on machine use iii
1.3.1 Defining the operator and service personnel iii
1.3.2 Restricting machine operation with passwords iii
1.4 Cautions during machine operation iii
1.5 Cautions during power outages iii
1.6 Cautions regarding ferromagnetic fields iii
1.7 Handling the internal tape cutter iii
1.8 Keeping hands away from moving parts iv
1.9 Handling solvents vi
1.10 Handling the X-ray unit vi
3. Warning labels xi
3.1 Warning label format and mark description xi
3.1.1 Warning label format xi
3.1.2 Meaning of marks xi
3.2 Warning labels xii
3.2.1 Handling safety covers xii
3.2.2 Pinching or crushing injury xiii
3.2.3 Effects on human body xiv
3.2.4 Handling each section xvii
3.3 Caution labels xix
3.3.1 Machine damage xix
3.4 Label positions xxiii
SF_SMT_EP133-431
CE marking
This equipment conforms to the EU Machinery Directive 2006/42/EC (description A1 below) and EMC
Directive 2004/108/EC (description A2 below).
However, this equipment does not bear CE marking if a custom order item was installed.
Safety instructions
A1.
Cautions regarding the official language of EU countries and the language used in operation
manuals, CE declarations, operation screen characters, and warning labels when this equipment is
installed in an EU countr y.
• All materials except warning labels are written in English only.
n NOTE
Warning labels only have pictograms or else include warning messages in English, Chinese, Korean and Japanese
language.
A2.
EMC description
• Electromagnetic immunity (Immunity)
Complies with test standards as specified by EN 61000-6-2.
• Electromagnetic emissions (Emission)
Complies with test standards for ISM category: Group 1, Class A, as specified by EN 55011.
n NOTE
Class A equipment is intended for use in industrial environments. If used in other environments, ensuring
electromagnetic compatibility (EMC) might be difficult. Refer to EN 55011 standards for detailed information.
i
1. Safety
To ensure that the machine you purchased is used safely and correctly, always comply with the instructions
and rules in this manual regarding safety. However this manual cannot cover all items regarding safety in
detail. So it is extremely important that the operator or person handling the machine make correct decisions
Safety instructions
regarding safety.
n Hazardous actions
• Ignoring causes of accidents
• Working or operating equipment in cramped locations
• Working in locations or positions where safety cannot be ensured
• Unsafe machine operation and using equipment whose safety cannot be ensured
• Working or operating equipment at speeds where safety cannot be ensured
• Working or operating machines with safety equipment removed
• Performing work or tasks on top of a machine currently in operation
• Playing around or goofing off during work
• Performing maintenance or inspections without wearing safety gear
w WARNING
• Inflammation may occur if grease or lubricant gets in the eyes. Before handling the grease or
lubricant, wear safety goggles to ensure it will not come in contact with the eyes.
• Inflammation may occur if the grease or lubricant comes into contact with skin. Be sure to wear
protective gloves to prevent contact with skin.
• Do not take orally or eat the grease or lubricant. Eating will cause diarrhea and vomiting.
ii
1.3 Restrictions on machine use
1.3.1 Defining the operator and ser vice personnel
c CAUTION
Only the operator and service personnel having sufficient knowledge of this machine should handle this machine.
Safety instructions
Operator:
The operator is someone who has been trained by us in machine operation, has a thorough knowledge of the machine
operation manual and demonstrates adequate knowledge of machine operation and safety.
Main tasks of the operator include pre-operation checks, operation (component mounting) and making setups
(changeovers). The machine is only used in normal operating mode.
Ser vice personnel:
The service personnel are those trained by us in machine maintenance as well as safety instruction and demonstrate a
thorough knowledge of safe handling of the machine according to the type and location of machine operation. They must
also understand hazardous sections of the machine and residual risks.
Main tasks of the service personnel include machine maintenance, repair, adjustment and management of the system.
The service personnel may make changes to the machine settings and operation in factory adjustment mode.
iii
1.8 Keeping hands away from moving parts
During use of this machine, the customer’s equipment and operating conditions might allow the operator’s
hands to come into contact with moving parts.
Use the following safety measure options to avoid possible danger where openings or gaps are found on the
machine.
Safety instructions
■ Dummy feeder
Use dummy feeders as safety measures to fill a gap between tape feeders. Install dummy feeders on the feeder plate the
same way as normal feeders in order to prevent hands from entering.
Clamp lever
c CAUTION
To install or remove a dummy feeder, be sure to first press the emergency button and then open the cover. T he
machine has a structure that does not allow installing or removing a dummy feeder when the machine is in operation.
However, inserting a dummy feeder inside the cover during operation may cause serious accidents, so be careful not
to attempt it.
■ One-stop cover (for machines (except for YSM40) with batch change carrier specs.)
If not using a feeder exchange carriage in the machine that is to be used with feeder exchange carriages, install a
one-stop cover in the position where a feeder exchange carriage is to be installed.
One-stop cover
91204-L0-10
n NOTE
One-stop covers cannot be installed or removed during operation. The machine must be in a stopped state because
the section where a feeder exchange carriage is to be installed will move up and down for the installation or removal
of the feeder exchange carriage.
iv
■ Muzzle plate
Use these plates as a safety measure for the board conveyor entrance and exit openings. Each plate is movable, so adjust
the mounting position to match the boards to be produced.
Muzzle plate
Safety instructions
Upper muzzle plate
91205-L0-00
v
1.9 Handling solvents
Take the following precautions when handling cleaning solvents during solder printing or preparation.
1. The X-ray output window of the X-ray source is made of ver y thin ber yllium foil.
· Beryllium in the form of dust particles can cause acute toxicity or chronic toxicity, and may induce respiratory
problems if inhaled.
· To ensure safety, the X-ray unit is designed so that the X-ray window cannot be touched. However, should the X-ray
output window be broken for some reason, immediately turn off the power switch and use extreme care not to inhale
the dust particles.
· Chlorine gas can corrode the beryllium window of the X-ray tube, causing permanent damage to the X-ray tube. Do
not use the X-ray unit in environments where chlorine gases are generated. Take special care when handling samples
such as vinyl chloride materials which may generate chlorine gases.
2. Lead is used in the covers of machines equipped with an X-ray unit.
Although lead is sealed within the covers so that the lead portions cannot be directly touched, use caution since lead is
known as heavy metal having harmful effects.
3. A safety key is provided for machines equipped with an X-ray unit.
The safety key must be managed by the supervisor of the machine.
vi
2. Safety message
This section describes information you should always comply with to prevent unforeseen accidents that might
lead to injury of the operator and others or damage the machine. Hazards and injuries that might result from
ignoring safety instructions and operating the machine incorrectly are categorized as follows.
Safety instructions
2.1 Safety message and categories in this manual
This manual uses the following safety alert symbols, signal words, and format styles according to the degree of
hazard.
w WARNING
Indicates a potentially hazardous situation which, if not avoided, could result in death or serious injury.
These are points most essential for protecting the safety of the machine operator, inspector and service
personnel.
c CAUTION
Indicates a potentially hazardous situation which, if not avoided, may result in minor injury, or material loss or damage
to the machine. These points are important for protecting the safety of the machine and data, etc.
n NOTE
Gives helpful information or key points when operating the machine, in a simple and clear manner.
e EMERGENCY STOP
This mark indicates the emergency stop button must first be pressed before continuing the procedure.
vii
2.2 Typical warning text found in manual
The following are typical warning message text found in the YAMAHA surface mounter or related product
manual.
When you see the following cautions or warnings, always read them thoroughly and make sure you fully
understand them.
n Warnings
w WARNING
The signal light (signal tower) installed on the top of the machine is an important device that shows the
operating status of the machine. BEFORE OPERATING THE MACHINE, MAKE SURE THAT EACH LAMP OF THE SIGNAL
TOWER LIGHTS UP CORRECTLY (GREEN DURING OPERATION, YELLOW WHEN ERROR OCCURS OR INTERLOCK IS DETECTED,
AND RED DURING EMERGENCY STOP). NEVER PLACE ANY PART OF THE BODY IN THE HEAD MOVEMENT RANGE WHILE THE
GREEN LIGHT IS ON. (On machines designed to meet EU specifications, green/white/blue lamps are used
instead of green/red/yellow lamps.)
w WARNING
Never allow any part of your body (hands, head) to enter within the machine movement range during
operation.
w WARNING
Be careful when using isopropyl alcohol, since inhaling its fumes over long periods can be hazardous
to health.
n Cautions
c CAUTION
The person operating the machine must have been trained in correct machine operation and safety.
c CAUTION
This machine contains parts generating strong magnetic fields. G reat care should be taken when a part of your body
is put inside the machine for the maintenance work. C autions regarding ferromagnetic fields are described in the
section, “Safety Instructions”, at the beginning of this document. A lways thoroughly read this section to fully
understand its contents.
c CAUTION
The exhaust air blow might strike your face, so be sure to wear safety goggles.
viii
2.2.2 Operation and handling precautions
When you see the following cautions or warnings, always read them thoroughly and make sure you fully
understand them.
n Warnings
Safety instructions
w WARNING
Inflammation may occur if grease or lubricant gets in the eyes. Before handling the grease, wear safety
goggles to ensure the grease will not come in contact with the eyes.
w WARNING
Inflammation may occur if the grease or lubricant comes into contact with skin. Be sure to wear
protective gloves to prevent contact with skin.
w WARNING
Do not take orally or eat the grease or lubricant. Eating will cause diarrhea and vomiting.
n Cautions
c CAUTION
Always stop the machine before installing the parts feeder into the machine. Hands or other parts of your body might
otherwise be caught in the moving parts.
c CAUTION
During operation only press the emergency stop button in cases of emergency.
c CAUTION
Always turn off the power with the correct procedure. Using hasty or incorrect procedures to turn off power might
damage the flash disk in the machine.
c CAUTION
When installing push-up pins on the push-up plate, set them in positions where they will not interfere with the conveyor
rails or other parts when the push-up plate is raised.
c CAUTION
When the machine you are using is not equipped with a nozzle station, you must change the nozzle by hand if it is not
a specified nozzle. In this case, always first press the emergency stop button.
c CAUTION
If an abnormality occurs during warm-up, immediately stop the machine, find the cause of the problem and eliminate it.
c CAUTION
When storing the grease after use, tightly close the cap of the grease tube or container to prevent dust and moisture
from entering inside. S tore it in a dark place to avoid direct sunlight, and keep away from fire and heating sources.
c CAUTION
After copying board data or system data into a USB flash memory, do not leave that data in the USB flash memory for
a long time. U se the USB flash memory just as a copy medium for backup data. P repare other backup media
(CD , DVD , MO , etc.) to store backup data more safely.
c CAUTION
You can also clean and grease the ball screw after removing the push-up plate. H owever, the push-up plate is heavy.
S o, take great care during handling.
c CAUTION
A strong air flow is exhausted during the cleaning blow. Always remove all nozzles attached to the heads before
starting the cleaning blow. Starting the cleaning blow while the nozzles are still attached may blow the nozzles away
from the heads causing the nozzles to break or become lost.
ix
2.2.3 Facilities and environmental condition
When you see the following cautions or warnings, always read them thoroughly and make sure you fully
understand them.
n Warnings
Safety instructions
w WARNING
Always shut off the power and air supply before replacing parts or performing repairs.
w WARNING
During teaching or when making machine adjustments, always keep alert so that you can stop the
machine whenever needed.
w WARNING
Safety devices (safety interlocks) that stop machine operation should always be in good operating
condition.
w WARNING
The machine should never be used in locations with inflammable gas or in extremely dirty or polluted
environments.
w WARNING
• Persons wearing electro-medical devices such as cardiac pacemakers must be kept away from the
head assembly.
• Persons with implanted magnetic metals must be kept away from the head assembly.
• Do not bring ferrous objects such as metal tools and screws close to the parts where a strong
magnetic field warning is indicated.
• Do not bring magnetic cards or objects vulnerable to magnetic fields close to the head assembly.
w WARNING
To avoid the risk of electrical shock, make sure that the power source i s off before connecting the
power cable. A lso make sure that the ground cable i s securely connected to the machine.
n Cautions
c CAUTION
When disconnecting the air hose, be careful not to allow oil, water or impurities to splash outwards. A dditionally, take
great care since a large air exhaust sound is produced when disconnecting the coupler.
c CAUTION
Use a power cable whose conductor cross-section area is greater than 3.5mm2.
x
3. Warning labels
To use the YAMAHA machines safely and correctly, warning labels are attached to the machine body and
peripheral equipment. Check that the information on each warning label is clearly legible and comply with
the instructions.
Safety instructions
3.1 Warning label format and mark description
Message
90K41-000380
91206-L0-00
Usage examples
91207-L0-00
xi
3.2 Warning labels
Safety instructions
Potential
Unexpected accidents may occur if safety mechanisms are disabled.
hazard
To avoid Do not remove or disassemble any specified safety mechanism (protective cover, safety cover,
hazard etc.).
Applicable
YS24, YS24X, YSH20, etc. Case All case
machines
xii
3.2.2 Pinching or crushing injur y
Potential · Hands or fingers might be caught between moving parts and covers, causing injury.
Safety instructions
hazard · Hands or fingers might be pinched by moving parts, causing injury.
To avoid
Never place hands or fingers in machine during operation such as when handling tray magazines.
hazard
Applicable
All YS series machines, tray changers, etc. Case All case
machines
Potential
Hands or fingers might be pinched or crushed by clamp plate, causing injury.
hazard
To avoid
Never place hands or fingers in the machine when clamping a mask.
hazard
Applicable • Setup
YSP Case
• Maintenance
machines
Potential
Injury from tape cutter
hazard
To avoid
Do not put hands into cutter unit while power or compressed air is supplied.
hazard
Applicable
YS series (machines equipped with tape cutter) Case Maintenance
machines
xiii
3.2.3 Effects on human body
Potential
Safety instructions
Potential
Death, serious injury or equipment malfunction
hazard
To avoid
Observe precautions necessary due to strong magnetic fields.
hazard
Applicable
YS12, YS12P, YS12F, YS24, YS24X, YSH20, etc. Case All case
machines
Potential
Electrical shock hazard
hazard
To avoid
Do not touch power supply inside cover.
hazard
Applicable
All machines Case All case
machines
xiv
Potential
Burn hazard
hazard
Safety instructions
To avoid
Heater becomes very hot during and shortly after operation, so do not touch it.
hazard
Applicable • Setup
YSH20 machines equipped with heater (option) Case
• Maintenance
machines
Potential
Electrical shock hazard
hazard
To avoid
Do not touch while power is supplied.
hazard
Applicable All YS series machines (controller unit) except for inspection
Case Maintenance
machines equipment
Potential
Loss of eyesight
hazard
To avoid
Do not directly look into laser beam.
hazard
Applicable IT options such as barcode readers (Class 2 laser)
Case All case
machines YS series machines (Class 1 laser)
xv
Potential
Electrical shock
hazard
Safety instructions
To avoid
Keep the ionizer away from eyes. Do not disassemble or touch the discharge needles.
hazard
Applicable
Machines equipped with ionizer (option) Case All case
machines
Potential
Electrical shock
hazard
To avoid
Always turn off UPS switch when performing maintenance work.
hazard
Applicable
Machines equipped with UPS (option) Case Maintenance
machines
Potential
Electrical shock
hazard
To avoid
Always turn off UPS switch when performing maintenance work.
hazard
Applicable
Machines equipped with UPS (option) Case Maintenance
machines
xvi
3.2.4 Handling each section
Potential
Safety instructions
Solvent may catch fire.
hazard
To avoid
Keep solvents such as alcohol away from fire or flame.
hazard
Applicable • Setup
All solder paste printers Case
• Maintenance
machines
Potential
Electrical shock hazard
hazard
To avoid
Before opening covers wait at least 100 seconds after turning power off.
hazard
Applicable
All machines Case Maintenance
machines
Potential
Possible skidding or slipping causing injury
hazard
To avoid
Do not step on base section.
hazard
Applicable
YS24X (machines equipped with sATS II) Case All case
machines
xvii
Potential
Damage to machine or injury to person
hazard
Safety instructions
To avoid Before handling the product (equipment) always read manuals and make sure you fully understand
hazard the contents.
Applicable
All YS series machines Case All case
machines
Potential
Exposure to radiation
hazard
To avoid
Keep covers closed during operation.
hazard
Applicable
YSi-X Case All case
machines
Potential
Risk of injury
hazard
To avoid
Do not open any cover without permission from YAMAMA service personnel.
hazard
Applicable
Maintenance parts for linear motors (strong magnetic fields) Case Maintenance
machines
xviii
3.3 Caution labels
Safety instructions
3.3.1 Machine damage
Potential
Adverse effects on component mounting accuracy
hazard
To avoid
Do not touch camera unit or apply impacts to it.
hazard
Applicable • Setup
All machines Case
• Maintenance
machines
Potential
Risk of damage
hazard
To avoid
Remove shipping bolts and clamps before using machine.
hazard
Applicable
Feeder exchange carriage (option) Case Installation
machines
Potential
Machine damage or malfunction
hazard
To avoid
Connect power only at the specified voltage.
hazard
Applicable
All machines Case Installation
machines
xix
Potential
Machine damage
hazard
Safety instructions
To avoid
Make sure push-up pins are arranged within specified area.
hazard
Applicable
YS24, YS24X Case Setup
machines
Potential
Machine damage or fire
hazard
To avoid
Do not use other than specified solvent.
hazard
Applicable • Setup
All solder paste printers Case
• Maintenance
machines
Potential
Machine damage
hazard
To avoid
Always use gauze rolls of proper size.
hazard
Applicable • Setup
All solder paste printers Case
• Maintenance
machines
xx
Potential
Machine damage
hazard
Safety instructions
To avoid If machine is not to be used for 6 months or more, block off the solvent path to protect solvent
hazard pump.
Applicable
All solder paste printers Case Maintenance
machines
Potential
Might disable machine functions
hazard
To avoid
Periodically replace USP battery since it has a limited service life.
hazard
Applicable
Machines equipped with UPS (option) Case Maintenance
machines
Potential
Machine damage
hazard
To avoid
Read manuals and use correct procedure to operate machine.
hazard
Applicable
YS24X (machines equipped with sATS II) Case All case
machines
xxi
Potential
Could cause machine damage (collisions with head, etc.).
hazard
Safety instructions
To avoid
Verify that no objects have been placed on the batch change carrier's (for YSM40) top cover.
hazard
Applicable
Batch change carrier (YSM40) Case Setup
machines
Potential
The top tape could make contact with the head, possibly causing machine damage.
hazard
To avoid When a feeder is extracted from its loaded position, be sure that the feeder has been completely
hazard extracted before pressing it back into its loaded position.
Applicable
YSM40 Case Setup
machines
Potential
Pallet may drop if setting up parts on the parts supply station.
hazard
To avoid
Remove pallets before setting up parts.
hazard
Applicable
C-ATS (YSM40) Case Setup
machines
xxii
3.4 Label positions
Warning/caution labels are attached to the YAMAHA products to ensure safe and correct use. Check that the
information on each label is clearly legible and comply with the instructions.
For safety precautions other than those on the labels shown in this section, see the instructions in "1. Safety".
Safety instructions
NOTE
When connecting power to this equipment, refer to "Power connection terminals" described in the appendix of the
operator's manual.
n NOTE
The label contents and positions are slightly differ depending on machine model. For the label contents and positions,
refer to the operator's manual for the machine being used.
xxiii
General Contents
2. Warranty ii
4. Page layout iv
EPP6138100
2.2.2 Starting automatic inspection 1-29
2.2.3 Upside down automatic inspection settings 1-30
2.3 When NG detection occurs 1-32
2.3.1 NG monitor 1-32
2.4 Inspection complete screen 1-34
2.5 Ending the automatic inspection 1-35
Appendix
1. List of keyboard shortcut keys i
INDEX
Before using the machine
Contents
2. Warranty ii
4. Page layout iv
1. Using this manual
■ Available manuals
The following manuals are supplied with the machine you purchased.
Programming Manual
Operator's Manual
This manual
23000-P6-00
This manual is intended for machine operators. It provides This manual is intended for those who program inspection
an overview of the machine and information necessary to data. It describes how to create and edit data needed for
operate the machine. machine operation and board inspection.
Before using the machine
Before using the machine
Chapter 1: Basic operation
Chapter 1: Part names and functions
Chapter 2: Creating inspection programs
Chapter 2: Basic operation
Chapter 3: Step screen
Chapter 3: Daily operation
Chapter 4: Inspection status
Chapter 4: Maintenance
Chapter 5: Inspection machine settings
Appendix Specifications, option units, etc.
Appendix List of keyboard shortcut keys
c CAUTION
The contents of these manuals are subject to change without prior notice.
i
2. Warranty
Before using the machine
The machine you have purchased is warranted against malfunctions as described below.
n Warranty description:
If a failure or breakdown occurs due to defects in workmanship or materials used to manufacture this machine within
one year or 5,000 hours of operation (whichever comes first) after the incoming inspection is complete, then YAMAHA
will repair the defective parts free of charge.
n Warranty period
The warranty period ends when any of the following applies:
1. After one year has elapsed from the time of installation.
2. After 5,000 hours of operation.
ii
3. Contents of each chapter
Appendix
This section describes keyboard shortcut functions that are available when performing screen operation.
Index
The index at the end of this manual helps you quickly find where necessary items are explained.
iii
4. Page layout
Before using the machine
The description below shows a typical page layout used in this manual.
5. Block settings
A "block" is the inspection range (field-of-view) of the inspection device. Blocks must be set on the board
locations to cover all parts to be inspected. Because the image of each block is acquired and saved, block
settings must be performed on the actual machine. (On the offline software, some buttons are grayed out and
inactive.)
Note, Caution
The basic block setting procedure is explained below.
2 Chapter number
NOTE
When an inspection program created with P-Tool is loaded, there is no need to set blocks because they have already
or Warning been set.
Step Blocks can be automatically created by using the VADMIC editor. Chapter title
Open the "Data Edit" screen and set a board in place.
Sub step or When you press the [Data edit] button on the "Main" screen, a "Set PCB?" message appears. At this time,
description of step set a board at the entrance sensor detection position on the conveyor and then press the [Yes] button.
Figure, picture
or table caption
24219-K0-10
2-15
23001-P6-00
n Step
This describes the procedure for each operation.
iv
Chapter 1 Basic operation
Contents
basic operation
The YSi series operation screen can be divided into the "Status area", "Button area", and "Free area" as shown
below.
Button area
Free area
24101-P6-00
Status area
Displays the current machine status on the left end, the selected inspection program name in the middle, and the number of boards
that have been inspected on the right end.
Button area
This area allows selecting the main menus for machine operation. The "Free area" screen will change according to the selected menu
button.
Free area
Displays the operation screen selected by a menu button in the "Button area".
1-1
1.2 Button area's functions
The functions that can be used by pressing each menu button in the "Button area" are described below.
1 The contents of the "Free area" change according to the selected menu button. Each screen that opens by press-
ing a menu button is described on the following pages.
Button area
basic operation
1
2
3
4
5
6
7
8
9
10
11
12
13
24102-P6-00
■ Button area
Opens the "Setup" screen used to manage programs. (See 1.3, "Setup screen", in this
1 Setup
chapter.)
Opens the "Data Edit" screen used to edit inspection data. (See 1.4, "Data Edit screen",
2 Data Edit
in this chapter.)
Opens the "Auto Inspection" screen used to perform auto board inspection.
3 Auto
(See 1.5, "Auto Inspection screen", in this chapter.)
Opens the "Unit (manual operation)" screen. (See 1.6, "Unit (manual operation) screen",
4 Unit
in this chapter.)
Displays errors that have occurred and operation history. (See 1.7, "History", in this
5 MIS
chapter.)
Saves inspection programs.
6 Save After editing data on each screen, pressing this [Save] button opens a confirmation
dialog. Press the [OK] button in the confirmation dialog to save the edited data.
Unloads the board in the inspection machine and loads another board into the machine.
7 Change Also press this button to load a board into the inspection machine where no board is
loaded.
Selects the operator who will be operating the inspection machine. (See Chapter 5, "1.
8 Operator
Operator management", in this manual.)
Opens a screen used to specify inspection machine settings. (See Chapter 5, "2.
9 Machine
Machine settings", in this manual.)
Displays the current inspection machine application language. Select from the drop-down
11 Language
list to change the language.
1-2
1.3 Setup screen
The "Setup" screen allows you to manage inspection programs and specify settings for all utilities. The items
and buttons displayed on the screen are described below.
"Setup" screen
1
YSi-X example
1 2
basic operation
3
13
14
6 4
15
16
20
5 11 12 7 8 9 10 17 18 19
24103-P6-00
1 Path Shows the path to the location where inspection programs are stored.
Changes the selected program in the list. Programs can also be selected by directly
3 Program change
clicking programs in the list.
Loads the inspection program selected in the program list. Programs can also be loaded
4 Select
by directly double-clicking programs in the list.
Selects mount data (YGX) and converts it to an inspection program. (See Chapter 2,
12 Convert
"2.2 Data conversion", in this manual.)
13 Origin* Moves the inspection head, conveyor, and laser unit to their respective origin positions.
14 Warmup* Opens a dialog box for warming up the servo motor axes.
16 X-ray Information (YSi-X)* Performs an X-ray source status check and self test.
Press this button to register and edit operators, and set passwords and operator levels,
18 Operator Management
etc. (See Chapter 5, "1. Operator management", in this manual.)
20 SW Version Displays the software version, running time, machine serial number, etc.
1-3
1.4 Data Edit screen
The items and buttons displayed on the "Data Edit" screen are described below.
1 For instructions on how to set inspection data, refer to Chapter 2, "Creating and setting data", in this manual.
2 3 4 5
24104-P6-00
1 Board parameter In this list, set parameter data such as board size to perform inspection.
1-4
1.4.2 "Fiducial" screen
This screen allows setting fiducial marks to use the fiducial function. Based on recognition results of the
1
fiducial marks on the board under inspection, the fiducial function corrects local distortion or warps on the
board that may occur from errors in machining the board outline or locate pin holes, or board clamping
mechanism fluctuations.
basic operation
1
2
3
Mark list 4
Mark type list
7
8
5
9
10
6 11
12 13 14 15 16 17 18 19 20 Basic parameter
24105-P9-00
1 Board/Block/Local The unit for enabling the fiducial function can be selected from board, block, or local.
2 Trace Moves the camera to the mark XY coordinates selected in the mark list.
3 Teach The center of the recognized mark is registered as the fiducial mark position coordinates.
4 Find Searches for and replaces items registered in the block or local mark list.
Displays a list with the mark image illuminated under each lighting, allowing the operator
9 Light List
to select the most suitable lighting from the list.
By dragging the mouse to enclose the identified mark, parameters are measured
10 Measure
automatically based on the "Algorithm Type" set in the basic parameters.
Saves template data for pattern matching. This button becomes active when pattern
11 Template
matching is selected at "A. Algorithm Type" in the basic parameters.
13 Detected Displays the detected range based on the set threshold value conditions in red.
14 Insp img Displays the inspection image with the lighting selected in the lighting list.
15 Image List Selects fiducial mark images saved to the image list.
Pressing this button changes the pitch for the camera to move when the arrow buttons
16 0.1mm
on the scroll bars are pressed. (0.01mm, 0.100mm, 0.500mm, 5.000m)
17 Result display Displays the result of the fiducial mark recognition test.
20 Threshold slide bar Displays and changes the detection threshold value.
1-5
1.4.3 "Bad Mark" screen
This screen allows you to set bad marks in order to use the bad mark function. The bad mark function involves
1
affixing a mark (bad mark) to a set location on the board in order to ensure that inspection is not performed
when the mark is recognized by the inspection machine.
1
2
3
Mark list
4
7
8
5
6
10
11 12 13 14 Basic parameter
24106-P6-00
1 Board/Block/Local The unit for enabling the bad mark function can be selected from board, block, or local.
2 Trace Moves the camera to the mark XY coordinates selected in the mark list.
3 Teach The center of the recognized mark is registered as the bad mark position coordinates.
4 Find Searches for and replaces items registered in the block or local mark list.
Displays a list with the mark image illuminated under each lighting, allowing the operator
9 Light List
to select the most suitable lighting from the list.
Sets the threshold value used for mark recognition. By pressing this button, a "Bad mark
10 Thresh threshold value setting" screen appears, allowing the user to set the threshold value
when marks are detected and when not detected.
Displays the view image selected in the view list. The view image can be changed even
11 Insp img
by selecting the board image view.
Pressing this button changes the pitch for the camera to move when the arrow buttons
12 0.1mm
on the scroll bars are pressed. (0.01mm, 0.100mm, 0.500mm, 5.000m)
13 Result display Displays the result of the bad mark recognition test.
1-6
1.4.4 "View" screen
This screen allows you to register inspection view coordinates, save view images, and edit views.
View list
1
1
basic operation
2
View radar
3
4
5
13
14
6 15
16
17
View image
18
7
19 20 21 22 23 8 9 10 11 12
24107-P6-00
1 Add View* Adds a view at the lower right of the selected view.
Displays the selected view image. The view image can be changed even by selecting the
4 Trace
board image view.
7 Change lighting Changes the view image lighting. Select the lighting from U, H, M, L, and X (YSi-X).
10 Overwrite* Select images in the OK board image list, and then press this button to overwrite images.
The [Edit Step] button becomes valid when the (NG) tab is opened. By selecting the view
for which "0" is displayed in the existing images list, selecting applicable parts from the
12 Edt Step
displayed parts list, and then pressing this button, the "Step" screen appears, allowing
the first step for relevant parts to be selected.
13 Rotation Sets the angle to rotate the copied view when pasting it.
16 Auto* Automatically creates views while taking the step frame positions and sizes into account.
17 Sort* Changes the view numbers so that the camera movement time becomes the shortest.
1-7
Item/button name Function
1
Pressing this button changes the pitch for the camera to move when the arrow buttons
21 0.1mm*
on the scroll bars are pressed. (0.01mm, 0.100mm, 0.500mm, 5.000mm)
Displays whether images exist in each view for board ID images selected in the image
22 Existing images list
list. is displayed if the image exists, and X is displayed in the image does not exist.
23 NG parts list Displays all NG parts for the entire view saved as an NG image.
basic operation
1
2
3
4
5
8 9 10 11 12 13 14
24108-P6-00
Displays data displayed in the step data list as all steps in the program, or as inspection
1 List
steps for the currently selected part.
Cuts (deletes) the selected rows and copies them to the clipboard. The data rows below
2 Cut the deleted rows move up.The cut data is kept stored until different data is cut or paste
to the clipboard.
Inserts and overwrites data copied to the clipboard into inspection data. Pressing this
4 Paste
button displays an "Add step" dialog box, allowing the add method to be selected.
5 Delete Deletes the selected data rows. The data rows below the deleted rows move up.
7 Change lighting Changes the step image lighting. Select the lighting from U, H, M, L, and X (YSi-X).
Displays an image at the step frame position, by capturing it under lighting used for
11 Insp Img
inspection.
A list of images saved to the inspection program appears. Select the image to be
12 Image List
displayed from the image list.
1-8
Item/button name Function
Pressing this button changes the pitch for the camera to move when the arrow buttons
0.1mm
1
13
on the scroll bars are pressed. (0.01mm, 0.100mm, 0.500mm, 5.000mm)
By specifying the number of divisions at [Edit Assist] - [?Deploy Foreign Matter Check?]
14 Foreign Disp in the (Tuning) tab, created foreign matter check steps are displayed. Furthermore, steps
in the adjacent view appear in a yellow box.
basic operation
Parameter screens
Basic Light Detail
1
2
Detect Judge
3 4
5
OPtion
24109-P9-00
1 Light sampling Type Selects the method used to recognize the inspection object.
LIGHT
2 Light Detail Specifies detailed settings used to recognize the inspection object.
Detect 3 Area By pressing this button, the area inside the step is entered in "Std Area".
4 All Set Pressing this button also sets the selected offset in other directions.
Judge
5 OCR Reg. Registers an original character font for each user as the character recognition font.
Option 6 Mask Teach Moves the mask area, and changes the size.
TIP
For details on each parameter, refer to Chapter 3, "1. Parameters", in this manual.
1-9
[Data Edit] – [Step] screen
[Tuning] tab[Utility] tab
1
[Tuning] tab 1 2 3 6 7 9
basic operation
4 5 8 10
[Utility] tab 11 15
13 12 14 16 17
24110-P6-00
Tuning Performs a continuous test of the selected steps, and displays the results.
1 Step Performs an inspection until the [End] button is pressed, and displays the test
results in the "Step" screen.
2 Parts Performs a test of all steps for the selected part, and displays the results.
Sets conditions for steps subject to inspection, and performs a test. (See Chapter
3 Multi
3, "2.4.1 Multi-test", in this manual.)
6 Register Registers the steps for the selected part in the library.
Copies steps, adds pin Nos., deploys arrangement and pin information, and
9 Edit Assist
deploys foreign matter checks. (See Chapter 3, "3 Edit assist", in this manual.)
All results can be checked when the test is complete. (See Chapter 3, "2.4.2
10 Detail
Measurement results", in this manual.)
Utility Sets conditions, and replaces parameters for the relevant step at one time. (See
11 Replace
Chapter 3, "4.1 Replace", in this manual.)
Set the type and character string for the inspection object at the "Search" screen,
12 Search and press the [Next Search] button to jump to the relevant step. (See Chapter 3,
"4.2 Search", in this manual.)
Displays a list of recognized images with the YAMAHA standard lighting settings.
13 Light List Furthermore, new lighting settings can be registered, and lighting settings can be
set to steps.
Displays the "Library unset parts" screen, and displays steps to which no library
16 Lib Non
has been pasted in a list.
1-10
1.4.6 "Height Correct" screen (YSi-X)
Height is measured with a laser height sensor, and height is then corrected in order to perform X-ray inspection
1
correctly.
basic operation
2
1 5
6
7 8
24111-P6-00
The unit for enabling the height correction function can be selected from board
1 Board/Local
or local.
+ : Enlarges the height correction image.
2 Image size change - : Reduces the height correction image.
The image can also be enlarged and reduced by rotating the mouse wheel.
Changes the code scan image lighting. Select the lighting that results in the
3 Change lighting
clearest mark image from U, H, M, and L.
Pressing this button changes the pitch for the camera to move when the arrow
4 0.1mm
buttons on the scroll bars are pressed. (0.01mm, 0.100mm, 0.500mm, 5.000mm)
By pressing this button, the height of the position selected in the list is measured
7 Test
and then displayed in the upper right screen.
Pressing this button and moving the mouse to the upper right screen displays
8 Measure
the XY coordinates and height.
TIP
Height correction performed locally becomes valid in view units, and is set in the "Height correct" field in the "View"
screen view data.
1-11
1.4.7 "Code Scan" screen
The code scan function is used to read QR Codes and so on affixed to boards to identify boards IDs. Board IDs
1
are used when outputting SPC data, and when outputting results to the Repair Station (option).
This screen allows you to set and edit code scan conditions.
1
2
3
6
7
4
9 10 11 12
24112-P6-00
3 Find Searches for and replaces items registered in the mark list.
Displays a list with the mark image illuminated under each lighting, allowing the
8 Light List
operator to select the most suitable lighting from the list.
Displays the code scan image captured with the lighting used to perform
9 Insp Img
inspection in the code scan position.
Pressing this button changes the pitch for the camera to move when the arrow
10 0.1mm
buttons on the scroll bars are pressed. (0.01mm, 0.100mm, 0.500mm, 5.000m)
1-12
1.5 Auto inspection screen
Press the [Auto] button to perform automatic board inspection.
This section describes the screen items and buttons that appear when the [Auto] button is pressed.
basic operation
[Auto] – [Inspection] screen
1
2
3
5
6
7 8 12 9 10 11
24113-P6-00
1 Judgment Mode Displays optional software used to send inspection results to the Repair Station.
Selects and displays the image display. Select the display type from the
2 Image View Type
drop-down list.
Selects and displays the inspection results displayed in the results details list.
3 Display Type
Select the display type from the drop-down list.
Displays inspection steps for the inspection results specified in "Display Type".
4 Rsult detail
(No steps are displayed if the no Ref. Nos. have been set for the steps.)
The number of parts for which an OK inspection result was obtained is
5 OK Parts Count
displayed.
The number of parts for which an NG inspection result was obtained is
6 NG Parts Count
displayed.
Inspects images saved to the inspection program. Pressing this button displays
7 Image List
an "Image list" screen. Select an image and then press the [Select] button.
This button appears when "Use" is set in "Server Settings" → "Lot Unit
8 Lot Edit Management" in the machine settings. Pressing this button displays a "Lot input"
screen, allowing the lot No. and production quantity to be edited.
Inspection result
12 Displays the board inspection result.
display field
1-13
1.5.2 "Whole" screen
This screen displays the inspection state in real-time, such as the number of boards that have been inspected.
1
When the inspection program is changed, information related to that inspection program will be cleared.
The displayed items can be changed by pressing the [Display Change] button on the right side of each item.
NG information
24114-P6-00
Shows the number of boards inspected after the current inspection program is
Inspection Count Sheet selected.
Boards for which inspection is stopped before it is completed will not be counted.
Shows the total number of boards inspected after the inspection machine
Total Count Sheet
application software is started.
Cycle Time Sec/Step This is the average inspection time per step.
Over Judge Rate % OK CONT count / number of inspected steps × 100 (%)
This is the number of OK boards divided by the number of inspected boards and
First-Pass Rate %
then multiplied by 100 (%).
Number of defective boards / number of inspected boards × 100 (%). This is
NG Rate %
counted after the current inspection program is selected
NG count for each Ref / total Ref count (number of parts) × 100 (%). This is
Parts NG Rate %
counted after the current inspection program is selected.
Total number of defective steps / total number of inspected steps × 100 (%). This
Total NG Rate %
is counted after the inspection machine application software is started.
Displays the number of NG boards after changing to the inspection program
NG Board Count Sheet
currently being used to perform inspection.
Displays the total number of NG boards since the inspection machine application
Total NG Board Count Sheet
was started.
Displays the number of OK boards after changing to the inspection program
First-Pass Count Sheet
currently being used to perform inspection.
Displays the number of NG steps after changing to the inspection program
NG Count Step
currently being used to perform inspection.
Displays the total number of NG steps since the inspection machine application
Total NG Count Step
was started.
Average inspection time × (number of inspected boards) / machine's cumulative
Operating Rate %/lot
inspection time
Average inspection time × (number of inspected boards) / (machine's cumulative
Working Rate %/lot
inspection time – board wait time – board unloading wait time)
1-14
1.5.3 "Output" screen
This screen displays the cycle time for inspected boards for each inspection.
basic operation
24115-P6-00
This is the time from the start of board inspection until the end of board
Total Inspection Sec
inspection.
This is the time from the point the board is detected by the sensor at the
Carry-in Sec
conveyor entrance board until board clamping is complete.
This is the time from the point board unclamping is started until the board
Carry-out Sec
passes the sensor at the conveyor exit.
This is the length of time spent waiting for the judgment from the Repair
InspectionWaitTime Sec
Judgment Station or secondary judgment.
This is the time from the start of board fiducial recognition until the end of board
Fiducial Recognition Sec
fiducial recognition. This also includes recognition retry time.
This is the time from the start of bad mark recognition until the end of bad mark
Bad Mark Recognition Sec
recognition. This also includes recognition retry time.
Code Recognition Sec This is the length of time spent performing a code scan.
1-15
1.5.4 "Bad Mark" screen
This screen allows you to display the bad mark recognition results for each inspection. Recognition results can
1
be checked by selecting the bad mark type from a drop-down list.
Recognition results
24116-P6-00
OK image
Inspection image
1-16
1. [NG Reason] button
Changes the NG reason for NG steps.
1
2. [All NG] button
Judges NG for all steps judged to be NG by the inspection machine.
basic operation
This screen exists when the machine is equipped with a laser height sensor. Displays the measurement result if
performing height measurement inspection.
24118-P6-00
1-17
1.5.7 "Conveyor" screen
Displays the current conveyor status.
YSi-X
24119-P6-00
Ent. Upper – YSi-X Lights up green when the entrance shutter is open.
Ent. Lower – YSi-X Lights up green when the exit shutter is closed.
Downstream Lights up green when inputting a board transfer permission signal from
Busy In YSi-12 YSi-X
side the downstream machine.
Lights up green when outputting a board unloading request signal from
BA Out YSi-12 YSi-X
the downstream machine.
Exit Upper – YSi-X Lights up green when the entrance shutter is open.
Exit Lower – YSi-X Lights up green when the exit shutter is closed.
Conveyor Push Up YSi-12 YSi-X Lights up green when the push up is up.
Entrance,
YSi-12 YSi-X Lights up green when the board is present at each position.
Inspection, Exit
Inspection Result OK YSi-12 YSi-X Lights up green when the board inspection result is "OK".
result
Result NG YSi-12 YSi-X Lights up green when the board inspection result is "NG".
1-18
Item Applicable model Status
Other Stopper YSi-12 YSi-X Lights up green when the board stopper is closed.
Clamp
Edge Clamp
YSi-12
–
YSi-X
YSi-X
Lights up green when the board clamp is closed.
basic operation
MS Safety sensor – YSi-X Lights up green when the main stopper is down.
24120-P6-00
1-19
1.6 Unit (manual operation) screen
This section describes manual operation buttons on the "Unit" screen.
1 n NOTE
The "Unit (manual operation)" screen does not work with the optional YSi-OS offline software. Basic operation
This screen allows you to operate the conveyor unit and so on.
Display area 2 1 4 5 6 7
YSi-X
13
3
14
16
17
18
19
8 9 10 11 12 15
YSi-12
20
21
24 22 23
YSi-S
25
26
27
24121-P6-00
1-20
Item/button
Applicable model Description
name
+ : Enlarges the image.
1
1 Zoom YSi-X YSi-12 YSi-S - : Reduces the enlarged image.
The image can also be enlarged and reduced by rotating the mouse wheel.
Changes the mark image lighting.
2 Change lighting YSi-X YSi-12 YSi-S
(U, H, M, L)
Pressing the button each time changes the camera movement pitch when
3 0.1mm YSi-X YSi-12 YSi-S
the scroll bar arrow is pressed. (0.01 mm, 0.100 mm, 0.500 mm, 5.000 mm)
basic operation
The image position can be moved using the arrows, or by entering values
directly in the "Now Position" fields.
4 Table YSi-X YSi-12 YSi-S YSi-X : The table moves.
YSi-12 : The camera moves.
YSi-S : The camera and table move.
The X-ray source and optical camera can be moved using the arrows, or by
entering values directly in the "Now Position" fields.
5 Head YSi-X – –
HZ button : Moves the X-ray source up and down.
HS button : Moves the optical camera left and right.
The X-ray detector can be moved using the arrows, or by entering values
6 XRay Cam YSi-X – –
directly in the "Now Position" fields.
Press the [W] button to turn the conveyor brake ON and OFF.
YSi-X : Press the [W+] button and [W-] button to move the conveyor
position.
7 Conveyor YSi-X YSi-12 – Press the [MS+] button and [MS-] button to move the stopper
position.
YSi-12 : Press the [W+] button to widen the conveyor width.
Press the [W-] button to narrow the conveyor width.
9 Cycle Capture YSi-X YSi-12 YSi-S Displays the upper left display area for continuous capture.
11 Edge Clamp YSi-X YSi-12 – Opens and closes the board clamp.
13 Setup Pos. YSi-X YSi-12 YSi-S The conveyor moves to the setup position.
16 Origin YSi-X YSi-12 YSi-S The head, conveyor, and laser unit move to their respective origin positions.
17 Cover Lock YSi-X YSi-12 – Opens and closes the safety cover lock.
1-21
1.6.2 "I/O" screen
This screen allows you to perform I/O signal status checks and turn outputs ON and OFF.
1 ■ YSi-S, YSi-X
1 2
3 4
24122-P6-00
1 ON/OFF switch (individual) Turns the output signal for the location selected with the cursor ON and OFF.
2 ON/OFF switch (line) Turns the output signals for the line selected with the cursor ON and OFF.
Displays the output signal name selected with the cursor, and the meaning of "0"
3 Output signal description
and "1".
Displays the input signal name selected with the cursor, and the meaning of "0"
4 Input signal description
and "1".
1-22
■ YSi-12
basic operation
24123-P6-00
Item Function
Clicking check boxes turns the output signal for the selected location ON and
1 Output Port No.
OFF.
1-23
1.7 Histor y
The inspection machine operating history can be displayed. Error, operator, board, lot, and light check history
1 can be displayed.
TIP
History for each item is displayed in up to 1,000 lines in order of date, and is deleted starting with oldest line first.
Basic operation
basic operation
History
[Error] tab example
[Clear] button
24124-P6-00
Error
Displays errors that occurred at the machine or the task involved. Each error or task is displayed in a single line of data.
Operator
Displays the operator operation history. Each operation is displayed in a single line of data.
Board
Displays the inspection history. History for each board is displayed in a single line of data.
Program Log
Displays production results per lot, with one lot treaded as the interval from the loading of a program (board data) until
switching over to the next program.
One data row is used to record one lot. Up to 1000 rows can be displayed.
Light Check
The standard value is displayed in the first line, and the results when the lighting intensity check was performed are
displayed in the second line onward. Each lighting intensity check is displayed in a single line of data.
[Clear] button
Use this button to delete all log data currently displayed on the screen. Data cannot be deleted in rows.
When a confirmation dialog box appears, press the [Yes] button to delete the log data.
c CAUTION
Data cannot be recovered once deleted, so use caution.
1-24
1.8 Operator selection screen
Pressing the [Operators] tab opens an "ID WINDOW" screen.
The machine operator is selected at this screen.
TIP
Operation items differ depending on the selected operator level. For details on items displayed in the "ID WINDOW"
1
screen, refer to Chapter 5, "1. Operator management", in this manual.
basic operation
[Operator] – [ID WINDOW] screen
4 5
24125-P6-00
1 GROUP NAME Selects the group name for operators performing operation.
Used to enter the password if one is specified for the operator performing
3 PASSWORD
operation. Press the [OK] button if no password has been specified.
The operation screen appears if the password is correct, allowing inspection
4 OK
machine operation.
1-25
2. Star ting and ending inspection
1 2.1 Starting automatic inspection
c CAUTION
Ensure to complete conveyor unit setup before starting automatic inspection.
basic operation
To set up the conveyor units, refer to "Daily operation" in the operator's manual for the inspection machine being used.
[Select] button
24126-P6-00
1-26
2.1.2 Starting automatic inspection
1
1 Check the inspection program.
Check the inspection program name displayed in the "Status" area of the screen.
basic operation
3 Press the [Run] button to start inspection.
To stop the automatic inspection, press the [Stop] button.
[Auto] button
Inspection
[Stop] button
24117-P6-00
1-27
2.2 Starting upside down automatic inspection (YSi-S)
The upside down automatic inspection function involves inspecting the upper and lower surfaces of a single
1 board, and then automatically inspection the upper and lower surfaces of the next board. It is necessary to
specify upside down inspection settings to use this function. For details on settings, see section 2.2.3, "Upside
down automatic inspection settings".
[Select] button
24128-P6-00
1-28
2.2.2 Starting automatic inspection
1
1 Check the inspection program.
Check the inspection program name displayed in the "Status" area of the screen.
basic operation
3 Set the board.
1. Align the conveyor width with the board.
2. Press the [Change] button. Set the board on the conveyor with the surface to be inspected first
facing up.
24129-P6-00
5 Set the board with the upper and lower surfaces reversed.
Unload the board, and then set it on the conveyor with the completed surface facing down.
1-29
2.2.3 Upside down automatic inspection settings
This section describes the settings required for upside down automatic inspection.
1
In this description, the board surface inspected first is the upper surface (Side A), and the subsequently inspect-
ed surface is the lower surface (Side B).
n NOTE
• If performing upside down automatic inspection, select "Yes" for "Installation Setting" → "Upside down inspection" in
the machine settings.
basic operation
[Save] button
24130-P6-00
ASSY Name
Enter an arbitrary name.
A/B Side
Select "Side A".
1-30
4 Load the program for the lower surface.
Open the "Setup" screen, and then load the lower surface program from the inspection program list.
basic operation
[Save] button
24131-P6-00
ASSY Name
Enter the same ASSY Name as that entered for the upper surface.
A/B Side
Select "Side B".
1-31
2.3 When NG detection occurs
1
2.3.1 NG monitor
The NG image appears when an NG is detected during semi-automatic inspection. Look at the displayed image
and judge whether it is OK or NG. If OK, press the [OK CONT.] button, and if NG, press the [NG CONT.]
button. This screen describes all buttons that appear on this screen.
TIP
basic operation
Semi-automatic and automatic inspection modes are set in "Machine Information" → "Installation Setting" →
"Inspection Mode Setting" in the machine settings. For details on "Inspection Mode Setting", see Chapter 5, "2.1
Installation Setting", in this manual.
Basic operation
1
2
Entire image 3
5
6
7
8
9
10
11
12 13
24132-P6-00
1. [STD.] button
Displays the inspection image.
NG monitor
Displays the screen when an NG is detected.
Step judged to be NG
24133-P6-00
2. [Detected] button
Displays the detected area in red.
1-32
3. [Comparison] button
Displays standard images for steps judged as NG on the left side, and NG images on the right side.
NG monitor
"Comparison" screen when NG detected
Standard images NG images
1
basic operation
24134-P6-00
4. [Board] button
Displays and hides the entire image in the upper left of the screen.
5. [Image Change] button (YSi-X))
By pressing this button when an X-ray image for an NG step is displayed on the screen, the display changes to an optical
image of the same location.
6. [Buzzer OFF] button
Stops the buzzer.
7. [Zoom Up] button
Pressing the [Zoom Up] button when the standard image is displayed enlarges the image.
After clicking the screen, the image can also be enlarged with the mouse wheel.
8. [Zoom Down] button
Pressing the [Zoom Down] button when the standard image or detected area is displayed reduces the image.
After clicking the screen, the image can also be reduced with the mouse wheel.
9. [Image Save] button
Saves the view screen to the program.
10. [Cancel] button
Stops the inspection.
11. NG data
Displays the NG judgment step number, block number, view number, reference number, parts name, inspection status,
NG reason, pin number, cumulative judgment standard NG count for NG judgment steps, measurement value, minimum
allowable tolerance, and maximum allowable tolerance. Set the NG reason in the "Option" parameters in the [Data Edit]
- [Step] tab. If no settings are specified, the default NG reason for each status is displayed. The cumulative NG count
displays the cumulative NG count for steps for which NGs occurred. The NG count is set to "0" when loading the
inspection program.
12 [OK CONT.] button
Check the images judged as NG, and if OK, press this button to resume inspection.
13 [NG CONT.] button
Check the images judged as NG, and if NG, press this button to resume inspection.
1-33
2.4 Inspection complete screen
When board inspection is complete, the inspection result appears in the inspection result display field as "OK"
1 or "NG". When the "Whole" screen is displayed, inspected parts with "OK" result are indicated with blue dots,
and parts with "NG" result are indicated with red dots. By selecting the "Display Type", steps for the selected
inspection result conditions are displayed in the parts inspection results list. By selecting a parts in the parts
inspection results list, the position of the relevant parts is indicated with a cross.
basic operation
c CAUTION
Steps for which no Ref No. is set are not displayed in the list even if judged as NG.
1-34
2.5 Ending the automatic inspection
After board inspections are completed, use the following procedure to exit the automatic inspection mode.
basic operation
To end inspection machine operation, press the [Off] button. The following dialog box appears when
the [Off] button is pressed. Follow the instructions on the screen.
24136-P6-00
e Pressing the emergency stop button exits the inspection machine application and Windows. When it is okay to
turn the power off, turn off the inspection machine main power.
c CAUTION
Use the emergency stop button to stop the machine immediately in times of emergency, and when instructed to do
so in a dialog box. Do not use this button during normal operation.
1-35
Chapter 2 Creating inspection programs
Contents
2
A "view" refers to a single field-of-view captured by the camera and is used as an inspection range. The camera moves to
the set position to perform inspection, and so view frames should be arranged on the board locations to be inspected so
that all parts are covered. If converting mount data to inspection machine data, by selecting the "Auto Assign View" check
box in the "CVT" dialog box, views are created automatically based on the step positions. Furthermore, views can also be
created by pressing the [Auto] button in the "view" screen. For details on view creation, refer to section 2.6, "View
settings", in this chapter.
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n Step
A "step" is the minimum inspection area within a view. Inspection is performed inside the step frame (inspection area),
and so it is necessary to create steps at the location of the object to be inspected, select inspection items, and set
parameters such as detection conditions and judgment conditions. All steps required for inspection must be created for
each parts, and are registered as parts libraries.
Library
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2-1
1.2 Inspection method
This section describes the optical inspection method and X-ray inspection method used by YSi Series inspection
machines.
The models and corresponding inspection methods are shown in the following table.
2
YSi-X Optical inspection + X-ray inspection + laser unit height measurement *
n NOTE
The inspection head and board movement when performing inspection differ depending on the model.
Inspection data creation and tuning
• YSi-S
The inspection head moves in the left and right directions, and the board moves in the forward and back directions.
• YSi-12
The inspection head moves back, forth, left and right above the board.
• YSi-X
The board moves below the inspection head.
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2-2
n Detection conditions: lighting selection
Select the lighting best able to judge the inspection object clearly, and specify settings for performing inspection with
only the inspection object shown in red. For each step, open the "LIGHT" tab at the [Inspection Program] - "Step" screen,
and select the lighting detection type from "Luminance", "Color", or "Shape".
This section describes the lighting selection if "Luminance" is selected.
1. Click the image list buttons to the right of the sampling light and reduced light values fields to display a list of sampling
light images.
2. Select a lighting that offers good contrast between the area being inspected and the surrounding area (lighting with
which difference in brightness is clearly visible) from the list of sampling light images, and then press the [OK] button.
2
3. Adjust "Thresh 1” with the threshold slide bar to set the threshold value that shows the inspection area in red.
4. Set the conditions for the inspection object from the area shown in red in the detection conditions parameters.
Image list
Sampling light example
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n Judgment conditions
Set the reference for judging OK or NG for the inspection object detected in red with the detection conditions. The
parameters to be set differ depending on the inspection status. For details on the inspection status, see Chapter 4,
"Inspection status", in this manual.
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1.2.2 X-ray inspection
X-ray inspection is used to inspect solder joints on lower surface electrode parts and the back fillet of leaded
parts, and solder on parts mounted on the lower surface. Tomographic imaging is possible with digital
laminography, and so height inspection can be performed with height set. Inspection is performed by
compensating for board warp, and therefore laser unit height measurement is used. The resolution can be
changed to 12, 19, 27, and 54 μm for each field-of-view based on the size of the inspection object.
2 X-ray source
Inspection data creation and tuning
Dome lighting
Board
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X-ray inspection involves setting the inspection height and creating X-ray horizontal tomographic images based
on an aerial X-ray image and X-ray images from up to eight different directions.
Inspection image
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2-4
1.3 Main inspection items
This section describes the inspection status and judgment method required to perform inspection by main items
that YSi Series machines are capable of inspecting. For details on the inspection status, see Chapter 4,
"Inspection status", in this manual.
n Missing part
2
One of two inspections methods (inspection status) is used depending on the part type.
• Parts check
This inspection mode detects the outer shape and body of a part, and determines whether the part is present or not
based on the detected area and size of the part.
• Electrode check
The inspection mode detects the electrodes of a chip part, and determines whether the part is present or not based
on the electrode pitch. Used primarily for chip resistors and chip capacitors.
Electrode check
n Position deviation
• Shift tolerance
An NG is judged if the detection area exceeds the allowable position displacement amount from the inspection frame
(step frame).
Shift tolerance
2-5
n Polarity
One of 3 inspection modes is used, depending on the part type.
• Polarity check
This inspection mode detects the polarity mark on a part, and determines the polarity based on the area and size of
the mark.
• Comparison
This inspection mode subtracts the brightness level of one location from that of another location on a part, and
determines the polarity based on the result.
2 Comparison
1 2
Inspection data creation and tuning
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• Character recognition
Characters are detected, and judgment is made based on the character angle.
Character recognition
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n Bridge
• Lead Check
One of 3 inspections modes is used, depending on the inspection location. It is recommended to test at the maximum
allowable size.
1. Maximum Acceptable Size
This is used for the inspection of bridges between leads on IC parts and so on.
Individual leads and solder inside the inspection frame are detected, and judgment is made based on the vertical and
horizontal sizes.
OK part
Bridge
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2. Area
This parameter is used to detect the area of each lead to determine whether a solder bridge is formed between leads.
3. Pin Count (Lead Count)
This parameter is used for bridge inspections between leads of 3-pin and 5-pin transistors, etc.
2-6
n Fillet
• Quantity solder check (solder amount check)
This inspection can be used to detect the fillet area, and determines whether a fillet is formed or not based on that
result.
2-7
1.3.2 Inspection with X-ray camera
2 Optical M lighting image: Displays BGA upper surface X-ray image: Displays parts on upper/lower surface of board
Inspection data creation and tuning
X-ray image: Balls only detected by setting solder ball height for inspection height
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n Back fillet
Inspection is performed with X-ray images taken from above.
• Solder quantity check
Lead parts back fillet is detected from X-ray images, and judgment is made based on the detected surface area.
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2-8
2. Creating inspection programs
This section describes how to create inspection programs for inspection machines from mounter mount data.
Create full board image FSee Chapter 2, "2.3 Creating a full board image".
Library deployment *
Data tuning
2-9
2.2 Data conversion
Mounter data for YAMAHA mounters is converted to inspection programs using a data conversion function.
n NOTE
Before performing this operation, it is necessary to refer to Chapter 5, "2.7 Data conversion settings", and set the
required items at the "Data Conversion Setting" screen in the machine settings.
2 [Setup] screen
Data conversion
Creating inspection programs
Step3
Step2
LIB Redeploy
By selecting this check box, libraries corresponding to the names of parts to be converted are deployed
to mounting positions based on the library table. If the selection is cleared, or parts name have not
been registered in the library table, steps are created for parts mounting positions without performing
library conversion.
2-10
3 Select the file to be converted and press the [Convert] button.
1. A multi-board panel block No. setting confirmation dialog box appears. Check the contents and
press the relevant button to perform data conversion.
Yes
Uses reference data.
Select to convert data for blocks for which block deployment is complete.
No
Uses offset information.
Select to convert data for boards with only one block, or for boards for which no blocks have been
deployed.
2. A conversion complete dialog box appears when conversion is complete. Press the [OK] button to
return to the "Setup" screen.
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3. The name of the converted program appears in the status area, and the converted inspection
program is added to the program list.
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2.3 Creating full board images
If creating a new inspection program, it is necessary to create and save a full board image. Saved full board
images are used only as images for displaying the entire board, and are not used for inspection. This section
describes how to create full board images for inspection programs converted from YAMAHA mounter mount
data.
1 Press the [Data Edit] button and open the "Board" tab.
2 Press the [Width] button to change the conveyor width.
2
A conveyor width change dialog box appears. Ensure that the conveyor width after changing is the
same as "Board Size Y (mm)", and then press the [OK] button.
Step6
Step5
Step3
Step4
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TIP
If using push up pins (option), set in positions where they will not interfere with the conveyor rails or other parts when
the push up plate is raised.
n NOTE
If the board size has not been entered in "Board Size X, Y (mm)", enter the correct board size.
2-12
6 Enter board parameters as needed
Board parameter
2
2
3
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Item Description
Board Size Height (mm) Enter the board thickness. This may be left blank.
A/B Side Select the panel surface from side A and side B.
2 Product Total Count The total inspection board quantity is displayed after being initialized.
Information
The number of NG boards is displayed after selecting the inspection
NG Board Count
program.
The number of NG blocks is displayed after selecting the inspection
NG Block Count
program.
2-13
Item Description
4 Inspect Auto Lib Deploy at Data If "Use" is selected, libraries are automatically deployed when the
Condition Load inspection program is loaded.
If "Use" is selected, when the result of the parts check or electrode
Skip Inspection of No
check when performing automatic inspection is NG, inspection of
Parts
identical parts is skipped, and the next part is inspected.
"Inspect Only First Parts" or "?Inspect for Each Specified Qty" can be
selected when the inspection status is "Character recognition" or
Inspect Only First Parts
"Polarity check". Inspection is not performed for other than the specified
board. Setting is required in the "Option" tab for each step.
2
Number of Cycle This is valid if "Inspect Only First Parts" is set for "?Each Specified
Inspection Qty?". Enter the cycle quantity for boards to be inspected.
6 X-Ray Selects whether to set the X-ray inspection settings in "Board Unit" or
X-Ray Mode "View Unit".
If "Board Unit" is selected, select the "View zoom".
This is valid if "Board Unit" is selected for "X-Ray Mode".
View zoom
Select a suitable magnification for inspection from the drop-down list.
Enter the maximum height of parts mounted on the board subject to
Max Parts Height (mm)
inspection.
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2.4 Fiducial function
Based on the recognized position results of fiducial marks allocated to boards, the fiducial function corrects
errors that may occur from errors in machining the board outline or from the board clamping mechanism, as
well as board warp. This function is used to correct the position of the entire board by registering fiducial
marks in the lower left (or upper left) of the board as Mark 1, and marks in the upper right (or lower right) as
Mark 2. (Up to three marks can be registered.) If required, register block fiducials or local fiducials after
registering board fiducial marks.
Mark 2 2
Board
■ Fiducial screen
By pressing the [Data Edit] button and opening the "Fiducial" tab, the following fiducial mark setting screen appears.
Mark list
[Measure] button
Basic parameters
2-15
2.4.1 Basic parameters
Basic parameters
2
Creating inspection programs
[Template] button
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A. Algorithm Type
The algorithm type is selected from the following three types. "Form" should normally be selected.
If "Pattern Matching" is set, press the [Template] button, open the [Register Template] screen, and register marks in a
template.
• Pattern Matching
Recognizes the mark based on how closely it matches the image template.
• Form
Recognizes the mark based on the "Surface Type", "Std. Area", Mark Size XY", "Circularity", and "Perimeter" parameters.
• Edge
Recognizes the mark based on the "Surface Type" and "Mark Size" parameters.
D. Light Type
Selects the lighting used to recognize the mark.
F, G. Search Area X, Y (mm)
Sets the size of the area in which to search for the mark. Set the mark outline +3.00 mm as a guideline. For example, if
the mark outline is 1 mm as shown below, enter 4 mm. However, if there is a possibility that patterns (resist, silk, etc.)
other than marks may also be detected, narrow the mark detection range value so that only the mark is detected.
1
4 Board
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H. Brightness Gain
Adjust this value to brighten the entire image so that the mark is easily recognized.
I. Brightness Offset
Adjust this value to make the entire image darker so that the mark is enhanced.
K. Thresh Lower Limit, L. Thresh Upper Limit
Sets the upper and lower threshold limits for the brightness with which the mark is shown in red when performing mark
recognition.
2-16
M. Shape Type
A selection can be made from the following three shapes. Select from the drop-down list based on the mark being used.
Select if the mark is made up from a single object, and the mark shape is other
Special
than a circle, square, rectangle, or equilateral triangle.
2
N. Mark Size (mm)
Enter the mark outline dimensions. The dimensions can be entered automatically if unknown. Press the [Measure] button
and enclose the mark by dragging the mouse. The recognized outline dimensions are set and a test is performed.
R. Circularity
Enter the mark circularity.
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2.4.2 Fiducial mark settings
1 Press the [Data Edit] button and open the "Fiducial" tab.
2 Set fiducial marks
Open the tab for which fiducials are to be set, and set the fiducial function to "Execute".
2 Select a tab.
Set to "Execute".
Creating inspection programs
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[Trace] button
[Teach] button
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Correction
Select from the drop-down list.
Do not correct:
Fiducial positional correction is not performed.
1 Point:
Performs positional correction with one fiducial mark point. Board X and Y direction displacements
are corrected.
2 Points:
Performs positional correction with two fiducial mark points. Board X and Y direction displacements
and tilt are corrected.
3 Points:
Performs positional correction with three fiducial mark points. Board X and Y direction displacements
and tilt are corrected. Used for boards of material (paper phenol, paper) easily subject to expansion
and contraction or warp such as large boards or flexible boards.
2-18
X, Y
Enter the fiducial mark coordinates. If "2 Points" is selected for the correction method, enter coordinates
for X1, Y1, X2, and Y2. If "3 Points" is selected for the correction method, enter coordinates for X1, Y1, X2,
Y2, X3, and Y3.
• If coordinates have already been entered in such cases as with programs converted from mount
data, use the coordinates as they are. (Recommended)
• If fiducial mark coordinates are unknown, coordinates can be entered by teaching. After clicking
the fiducial mark on the board image, click the center of the fiducial mark in the field-of-view image
in the lower left of the screen. After setting the mark parameters, press the [Teach] button when the
test result is "OK". The recognized center coordinates are entered.
Mark
Enter the mark No. This number corresponds to the number in the mark data list.
If "2 Points" is selected for the correction method, enter a number for Mark 1 and Mark 2.
2
If "3 Points" is selected, enter a number for Mark 1, Mark 2, and Mark 3.
TIP
If fiducial marks are unclear, use the U, H, M, or L lighting buttons to change the lighting so that the mark becomes
clearer.
Select fiducial.
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No.
These numbers correspond to the mark Nos. set in marks 1, 2, and 3 in the mark list.
Mark Name
Enter an easily distinguishable name up to nineteen single-byte alphanumeric characters for each mark.
Spaces cannot be entered.
Mark Type
Select "Fiducial" from the drop-down list.
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6 Set the basic parameters.
Refer to section 2.4.1, "Basic parameters", on the previous page, and set the following parameters.
2
[Measure] button
Creating inspection programs
24215-P6-00
A. Algorithm Type
Set to "Form".
H. Brightness Gain, I. Brightness Offset
Set so that the marks on the board are clearly visible.
M. Shape Type
Select from the drop-down list based on the mark being used.
N. Mark Size (mm)
Enter the mark outline dimensions. (If the outline dimensions are unknown, this procedure is dealt with later at Steps 9
and 10, and therefore there is no need to enter dimensions here.)
R. Circularity
Enter the mark circularity. (If the circularity is unknown, this procedure is dealt with later at Steps 9 and 10, and therefore
there is no need to enter a value here.)
T. Tolerance (%)
Set to 20%.
TIP
If unable to see the fiducial mark clearly with the available lighting in the "Image List", "CUSTOM" lighting can be
selected. For details on the setting method, see 2.4.2, "Setting fiducial mark CUSTOM lighting", in the next section.
2-20
0 Enclose the mark by dragging the mouse.
Enclose the mark by dragging the mouse inside the mark detection range. The mark is recognized, and
"N. Mark Size (mm)", and "R. Circularity" are set for each recognition type based on the recognition
results, and a test is carried out.
Fiducial mark
TIP
If the mark is successfully recognized, the center coordinates appear in the upper left of the mark screen. By pressing
the [Teach] button after the test is complete, the recognized coordinates are entered as the fiducial mark. When the
design coordinates have been entered, do not press the [Teach] button.
2-21
2.4.3 Setting fiducial mark CUSTOM lighting
If unable to clearly recognize fiducial marks in the "lighting list image", use "CUSTOM lighting".
2 Open the "Light Detail" tab and select "Luminance" at the "Light Sampling Type".
CUSTOM lighting
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4 Press the [Sampling Light] button and select the sampling light.
By pressing the [Sampling Light] button, a sampling light type screen appears. Select the image in which
the fiducial mark appears clearest from the sampling light list. (Up to two images can be selected.)
Press the [OK] button when selection is complete. The display returns to the "Luminance" screen, and
the image is displayed with the selected sampling light.
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2-22
5 Press the [Reduced Light] button to select the reduced light.
By pressing the [Reduced Light] button, a light sampling type screen appears. If required, select a single
image to be excluded from the reduced light list. (There is no need to make a selection.)
2
Adjust with the threshold slide bar and change the upper and lower limits to set the threshold so that
only the mark appears red.
[Detected] button
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2. If reduced light is selected at Step 5, set the reduced light magnification. Set the magnification for
the reduced light selected when performing image processing to show only the mark in red. Press
the magnification button and enter the magnification, or drag the gray area on the monitor with the
mouse to set.
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2-23
2.5 Bad mark function
The bad mark function involves affixing a mark (bad mark) to a set location on the board in order to cancel
parts inspection when the mark is recognized by the inspection machine.
The following three types of bad mark are available. Use these bad marks accordingly depending on the
purpose.
2-24
■ Bad mark screen
By pressing the [Data Edit] button and opening the "Bad Mark" tab, the following bad mark setting screen appears.
[Trace] button
Mark list
Board image
Field-of-view image
[Thresh] button
Recognition results
[Test] button
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Basic parameters
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D. Light Type
Selects the lighting used to recognize the mark.
E. Surface Type
Select "Reflect" or "Non-reflect" from the drop-down list based on the mark being used.
F, G. Search Area X, Y (mm)
Sets the size of the area in which to search for the mark. The value can be entered from 0.00 to 150.00 (unit: mm). The
presence of bad marks is judged based on whether the inside of the detection range is reflective or non-reflective, and
therefore a range smaller than the size of the mark is set.
H. Brightness Gain
Adjust this value to brighten the entire image so that the mark is easily recognized.
I. Brightness Offset
Adjust this value to make the entire image darker so that the mark is enhanced.
J. Thresh
Press the [Thresh] button to set the threshold value for mark detection.
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2.5.2 Bad mark settings
1 Press the [Data Edit] button and open the "Fiducial" tab.
2 Set bad marks
Open the tab for which fiducials are to be set, and set the fiducial function to "Execute".
2 Select a tab.
Set to "Execute".
Creating inspection programs
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[Trace] button
[Teach] button
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X1, Y1
Enter the bad mark coordinates. If bad mark coordinates are unknown, coordinates can be entered by
teaching. After clicking the bad mark on the board image, click the center of the bad mark in the
field-of-view image. After setting the mark parameters, press the [Teach] button when the test result is
"OK". The recognized center coordinates are entered.
Mark 1
This number corresponds to the number in the mark data list, and therefore a mark No. for which no
fiducial mark has been set should be entered.
n NOTE
• If setting block bad marks, set the bad mark in the line for each block No.
• If setting local bad marks, set the respective local fiducial marks. Set the mark list number for the "G. Local Bad
Mark No." optional parameter for the relevant step.
TIP
If the bad mark is unclear, use the U, H, M, or L lighting buttons to change the lighting so that the mark becomes
clearer.
2-26
4 Move the camera to the fiducial mark position.
Select a mark from the mark list and press the [Trace] button. The camera moves to the fiducial mark
position.
2
Set for mark 1 No.
No.
This number corresponds to the mark No. set in mark 1 in the mark list.
Mark Name
Enter an easily distinguishable name up to nineteen single-byte alphanumeric characters for each mark.
Spaces cannot be entered.
Mark Type
Select "Bad Mark" from the drop-down list.
TIP
"Fiducial", "Bad Mark", and "Code Scan" can be set in the mark list, and so the code No. should be changed when
registering.
[Measure] button
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E. Surface Type
Select from the drop-down list based on the bad mark being used.
F, G. Search Area X, Y (mm)
Enter the size of the area in which to search for the mark.
H. Brightness Gain, I. Brightness Offset
Set so that the marks on the board are clearly visible.
2-27
7 Press the [Light List] button and select a clear image.
By pressing the [Light List] button, a list of images appears. Select an image in which the mark appears
clearly from the image list, and press the [Set] button. When setting is complete, the display returns to
the "Bad Mark" screen, and the "D. Light Type" is set.
2
"Bad mark threshold value setting" screen
Creating inspection programs
Threshold value
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2. Press the [Detect] button to display the luminance when a bad mark exists.
3. Click a position with no bad mark, and move the camera axis to a position with no marks.
4. Press the [No Detect] button to display the luminance when no bad mark exists.
5. The intermediate value is set as the threshold value. Press the [Set] button to set the value for "J.
Thresh". By pressing the [Close] button without pressing the [Set] button, the acquired threshold value
is not set.
9 Perform a test.
Press the [Test] button to verify whether the mark is judged correctly.
TIP
The mark recognition coordinates appear in the upper left of the mark screen.
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2.6 View settings
A "view" is the camera field-of-view used by the the inspection machine to inspect a board. In the view
settings, views are set for locations on the board to be inspected, and the board images for each view are
saved. When performing automatic inspection, the inspection head moves to the set coordinates to perform
inspection. View settings cannot be specified with the optional iPro offline software.
TIP
With the optional iPro offline software, saved images are used to make changes to data. Furthermore, saved images
are also displayed in the Repair Station (option) OK images.
[Save] button
[OverWrite] button
View image
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n NOTE
• If editing the view after saving the standard image, select the standard image from the OK image list, and then
press the image list [OverWrite] button.
• The saved image can be displayed by pressing the [List] button in the [Data Edit] - [Step] screen.
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■ Saving NG images
View images for which NGs occurred during automatic inspection are automatically saved. By pressing the "NG Image"
tab, a list of saved data appears. To display saved images, press the [List] button in the "Step" tab, open the "Image List"
screen, select a board ID, and then press the [OK] button.
Setting method
Press the [Machine] button to open a settings screen, select "Machine Information" → "Installation Setting", and select
"NG Image" from the "Image Setting" - "Image Auto SAVE" drop-down list.
c CAUTION
2
When saving NG images, only those view images for which an NG has occurred are saved.
1 Press the [Data Edit] button and open the "Step" tab.
2 Select a step.
Select the step to be checked from the step data list.
Select a step.
View image
[List] button
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n NOTE
It is possible to set whether to inspect images registered in the image list at the multi-test "Test Condition Setting"
screen. For details on multi-testing, see Chapter 3, "2.4.1 Multi-test", in this manual.
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2.6.3 Creating all views and shortening inspection time
Change the view No. to automatically create views for data for which steps already exist, and to shorten the
inspection head movement time.
1 Press the [Data Edit] button and open the "View" tab.
2 Use the auto creation function buttons in the lower right of the screen.
Auto creation function buttons
[Auto] button
Allocates views to include all steps considering step position and size, and adds a view No. to minimize the axis
movement time.
[Tie] button
Creates views uniformly for the entire board.
[Sort] button
Changes the view No. to minimize the axis movement time.
[Fill Area] button
Adds and assigns views to areas on the board to which no views have yet been assigned.
n NOTE
If editing views with the auto creation function, save the view images.
2-31
2.6.4 Manual view creation procedure
If unable to convert to an inspection program due to such reasons as having no CAD data, it is necessary to
create views for positions at which inspection is to be performed, and create inspection steps inside these
views. This section describes how to create views. Views cannot be created with the optional iPro offline
software.
1 Press the [Data Edit] button and open the "View" tab.
TIP
If there is no board in the inspection machine, and "View" or "Step" is selected, the following message appears. Press
2
the [No] button, set the board at the loading entrance sensor detection position, and press the [Change] button
Message
Creating inspection programs
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View image
Move view 1.
View 1
Scroll bar
2-32
3 Press the [Add View] button to add a view.
An added view appears red at a position slightly shifted to the lower right of the currently selected view.
n NOTE
Each view is displayed in color in the order that the views were created: yellow → red → green → blue → pink → purple
→ light blue. The selected view is highlighted by its color.
View image
Adding views
2
View 1
Step8 Step6
Step7
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n NOTE
In order to avoid losing sight of the inspection area, an added view should be positioned so that it partially overlaps
the adjacent view.
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2.6.5 Multiple view operations
Multiple views selected on the view radar display can be copied, deleted, and rotated at the same time.
1 Press the [Data Edit] button and open the "View" tab.
2 Select multiple views.
Enclose the multiple views to be selected in the view radar by dragging the mouse. The selected views
are shaded red and yellow. This time, the red-colored view is displayed in the view screen.
2 n NOTE
By clicking the target multiple views in the view radar while holding down the keyboard [Ctrl] button, views can be
selected or deleted. This time, the view selected first is displayed in the view screen.
Creating inspection programs
View image
Selecting multiple views
Selected view
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2-34
n Deleting multiple views
2-35
n Pitch input and copy of multiple views
Use the [Pitch Deploy] button to copy multiple views such as for creating views on a multi-board panel.
2
View list
View radar
Creating inspection programs
n NOTE
When setting the pitch to create multiple views on a multi-board panel, enter the view pitch data by board design.
(Units: mm)
2-36
4 Set the deployment conditions.
Select the direction to be copied from the "Prior Direction" drop-down list. Select the condition check
boxes as required.
Step 3
Prior direction
Select the prior direction to be copied.
Prior direction
X direction Y direction
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Before pitch input and copy After pitch input and copy
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2.7 Step settings
A "step" is the minimum inspection unit, and inspection details and judgment conditions are set for each step.
Combinations of steps used to inspect each parts are used as parts libraries. With inspection programs
converted from YAMAHA mounter data (YGX), parts libraries stored in the inspection machine are deployed to
mounter mounting positions. For parts to which no libraries have been deployed, it is necessary to paste the
relevant libraries from the parts library, create and register new libraries, and then deploy them.
n NOTE
A parts library is a database to which a combination of inspection steps for each parts has been saved.
1 Press the [Data Edit] button and open the "Step" tab.
Creating inspection programs
24238-P6-00
24239-P6-00
2-38
5 Select the applicable library and press the [OK] button.
The "Library Selection" screen is closed, and the library selected for the view image is displayed in
yellow.
If the applicable library does not exist, select a similar library. Details example names of standard library
names are described below.
Standard library
Lib parts name examples
Example 1: resistor, capacitor, tantalum capacitor Example 2: SOP
(4 pins, pitch: 1.27, lead opposing side width:
3.5 mm, parts body width: 2.9 mm)
• Lead opposing side width (distance from lead tip to lead tip on other side)
W : Square parts with leads on 2 sides or leads on 4 sides
L : Parts with leads on 4 sides, distance in longer direction
The following table shows typical codes.
Capacitor C Transistor TR
TIP
If a similar library is pasted, change the parameter settings for that part and register the library. For details on the
registration method, see section 2.7.3, "Registering libraries", in this chapter.
2-39
2.7.2 Step creation procedure
Create new steps for parts for which libraries have not been deployed.
The following example describes the procedure for creating steps to perform fillet solder quantity inspection.
1 Press the [Data Edit] button and open the "Step" tab.
2 Create a step.
1. Select a part step and press the [Copy] button. If the part has no steps, select the last step in the
relevant view displayed in the basic information field, and then press the [Copy] button.
2
2. Press the [Paste] button. An "Add Step" dialog box appears. Select "Add after selected step." and
press the [OK] button.
[Copy] button
[Paste] button
24240-P6-00
TIP
If copying and pasting steps, the new step is created 0.2 mm to the lower right of an existing step.
2-40
4 In the "Basic" parameter list, set the "Status" (inspection mode).
Select the inspection mode used to inspect the objects in the created step frame.
Select "Solder Quantity Check".
24241-P6-00
TIP
For details on the inspection status and related parameters, see Chapter 4, "Inspection status", in this manual.
5 Open the "LIGHT" tab and select the "Light Sampling Type".
If inspecting the fillet solder quantity, click the "Shape" radio button.
24242-P6-00
TIP
For details on the light sampling type, see Chapter 3, "2.1 Recognition method (based on light sampling type)", in this
manual.
2-41
6 Select the lighting.
Select a lighting for solder fillet recognition. If inspecting the solder fillet solder quantity, press the
[Sampling Light] button to open a "Sampling Light"selection dialog box, select "Hr+Mg+Lb Ver2" from the
sampling light list, and then press the [OK] button.
2
Creating inspection programs
24246-P6-00
TIP
The threshold value can also be adjusted with the threshold slide bars without performing sampling.
2-42
8 Set the detection conditions.
The setting items will differ for each inspection status.
Refer to Chapter 4, "Inspection status", and set the detection conditions.
2
If the test result is not judged to be correct, review all parameters.
2-43
2.7.3 Registering libraries
This section describes how to register the created steps in a library.
1 Press the [Data Edit] button and open the "Step" tab.
2 Select all steps to be registered in a library.
Ensure that all steps to be registered have the same "Library", "LibParts", "Ref.", and "Parts Name" in the
step data list. If different, enter the correct information for these items, and then press the [Enter] key on
the keyboard.
Libraries can be registered without entering the parts name.
[Register] button
24251-P6-00
"LibParts" registration
If the same "LibParts" has been registered If the same "LibParts" has not been registered
24252-P6-00
2-44
2. 1. By pressing the [Yes] button, the following dialog box appears. Press the [Yes] button. Add the
entered "Parts Name" and "LibParts" set to the library table.
2
24253-P6-00
2-45
2.7.4 Deploying libraries
The library deployment function is used to paste library data to parts on the board with the same name at one
time.
1 Press the [Data Edit] button and open the "Step" tab.
2 Press the [Redeploy] button at the "Tuning" tab.
A "Deploy Library Data" screen appears.
2
"Deploy Library Data" screen
Step 3
Creating inspection programs
Step 4
Step 5
Step 6
Step 7
24250-P6-00
Deploy all
Libraries from registered libraries for all parts with matching "LibParts" are deployed.
4 Specify the step to be deployed. (only for "Deploy by Lib Parts Name")
Specify the step if "Deploy by Lib Parts Name" is selected for the deployment mode in Step 3. Verify the
deployed "Library" and "LibParts". The "Library" and "LibParts" selected when the [Redeploy] button was
pressed are displayed. To change them, select from the respective drop-down lists.
2-46
6 Set the deployment conditions.
Select the deployment conditions as required.
No changes to OCR
By selecting this check box, the inspection character string for character recognition when deploying
the library is not changed.
2
Information registered by "LibParts"is deployed for all relevant parts. The deployment status and
deployment result appear at the bottom of the screen.
2-47
2.7.5 Checking libraries
Existing libraries have been set for inspection of standard parts, and therefore it may sometimes be necessary to
change the settings based on the actual inspection parts. This section describes the procedure used to perform
a test (multi-test) for deployed parts libraries.
[Multi-test] screen
Creating inspection programs
[Condition] button
Test Subject
Select the test subject from Step, Inspection Status, Parts, or NG reason.
Test condition
Select from All, Same Lib Parts Name, Same Parts Name, and Same Ref. No.
Test range
Select from All, Only Piece of Board, Only Selected View, and Only Selected Parts.
Librar y Image
Select from Skip, Exec OK parts , Exec NG Parts, and Exec all .
TIP
By pressing the [Analysis] button, a "Detect Value Graph" screen appears.
Select the "Display item" and display the test result in a graph as a reference to help with parameter correction.
2-48
2.7.6 Saving view images
If the steps do not fit inside the view for the deployed library, create the view again and save the image.
2-49
2.8 Librar y details
Press the [Detail] button in the [Data Edit] - [Step] screen - "Utility" tab to display a library details setting
screen. Registered library names can be changed, and libraries can be deleted or edited at this screen.
1 2
3
2
4
5
6
Creating inspection programs
7 19
8
9
10
11 12 13 14 15 16 17 18
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2 Step list All steps for the selected library are displayed.
By copying rows in the selected range in the step list to the clipboard and then
3 Cut pasting, these rows are deleted. The data rows below the deleted rows move up.
The cut data is kept stored until different data is cut or pasted to the clipboard.
4 Copy Copies the rows selected in the step list to the clipboard.
Inserts and overwrites data copied to the clipboard to the step list.
5 Paste Pressing this button displays an "Add step" dialog box, allowing the add position to
be selected.
Deletes the row selected in the step list. The data rows below the deleted rows move
6 Delete
up.
By selecting the "Library" and "LibParts" name and clicking this button, a dialog
9 New Parts appears. By entering the "LibParts" name and clicking [Save], a "LibParts" name can
be registered for the same "Library".
An image of the "LibParts" selected in the parts library list is displayed. If no image
15 Registered parts image
appears, set a board, and save the library again.
Steps for the "LibParts" selected in the parts library are displayed on the registered
16 Step Disp
parts image.
2-50
Item/button name Function
19 Parameter Displays all parameters for the selected step. Settings can also be changed here.
2-51
Chapter 3 Step screen
Contents
1. Parameters 3-1
1.1 Basic parameters 3-1
1.2 Lighting parameters 3-2
1.3 Detection conditions parameters 3-4
1.4 Judgment conditions parameters 3-6
1.5 Option parameters 3-9
Basic parameters
Inspection status "Electrode Check" example
Step screen
24301-P6-00
Item Description
Displays the view No. for the selected step. Jumps to the first step in the view No. selected in the
View
drop-down list.
Step Displays the selected step No. Enter the jump destination step No. to jump to the step for that No.
Displays the block No. (multi-board panel block No.) If changing the block No., enter an arbitrary
block No.
number.
Displays the inspection status for the selected step. If changing the inspection status, select from
Status
the drop-down list.
If saved to a library, the registered library name is displayed. If changing the library name, enter
Library
an arbitrary library name.
If saved to a library, the registered library parts name is displayed. If changing the library parts
Lib Parts
name, enter an arbitrary library parts name.
Parts Name Displays the name of the selected parts. If changing, enter a parts name.
Displayed the reference No. The reference No. can also be entered.
Ref.
The reference No. is judged as a part for which a single identical step exists.
Pin No. Displays the lead pin No. The pin No. can also be entered.
Displays which direction of the part the leads are on. The lead direction can also be entered.
Lead Group If "Change-step-size" is selected for the "Position-Align-Method" in the detection conditions, the
lead direction position is not corrected.
Displays the center X coordinate for the selected step. The step center X coordinate can also be
Step Center X (mm)
entered.
Displays the center Y coordinate for the selected step. The step center Y coordinate can also be
Step Center Y (mm)
entered.
Entry Angle Displays the step entry angle. To change, select from the drop-down list.
Step Size X (mm) Displays the X width for the selected step. The X width can also be entered.
Step Size Y (mm) Displays the Y width for the selected step. The Y width can also be entered.
This appears when the inspection status is "Parts Check" or "Electrode Check". If "Enable" is
Parts Position Align selected, the position of all steps with the same Ref. No. after the relevant step is corrected based
on the recognized displacement.
Entering the "Board Size Height (mm)" in the board parameters and specifying the board surface
sets the height at which X-ray inspection is performed.
A/B Side
Side A: Performs inspection at the board upper surface height.
Side B: Performs inspection at the board lower surface height.
3-1
1.2 Lighting parameters
Set the lighting used to perform inspection and threshold value required to show the object being inspected in
red. In order to recognize the object being inspected, select a lighting that offers good contrast between the
object being inspected and the surrounding area.
Lighting parameters
1
5 6
2
3
7
4
3
Light Sampling Type: Shape Light Sampling Type: Compatible
Step screen
9 10
14
11
15
16
12
13
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3-2
3. Settings list (luminance, compatible)
Sets the Sampling Light, Reduced Light, Noise Cut, and Reduced Light Ratio.
4. Multiple threshold value settings (luminance, compatible)
This is used if there is a difference in luminance in the object being inspected. Up to four threshold values can be set for
a single step.
5. [Sampling Light] button (color, shape)
This is used to set the sampling light for inspection. By pressing this button, a sampling light selection dialog box
appears. Select the image in which the contrast of the object being inspected is clearest, and then press the [OK] button.
The selected sampling light is set in the "Sampling Light" field.
6. Noise cut (color, shape, X-ray)
Selects the size for cutting the influence of noise.
7, 8. Threshold slide bars
Adjust the threshold by dragging with the mouse.
9. Light Type
Select the light type from the drop-down lists.
10. [Light List] button
Select the image for inspection from the displayed "Light List".
3
11. [Insp. Img] button
Step screen
By pressing this button, an inspection image screen appears.
12. Slant Thresh
After checking, enter the standard size and adjust the threshold with the slide bar.
13. Relative Thresh
After checking, enter the standard size and adjust the threshold with the slide bar.
14. Sampling Mode
Select whether to specify faults with one point or with a range from drop-down list.
15. Sampling Height slide bar (mm)
Adjust the sampling height by dragging with the mouse.
16. Sampling Thickness slide bar (mm)
Adjust the sampling thickness by dragging with the mouse.
3-3
1.3 Detection conditions parameters
Sets the inspection conditions for the object to be inspected in the area recognized in red as the inspection
object.
TIP
The displayed parameters differ depending on the inspection status. For details on parameter settings for each status,
see Chapter 4, "Inspection status", in this manual.
3
Step screen
[Area] button
24303-P6-00
• STD.
If the "Position-Align-Method" in basic parameters for the parts check and
electrode check for that part is set to "Enable", alignment is performed
with that position alignment method.
• Invalid
Even if the "Position-Align-Method" in basic parameters for the parts check
and electrode check for that part is set to "Enable", alignment is not
Common Position-Align-Method performed with that position alignment method.
• Change-step-size
If the "Position-Align-Method" in basic parameters for the parts check and
electrode check for that part is set to "Enable", alignment is performed
with that position alignment method, however, alignment is not performed
in the basic parameters "Lead Group" setting direction.
• Mask Correct
Aligns only the mask position set in the options.
This is the area of the selected step.
Std Area (mm 2) By pressing the [Area] button, the step area is entered. If the step size is
changed, the changed area is automatically entered.
Min Detect Size X, Y (mm) Sets the minimum X and Y size for the area to be inspected.
Sets the minimum area for the area to be inspected. Enter a percentage of
Min Area (%)
the standard area.
Step Level Correct Offsets with the difference in luminance level step for the same parts.
3-4
Inspection status Item Details
3
inspection is performed with the movement direction reversed.
[Area] button
Pressing the [Area] button sets the step area for the standard area.
Step screen
3-5
1.4 Judgment conditions parameters
Sets parameters used to judge whether the object being inspected is OK or NG.
TIP
The displayed parameters differ depending on the inspection status. For details on parameter settings for each status,
see Chapter 4, "Inspection status", in this manual.
3
Step screen
Sets the allowable amount that the recognized area edge may protrude from
Parts Check Offset Limit N - W (mm) the step frame. The detection area within this allowable amount is subject to
area calculation. Set based on the parts size and pattern design.
Sets the percentage of the minimum and maximum area with respect to the
Min Area, Max Area (%)
standard area.
Alignment (Deg) Enter the maximum tolerance angle for parts θ displacement inspection.
Align Area Limit N - W Enter maximum ranges for position alignment. An inspection NG result will
Position Align (±mm) occur if these values are exceeded.
Sets the percentage of the minimum and maximum area with respect to the
Min Area, Max Area (%)
standard area.
Alignment (Deg) Enter the maximum tolerance angle for parts θ displacement inspection.
Sets the allowable amount that the recognized area edge may protrude from
Electrode Check Offset Limit N - W (mm)
the step frame. Set based on the parts size and pattern design.
Alignment (Deg) Enter the maximum tolerance angle for chip parts θ displacement inspection.
Specifies whether to measure the electrode inner side distance or the outer
Measure Method
side distance.
Sets the allowable amount that the recognized area edge may protrude from
Polarity Check Offset Limit N - W (mm) the step frame. The detection area within this allowable amount is subject to
area calculation. Set based on the parts size and pattern design.
Sets the percentage of the minimum and maximum area with respect to the
Min Area, Max Area (%)
standard area.
Lead Space Check (mm) Sets the minimum value for the distance between leads.
3-6
Inspection status Item Details
Inspection Character
Character Recognition Enter the character string written on the correct parts.
String
Select the character type written on the correct parts from "Cap.&Num.",
OCR Type "Cap.", or "Num." (alphanumeric, alphabet, numeric.) In the case of alphabet
characters, only upper case characters are recognized.
• Complete
An OK result is judged if the recognized character string matches the
inspection character string completely.
Match Type
• Partial
An OK result is judged if the recognized character string contains the
inspection character string.
By pressing the [Detail] button following a step test, a list of recognized
characters is displayed with the recognition score for each character. Enter
Min Score
the minimum recognition score. 1st-Candidate: Inspects characters with
highest score.
• NON
Performs inspection only at the angle registered at the "Basic" tab. This is
also used as a polarity check.
• Permit 180°
3
Acceptable Rotation Select this setting for parts such as chip resistors where a 180° rotation
presents no problem.
• Permit All
Use to recognize the presence of an inspection character string,
regardless of the character string angle.
Step screen
Min Luminance Level Enter the minimum luminance level for OK parts.
Brightness level
Max Luminance Level Enter the maximum luminance level for OK parts.
Measure Method
Selects the luminance level calculation method.
(luminance level)
Selects the memory No. when performing calculation with subsequence
Memory No.
comparison steps.
3-7
Inspection status Item Details
Offset Limit N - W (mm) Set based on the parts size and pattern design.
Shape Check
• Size
Performs inspection by comparing the recognition area dimensions with
step dimensions.
• Circularity (roundness)
Inspects how much the detection area contour deviates from perfect
Inspection Shape roundness.
• Convexity
Inspects the smoothness of the detection area contour.
• Aspect ratio
Inspects the percentage of the detection object vertical length relative to
the horizontal length (horizontal = 100%).
Min Match Ratio (%) Enter the minimum match ratio for OK parts.
Max Match Ratio (%) Enter the maximum match ratio for OK parts.
These settings are valid for the size selected at "Size". The result will be OK
Tolerance X, Y (mm) if the maximum dimension of the recognition area is within the dimension for
which the tolerance has been increased or decreased for the step size.
3
Algorithm Type Selects the code type from "Unset", "QRcode", "D-matrix", or "Barcode".
Code Recognition
Specifies the starting digits used as the ID code from the extracted character
Start Data Column
string.
Specifies the ending digits used as the ID code from the extracted character
End Data Column
string.
Step screen
• Two-Side-Size
An NG result occurs if both the object size X and Y directions are NG.
Foreign Object Judge Size Condition
• One-Side-Size
An NG result occurs if either the object size X or Y directions is NG.
Judge Size X, Y Min. Sets the minimum size for judging foreign objects.
Ball Joint Check
Judge Size X, Y Max. Sets the maximum size for judging foreign objects.
This is calculated automatically from the pad diameter based on the original
Std Area (mm 2)
ball joint area.
This is calculated automatically from the pad diameter based on the original
Ball Radius (mm)
ball joint area.
Sets the allowable displacement from the center of the step to the center of
Position Check
the recognition area.
Max Accept Size X, Y This is the maximum allowable void X direction size relative to the detected
Void Check (mm) void.
Sets the allowable occupancy rate for the area of all detected voids relative
Max Void Occupancy (%)
to the standard area.
3-8
1.5 Option parameters
These parameters specify option settings for inspection steps.
TIP
The displayed parameters differ depending on the inspection status. For details on parameter settings for each status,
see Chapter 4, "Inspection status", in this manual.
Option parameters
Inspection status "Electrode Check", "Position Align" example
N Electrode Check N Position Align
Step screen
24305-P6-00
STD. Specify the step No. to be inspected next when the judgment result is
OK jump
Parts Check "OK".
Electrode Check
Specify the step No. to be inspected next when the judgment result is
Polarity Check NG jump
"NG".
Character Recognition
Solder quantity check Enter the NG (fail) reason to display during automatic inspection when the
Lead Check judgment result is "NG".
NG Reason
Position Align Maximum number of characters: 14 alphanumeric characters or 7 full-width
Brightness level characters
Brightness Level Correction
Local Fiducail No. Sets the local Fid No.
Comparison
Shape Check Local BadMark No. Sets the local Bad No.
Height Measure
Code Recognition • Disable
Foreign Object Does not perform inspection mask function.
Ball Joint Check • Include
Void Check Mask Type Always detects areas enclosed with a mask.
• Exclude
Does not include areas enclosed by mask in the inspection.
For details, see section 2.3, "Mask function", in this manual.
Mask Center Offset Sets the X offset amount from the step center position to the mask center
X(mm) position.
Mask Center Offset Sets the Y offset amount from the step center position to the mask center
Y(mm) position.
Ng image Out Sets the lighting when sent to the Repair Station (option).
Correct Start Step Specifies the first step No. in the range subject to alignment.
Position Align
Correct End Step Specifies the last step No. in the range subject to alignment.
3-9
2. All functions
2.1 Recognition method (based on light sampling type)
There are four methods available for recognizing inspection objects in order to perform inspection. Those
methods are luminance, color, shape, and X-ray. Select the image to be used for inspection, and then set the
threshold value to show the object to be inspected in red.
2.1.1 Luminance
Samples detection objects in region of specified luminance, and uses them as the object of inspection. Open
the "LIGHT" tab and select "Luminance" for the "Light Sampling Type".
Image name
Composite image
24306-P6-00
3-10
2 Selects the reduced light.
Reduced light is lighting for images excluded from images used for inspection. (Reduced lighting does
not have to be selected.) Use the following procedure to select the reduced light.
1. Press the [Reduced Light] button at the "Luminance" screen to open the light sampling type screen.
2. Select one image with good contrast other than the object to be inspected, and press the [OK]
button.
3
Select the image.
Image name
Selected image
Step screen
24307-P6-00
TIP
Adjustment is also possible without performing sampling by adjusting the threshold slide bar or changing the angle of
the gray area. The reduced light magnification value can be changed by pressing the [Reduced Light] button and
entering the magnification directly.
3-11
4 Press the [Set] button to save the settings.
By pressing the [Set] button, the display returns to the "Step" screen.
3
Threshold value setting bar
Set to "Use".
24309-P6-00
Step screen
c CAUTION
Automatic inspection uses all threshold values, and an inspection result of "OK" is returned if the result produced with
any of the threshold values is "OK". If a test is performed by pressing the [Step] button at the "Step" screen "Tuning" tab,
the test is performed using only the selected threshold value.
3-12
2.1.2 Color
Samples detection objects in region of specified color, and uses them as the object of inspection.
Step screen
2 Set the threshold value.
1. Press the [Sampling] button.
2. Click the location to be detected in the upper left image. The location with same color as the
clicked location is shown in red. When a large area of the part being sampled turns red, press the
[Sampling] button again to end sampling.
3. Press the [Detected] button to verify the area sampled and shown in red in the upper left image.
4. Move the three threshold slide bars to adjust the threshold value until only the inspection object is
shown in red. The area shown in red with Green Ratio, Red Ratio, and Luminance images is shown in
red in the upper left of the image.
TIP
The threshold value and gray area angle can also be adjusted without performing sampling.
3-13
2.1.3 Shape
3
Step screen
24312-P6-00
[Sampling] button
24313-P6-00
TIP
The threshold value and gray area angle can also be adjusted without performing sampling.
3-14
2.1.4 X-ray (YSi-X)
This is an X-ray inspection setting parameter used with the YSi-X. This parameter sets the capture direction used
for X-ray laminography image capture.
1 Select the direction to be used for inspection, and press the [Insp. Img] button.
An "Insp. Img" screen is displayed.
Step screen
24314-P6-00
Image from 135° direction Image from 45° direction Image from 30° direction
Composite inspection
Image from 210° image
direction
Image from 225° direction Image from 315° direction Image from 330° direction
24315-P6-00
3-15
2.1.5 Light detail settings
By pressing the [Light Detail] button on the luminance, color, and shape screens, the following light detail
settings screens are displayed. This section describes all items set at these screens.
Lighting parameters
[Light Detail] button - light detail settings screens
Light Sampling Type: Luminance Light Sampling Type: Color
View image 5 2 3 8 9
3 6 7
Light Sampling Type: Shape
Step screen
10 11 12 13
24316-P6-00
1. Sampling
Size of Syringe
Select the size of the syringe used for sampling.
Sampling Type
Sets whether to sample a detected point, or excluded point.
[Sampling] button
Press this button and click the screen to display values (luminance, color, shape) for the clicked location in a graph.
[Clear] button
Clears the last sampled data.
[All Clear] button
Clears all sampled data.
2. Noise Cut
Selects the size for cutting the influence of noise.
3. Reduced Light
Sets the reduced light magnification selected when processing image calculations. By pressing this button, a dialog box
appears, allowing an arbitrary value to be entered for the reduced light magnification.
4. Threshold value range
The position for the luminance level displayed in gray is shown in red when the [Detected] button is pressed. If reduced
light is set, the reduced light magnification is adjusted by dragging the gray area.
5. Threshold slide bar
Adjust the threshold by dragging with the mouse.
3-16
6. [Sampling Light] button (luminance, color, shape)
Sets the sampling light. By pressing the [Sampling Light] button, a sampling light type dialog box appears. Select an
image from the image list in which the area to be inspected appears white to set. Up to two images can be selected.
Luminance : The image is selected from ten types, including H RGB, M RGB, L RGB, and Uir (infrared).
Color : The image is selected from three types: H, M, L.
Shape : The image is selected from four types: Hr+Mg+Lb, Hb+Mg+Lr, Hb+Mr+Lg, Hr+Mg+Lb Ver2
Hr+Mg+Lb Ver2 should normally be selected.
7. [Reduced Light] button (luminance)
Sets the reduced light. (Reduced light does not have to be selected.) If setting reduced light, a sampling light type dialog
box appears when the button is pressed. Select an image from the image list in which the area to be reduced appears
white.
Luminance : The image is selected from ten types, including H RGB, M RGB, L RGB, and Uir (infrared).
8. Threshold slide bar
Adjust the threshold by dragging with the mouse.
3
9. [Insp. Img] button
The inside of the step in the upper left image is displayed with the inspected image.
10. [Detected] button
Displays the detected area in red.
11. [Set] button
Step screen
Sets the content set here.
12. [Close] button
Closes the "Luminance" screen without saving settings.
3-17
2.2 Registering user characters
With character recognition inspection, inspection is performed by comparing with the characters in the
"Standard character template" registered beforehand. Furthermore, this can also be used to register characters
that have not been registered in the "Standard character template". Registering characters facilitates the
recognition of characters unique to parts.
24317-P6-00
3-18
3. Press the [Recog. OCR] button to display the recognition result for the recognized characters.
24319-P6-00
Step screen
"OCR data registration" screen
Character selection
Display the selected character(s). "Edit Template" screen
Step 7
24321-P6-00
3-19
7 Register the corrected image.
1. Enter the character to be registeredin "Register Char." The characters that can be registered are as
follows.
Alphabet characters: A to Z
Numeric characters: 1 to 9
2. Specify the "User Font Group". If adding to a group that has also been registered, select from the
drop-down list. If registering a new group, enter the group name directly.
[Save] button
Specify the group to be registered.
Step screen
24322-P6-00
3. Check the image to be registered, and press the [Save] button. If registering a new group, a
confirmation dialog box appears. Follow the instructions provided. The following message appears
when registration is complete. Press the [OK] button to close the dialog box and return to the
original screen.
24323-P6-00
n NOTE
If registering a library for a part containing step data (character recognition) using a user template, the user template
is also registered in the library.
3-20
2.2.2 Editing registered characters
When registering user characters, characters that have already been registered can be edited and then
registered in a template. The procedure is as follows.
3
Select the displayed font type
and display character.
Step screen
Select the font.
24325-P6-00
3-21
■ Registered character matching
This section describes the procedure for checking how well the selected character matches the registered character.
1. Adjust the threshold value and perform character recognition.
2. Select the character to check for a match.
3. By pressing the [Cal. Match] button, the match between the character to be checked and the registered character is
displayed.
3
Select the displayed font
type and display character. [Cal. Match] button
Step screen
3-22
2.3 Mask function
The mask function involves creating a mask area inside a step, and specifying whether or not to always detect
the created mask area when performing inspection. If, for example, the inspection status is "Parts Check", and
the printed characters on the top of the parts cannot be recognized, using this function, an inspection object
exclusion mask is created at the character position and inspection is performed. Furthermore, if the inspection
status is "Electrode Check" and the electrode and parts are detected simultaneously, inspection can be
performed by creating an inspection object exclusion mask in the center of the parts. This procedure describes
an example in which the inspection status is chip part "Electrode Check", the electrode and part are detected
simultaneously, and an inspection object exclusion mask is created in the center of the parts.
TIP
The mask function is valid for the following inspection statuses.
parts check, electrode check, polarity check, character recognition, solder quantity check, lead check, position
align, brightness level, shape check
3
Select "Exclude" for the "Mask Type" in the option parameters. By selecting "Exclude", the mask area is
never detected.
Step screen
"Option" tab
Select the mask type.
24328-P6-00
3-23
2.4 Step test
It is necessary to perform tuning for all parameters in order that the test result for created steps is correct. To
check the step test result, use the buttons in the "Tuning" tab in the lower right of the "Step" screen - "Tuning"
tab. To review settings, see Chapter 4, "Inspection status", in this manual.
2.4.1 Multi-test
The multi-test function is used to perform a step test under set conditions. For example, the "Lib Parts Name" is
specified at such times as when creating a new library, an inspection is performed for all of the same libraries
on the board, and parameters are tuned based on the inspection result.
3 [Condition] button
[Execute] button
Step screen
24329-P6-00
[OK] button
24330-P6-00
Test Subject
Step : Tests all steps.
Inspection Status : Tests steps for the selected inspection status.
Parts : Tests steps for the selected parts.
NG Reason : Tests steps with selected NG reason.
Test condition
All : Tests all steps.
Same Lib Parts Name : Tests steps with same selected Lib parts name.
Same Parts Name : Tests steps with same selected parts name.
Same Ref. No. : Tests steps with same selected Ref. No.
3-24
Test range
All : Tests all steps.
Only Piece of Board : Tests steps in individual boards of the selected multi-board panel No.
Only Selected View : Tests steps in the selected view.
Only Selected Parts : Tests steps for the selected part.
Test Board Side (YSi-X)
Performs a test based on the "A/B Side" setting in the basic parameters.
Side A : Tests only those steps for which "A/B Side" is set to "Side A".
Side B : Tests only those steps for which "A/B Side" is set to "Side B".
Both : Tests all steps, regardless of the "A/B Side" setting.
Image List Test
Skip : Tests only standard images, and does not test images in the image list.
All : Tests standard images and images in the image list.
Exec OK Parts : Tests standard images and images in the OK image list.
Exec NG Parts : Tests images in the NG image list.
Step screen
Multi-test results example
Ref. No. unit display
NG Parts Count NG Steps Count
Results list
24331-P6-00
3-25
Changes the display.
Display by Ref. No.
Ref. No. unit (part unit) test results are displayed in the left side list of the inspection list. By selecting parts from
the list, the selected row is highlighted in blue, and the step test result for the applicable part is displayed in the
right side list of the inspection list. Select a step and check the step position and parameters.
Display by Step:
Displays the test results for all tested steps. Select a step and check the step position and parameters.
NG Parts Count
Displays the number of parts for which the test result is NG.
NG Steps Count
Displays the number of steps for which the test result is NG.
[Analysis] button
By selecting a display item, the test result for the relevant item is displayed in a graph. Refer to this when setting
parameters for data tuning.
3
Step screen
3-26
2.4.2 Measurement results
By pressing the [Detail] button following a step test, a "Test Results" screen appears containing data for
detected areas within steps.
2
1
3
4
24332-P6-00
3
1. Detection area details
Shows the details of all detection areas within the step. Recognized characters and corresponding scores are displayed
following a character recognition test.
2. Detect count
Shows the number of detected steps and number of inspection steps.
Step screen
3. Max. / Min.
Displays the "Area", "X Width", and "Y Width" maximum and minimum values.
4. [Auto Calculation] button
By pressing this button, detection condition setting values change to appropriate values automatically based on the
detection area. The locations which change and appropriate value calculation method differ for each inspection status.
The items that are automatically set by pressing the [Auto Calculation] button are as follows.
Maximum Acceptable
Lead Check Judge 1.5 times the maximum size XY of each detected lead
Size X, Y
0.7 times the minimum size of each detected lead when
Lead Width Check
this parameter is enabled.
Minimum Detectable
0.7 times the step frame size
Size X, Y
Character
Detect Character Size Maximum detectable size XY by character recognition
Recognition
Minimum Detectable
Parts Check Detect 0.7 times the step frame size
Size X, Y
n NOTE
Values entered by pressing the [Auto Calculation] button cannot be applied to all parts. If a step test is performed
and the test result is not incorrect, change the parameter settings as required.
3-27
3. Editing Assistance
By press the [Edit Assist] button at the "Tuning" tab, an "Edit Assist" screen used to create steps efficiently
appears. This section describes operations that can be performed at the "Edit Assist" screen.
1 Select a step.
Select the deployment source lead step at the "Step" screen.
3 2 Press the [Edit Assist] button and open the "Pin Develop" tab.
A screen used to set the deployment of pin information appears.
Editing assistance
Step screen
Step 3
[Execute] button
[Close] button
24333-P6-00
3-28
3.2 Copying steps
This function is used when creating multiple selected steps in the X and Y directions with arbitrary pitch.
1 Select a step.
Select the steps to be copied at the "Step" screen.
Multiple steps can also be copied by dragging with the mouse.
2 Press the [Edit Assist] button and open the "copy" tab.
A screen used to set step copy conditions appears.
Editing assistance
Copying
"copy" tab
[Execute] button
3
Step screen
[Close] button
Step 4
24334-P6-00
3-29
3.3 Editing pin Nos.
1 Select a step.
Select all steps at which pin Nos. are to be assigned at the "Step" screen.
2 Press the [Edit Assist] button and open the "Pin No." tab.
A screen used to edit step pin Nos. appears.
Editing adjustment
Editing pin Nos.
"Pin No." tab
3 Step 3
Step 4
Step screen
[Close] button
24335-P6-00
Inter val
Enter the interval for the pin No. being assigned.
3-30
3.3.2 Batch pin No. reassignment
This function is used when reassigning pin Nos. clockwise or counterclockwise at one time for leaded parts for
which pin Nos. have already been set.
3
Left (W) : Steps on left side of part
Step screen
Step position Clockwise Counterclockwise
2 Press the [Edit Assist] button and open the "Pin No." tab.
3 Select the reassignment direction.
Press the clockwise arrow button or counterclockwise arrow button based on the reassignment
direction.
Editing assistance
Pin No. editing - Batch pin No. reassignment
"Pin No." tab
3-31
3.4 Foreign object check deployment
This function deploys foreign object steps to all views.
Foreign object inspection steps for which "Foreign Object” is set for the inspection status are deployed to all
views.
1 Select a step.
Select the deployment source foreign object step at the "Step" screen. Steps are deployed with the
same parameters as the selected step. Select an arbitrary step if no foreign object check steps exist to
deploy steps with default parameters.
2 Press the [Edit Assist] button and open the "Foreign Object" tab.
A screen used to set foreign object check deployment conditions appears.
3
Step 4
Step screen
[Execute] button
[Close] button
24337-P6-00
Range
Sets the range for creating foreign object check steps. Set the applicable range to "All View" or
"Selected View".
Light (YSi-X)
This setting is only valid for X-ray inspection machines, and the foreign object check step lighting can be
selected from "Optical" or "X-ray".
Optical: Select to perform the foreign object check with optical lighting.
X-ray: Select to perform the foreign object check with X-rays (X-ray image).
3-32
3.5 Pin position editing
This function is used when aligning multiple steps on the same line and with same pitch.
1 Select a step.
Select multiple steps to be aligned by dragging the mouse.
2 Press the [Edit Assist] button and open the "Pin Pos.Edit" tab.
A screen used to set alignment conditions appears.
Editing assistance
Pin position editing
"Pin Pos.Edit" tab
3
Step 4
[Execute] button
[Close] button
Step screen
24338-P6-00
3-33
4. Batch replacement and search
4.1 Batch replacement
This function is used to set conditions for steps being replaced, and batch replace item values for applicable
steps with specified values.
c CAUTION
All applicable steps are changed when the [Replace] button is pressed, and therefore care should be taken when
specifying conditions and replacement settings.
"Replace" screen
TIP
The content of "Find what" will differ depending on the inspection status.
3-34
4 Specify "Replace with".
Enter the value following the change in the "Replace with" screen in the lower left. Select "NON" in the
value field for items that are not to be changed. If wishing to specify the selected step lighting settings
for "Replace with", press the [Get Light] button. Values are entered automatically.
Ensure that the number displayed in "The number of items in the Replacing list" matches the number of
items to be replaced.
TIP
Items displayed in the "Replace with" screen differ depending on the inspection status.
Step screen
3-35
4.2 Search
By pressing the [Search] button at the "Utility" tab, a "Search" screen appears. This screen is used to search for
the next step matching the set search conditions.
"Search" screen
Step 1
[Search] button
Step 2
24340-P6-00
3-36
Chapter 4 Inspection status
Contents
From the "Status" drop-down list, select the inspection mode for the inspection item. The setting contents differ
Inspection status
depending on the selected inspection mode, so check the setting contents of each inspection mode.
For details on the parameters to be set, see Chapter 3, "Step screen", in this manual.
TIP
• For details on the step creation method and settings, see section 2.7.2, "Step creation procedure", in Chapter 2 of
this manual.
• For steps for which inspection is not performed for reasons such as no parts being mounted, select the "Skip" check
box in the step data list.
• Inspection modes may be added or changed, depending on the software version.
SKIP No inspection will be performed. Used as reference for library and view
Parts Check Missing, position deviation, upside down Part body This chapter 1.1
Electrode Check Missing, position deviation Chip parts (1005, 1608, etc.) This chapter 1.2
Character Recognition Character recognition, polarity, upside down Characters (alphabets and numbers) This chapter 1.4
Solder Quantity Check Solder amount check (area) Solder (fillet area) This chapter 1.5
Lead bridges, adjacent part bridges, pin
Lead Check Lead, electrode, land This chapter 1.6
count
X, Y position alignment for the specified
Position Align Part edge, pattern edge This chapter 1.7
step
Brightness Level Upside down, polarity, position deviation Part body, polarity mark This chapter 1.8
Ball joint check (YSi-X) Bump (electrode) joint status check BGA solder balls This chapter 1.13
Void check (YSi-X) Solder void check Lower surface electrode part voids This chapter 1.14
Height Measure (option) Height from reference point Lead, IC body, polarity, etc This chapter 1.15
4-1
1.1 Parts Check
Use this inspection mode to detect the part body in order to check for missing parts and position deviations.
By setting the "Position-Align-Method" in the basic parameters to "Enable", the step position is aligned from the
parts check step for this part onward by the amount of parts mounting positional displacement.
Step frame
4
Inspection status
24402-P6-00
"Detect" parameters
Status: Parts Check
24403-P6-00
Position-Align-Method
This setting is valid if "Enable" is selected for the "Position-Align-Method" in the basic parameters.
STD.:
The position of steps from that step onward is aligned by the amount of positional displacement
detected when performing the parts check test.
Disable:
Position alignment is not performed.
4-2
Mask Correct
Position alignment is performed only for mask positions for which the "Mask Type" is set to "Include" or
"Exclude" in the option parameters.
For details on option parameters, see section 1.5, "Option parameters", in Chapter 3 of this manual.
"Judge" parameters
Status: Parts Check
24404-P6-00
4
Set the permissible top, bottom, left, right deviation range. An NG result is judged if the detected edge
exceeds the value set here.
Inspection status
Max Area (%)
An NG result is judged if the ratio relative to the standard area for the detected area exceeds this
value.
Ref. value 120%
Alignment (deg)
An NG result is judged if the detected parts θ displacement exceeds this value. By selecting "SKIP", tilt
inspection is not performed.
4-3
5 Press the [Detail] button.
The "Inspect result" dialog box opens. Press the [Auto Calculation] button. The following items in the
detection conditions parameters are set automatically.
4
24405-P6-00
Step test
Inspection data check
Inspection data
Detected data
Threshold No. : Threshold No. used for inspection
dx =, dy = : Amount that the step frame center deviates from the detection area center
Area = : Percentage of the detected area relative to the standard area
3. If the test result is not judged correctly, review all parameters while referring to the detection data.
4-4
1.2 Electrode Check
Use this inspection mode to measure electrode distances of chip parts, in order to check for missing and
deviated parts or inspect lead fillet.
By setting the "Position-Align-Method" in the basic parameters to "Enable", the step position is aligned from the
electrode check step for this part onward by the amount of parts mounting positional displacement.
Step frame
Inspection status
24407-P6-00
"Detect" parameters
Status: Electrode Check
24408-P6-00
n NOTE
Detection areas with ratio relative to the detection area "Std Area (mm2)" less than "Min Area (%)" are not subject to
inspection.
4-5
Min Detect Size X, Y (mm)
Sets the minimum detection size for detected electrodes. Enter the default values. (An appropriate
value is set at Step 5.)
• If parts mounted horizontally
For the X value, enter a width smaller than the Y value minimum width.
Default values: X = 0.04, Y = 0.08
• If parts mounted vertically
For the Y value, enter a width smaller than the X value minimum width.
Default values: X = 0.08, Y = 0.04
If horizontal mounting: X value < Y value If vertical mounting: X value > Y value
23401-P6-00
n NOTE
By entering the minimum detection size, the direction used to measure distance changes.
"Judge" parameters
Inspection status
24409-P6-00
Measure Method
Set the larger difference in distance between when a part does exist and when a part does not exist.
IN : Measures the distance between the inside of electrodes.
OUT : Measures the distance between the outside of electrodes.
Alignment (deg)
An NG result is judged if the detected parts θ displacement exceeds this value. By selecting "SKIP", tilt
inspection is not performed.
4-6
4 Perform a step test.
1. Press the [Step] button at the "Tuning" tab to perform a test for the created step.
2. When the test result appears, press the [End] button. When doing so, there is no problem if the test
result is "NG".
4
2. Take a note of and check the detection data, and then press the [End] button.
Inspection status
Displays detected data. Test result
24410-P6-00
Detected data
Threshold No. : Threshold No. used for inspection
dx =, dy = : Amount that the step frame center deviates from the detection area center
Area = : This is the detection object distance. (Unit: mm)
3. If the test result is not judged correctly, review all parameters while referring to the detection data
n NOTE
Paste a completed step to a missing part position and ensure that an NG result is returned. If judged incorrectly,
review the minimum or maximum distance.
4-7
1.3 Polarity Check
This inspection status is used if inspecting the parts mounting angle by recognizing polarity marks on IC partss
and so on.
TIP
• "Brightness Level" or "Comparison" inspection statuses may be appropriate for certain polarity mark types.
• By selecting character recognition for the inspection status, selecting "NON" for "Acceptable Rotation" in the
judgment parameters, and then performing an inspection, the parts mounting angle can be inspected.
4
Step frame
Inspection status
24411-P6-00
"Detect" parameters
Status: Polarity Check
24412-P6-00
4-8
3 Set the "Judge" parameters.
Open the "Judge" tab and set the following parameters.
"Judge" parameters
Status: Polarity Check
24413-P6-00
4
occurs.
Ref. value 40%
Inspection status
Ref. value 100%
4-9
8 Perform a step test again.
1. Press the [Step] button at the "Tuning" tab again to perform a step test.
2. Take a note of and check the detection data, and then press the [End] button.
Detected data
Threshold No. : Threshold No. used for inspection
dx =, dy = : Amount that the step frame center deviates from the detection area center
4-10
1.4 Character Recognition
This inspection status is used if inspecting differences in parts types or the parts mounting angle for IC parts
and so on by recognizing characters on parts. Only upper case, alphanumeric characters can be recognized.
Step frame
4
24415-P6-00
Inspection status
n NOTE
By selecting "AUTO" for the threshold value after setting the lighting, a test result can automatically be obtained with
the optimum threshold value. However, the inspection time will take a little longer than when the threshold value is
specified.
"Detect" parameters
Status: Character Recognition
24416-P6-00
4-11
3 Set the "Judge" parameters.
Open the "Judge" tab and set the following parameters.
"Judge" parameters
Status: Character Recognition
24417-P6-00
OCR Type
Select the appropriate setting from among "Cap&Num", "Cap", and "Num" (Alphanumeric,
Alphabetic, and Numeric) for the character string to be inspected. In the case of alphabetic
characters, only uppercase letters are recognized.
4 Match Type
Full : This inspects whether the detected character string completely matches the inspection
character string.
Partial : This inspects whether the detected character string contains the inspection character string.
You can enter a partial character string if you want to inspect only specific characters. If, for example,
Inspection status
only wishing to inspect 7 and 9 from a character string of "3793", enter "79" and set to "Partial". An NG
result is judged if unable to recognize the specified character string.
Min Score
If set to "1st candidate", the object with the highest score among the detection candidate characters
will be inspected. If the character print quality is poor, select small values such as 10 or 20 from the
drop-down list.
Acceptable Rotation
Sets whether to inspect the character angle.
NON : Select this setting when only the specified orientation should be judged to be OK
(normal setting).
Permit 180° : Select this setting for components such as chip resistors where 180° rotation presents
no problem.
Permit All : Select this setting for cases where the specified character presence/absence is the
only criterion and the character string angle is not an issue. However, the inspection
time will take a little longer because the image is rotated during image processing.
Set the character recognition angle in "Entry Angle" in the basic parameters. As shown below, this is the
angle rotated counterclockwise from 0°.
1234
1234
22402-P6-00
4-12
4 Perform a step test.
1. Press the [Step] button at the "Tuning" tab to perform a test for the created step.
2. When the test result appears, press the [End] button. When doing so, there is no problem if the test
result is "NG".
TIP
Depending on the recognition status, there may be times when the "Character Size X, Y (mm)" is best left at "AUTO".
4
1. Press the [Step] button at the "Tuning" tab again to perform a step test.
2. Take a note of and check the detection data, and then press the [End] button.
Inspection status
Displays detected data. Test result
24418-P6-00
Detected data
Threshold No. : Threshold No. used for inspection
Detect : This is the recognized character.
Score : This is the minimum recognition score for recognized characters.
3. If the test result is not judged correctly, review all parameters while referring to the detection data.
4-13
1.5 Solder Quantity Check
This inspection status is used to detect solder fillets on chip parts, and to inspect solder quantity.
Step frame
4 24419-P6-00
"Detect" parameters
Status: Solder Quantity Check
24420-P6-00
4-14
3 Set the "Judge" parameters.
Open the "Judge" tab and set the following parameters.
"Judge" parameters
Status: Solder Quantity Check
24421-P6-00
Inspection status
4 Perform a step test.
1. Press the [Step] button at the "Tuning" tab to perform a test for the created step.
2. Take a note of and check the detection data, and then press the [End] button.
Detected data
dx =, dy = : Amount that the step frame center deviates from the detection area center
Threshold No. : Threshold No. used for inspection
Area = : Percentage of the detected area relative to the standard area
3. If the test result is not judged correctly, review all parameters while referring to the detection data.
4-15
1.6 Lead Check
Use this inspection mode to check for solder bridges between leads or between adjacent parts.
Step frame
4 24423-P6-00
"Judge" parameters
Status: Lead Check
24424-P6-00
Select "SKIP".
Use to inspect bridges between leads on ICs and connectors without inspecting the number of pins.
4-16
Min Area, Max Area (%)
Sets the minimum and maximum area for the OK detection area. Sets based on the value set at "Pin
Number Check". An NG test result is judged if the inspection object lies outside the range for the value
set here.
"Detect" parameters
Status: Lead Check
Inspection status
24425-P6-00
2
Std Area (mm )
Sets the step area. Sets based on the value set for "Pin Number Check" at the "Judge" tab.
If "Pin Number Check" is set to "SKIP", enter "4". If the number of inspection pins has not been entered,
press the [Area] button to acquire.
4-17
6 Perform a step test again.
1. Press the [Step] button at the "Tuning" tab again to perform a step test.
2. Take a note of and check the detection data, and then press the [End] button.
Detected data
Threshold No. : Threshold No. used for inspection
dx =, dy = : Amount that the step frame center deviates from the detection area center
4 Pin =
WidthX =,WidthY =
: This is the number of detected leads.
: This is the maximum detection width X and maximum detection width Y.
3. If the test result is not judged correctly, review all parameters while referring to the detection data.
Inspection status
4-18
1.7 Position Correction
In addition to the usual position corrections based on board fiducial marks, this inspection mode corrects the
inspection positions. The inspection step positions specified for the parts are offset by an amount equal to the
recognized positional displacement. By performing fiducial mark position correction, the inspection step
position of specified steps can be offset by an amount equal to the mark positional displacement.
Step frame
4
24427-P6-00
Inspection status
2 Set the "Detect" parameters.
Open the "Detect" tab and set the following parameters.
"Detect" parameters
Status: Position Correction
24428-P6-00
4-19
3 Set the "Judge" parameters.
Open the "Judge" tab and set the following parameters.
"Judge" parameters
Status: Position Correction
24429-P6-00
4
Sets the minimum area for the area standard. An NG result is judged if less than this value.
Ref. value 10%
"Option" parameters
Status: Position Correction
4-20
5 Perform a step test.
1. Press the [Step] button at the "Tuning" tab to perform a test for the created step.
2. When the test result appears, press the [End] button. When doing so, there is no problem if the test
result is "NG".
Inspection status
Displays detected data. Test result
24431-P6-00
Detected data
Threshold No. : Threshold No. used for inspection
dx =, dy = : Amount that the step frame center deviates from the detection area center
Area = : Percentage of the detected area relative to the standard area
TIP
If dx and dy are "0", this means than the position correction limit is exceeded, so the position is not offset.
3. If the test result is not judged correctly, review all parameters while referring to the detection data.
4-21
1.8 Brightness Level
Use this inspection mode to measure the brightness level in a step frame in order to check for upside-down
parts, position deviations, and the polarity.
n NOTE
No threshold settings are required because the color image brightness is used as it is.
4
24432-P6-00
Inspection status
"LIGHT" parameters
Light Sampling Type : Luminance
24433-P6-00
Sampling light
"Mb+Lb" is normally used. Press the button to the right of the sampling light value field to open the
sampling light list, select "Mb+Lb" from the list, and then press the [OK] button.
4-22
3 Set the "Judge" parameters.
Open the "Judge" tab and set the following parameters.
"Judge" parameters
Status: Brightness Level
24434-P6-00
Inspection status
Mean : Judges the brightness level based on the average brightness in the step frame.
Minimum : Judges the brightness level based on the minimum brightness in the step frame.
Maximum : Judges the brightness level based on the maximum brightness in the step frame.
Deviation : Judges the brightness level based on the standard deviation of the brightness in the
step frame.
Max – Min : Judges the brightness level based on the difference between the maximum brightness
and minimum brightness in the step frame.
MinMean : Performs judgment with the average luminance in the range 25% of the step
frame focusing on locations with minimum luminance inside the step frame.
MaxMean : Performs judgment with the average luminance in the range 25% of the step
frame focusing on locations with maximum luminance inside the step frame.
Memor y No.
This parameter is used in conjunction with another inspection mode "Comparison".
If not using this parameter, set it to "0".
For details on "Comparison", see section 1.9, "Comparison", in this manual.
4-23
4 Perform a step test.
1. Press the [Step] button at the "Tuning" tab to perform a test for the created step.
Test results and detection data are displayed when testing is complete. When doing so, there is no
problem if the test result is "NG".
Detected data
dx =, dy = : These are offset amounts for which position correction was performed.
4-24
1.9 Comparison
This inspection status is used to inspect polarity and so on based on whether the difference in luminance
between two locations lies within the standard range. Three steps are set for comparison inspection, with
luminance measurement performed first at a bright location, and then at a dark location. Finally, the difference
between the two luminance values is calculated, and a judgment is made on whether the value lies within the
standard. The following description takes a luminance difference comparison as an example, however, the
same settings should be specified even when inspecting differences in thickness with the YSi-X.
n NOTE
If specifying settings for comparison with the YSi-X, thickness is measured at two locations with similar settings, and
finally, the difference between the two thicknesses is calculated to judge whether the value lies within the standard.
Inspection status
24436-P6-00
"Judge" parameters
Status: Brightness Level
24437-P6-00
4-25
Memor y No.
Select an arbitrary value from the drop-down list. "1" is selected here.
Creating a step
4
24438-P6-00
1. Select the step created at Step 4, and then copy and paste the step.
2. The frame of the pasted step is changed to a different shape in order to distinguish it from the
luminance level steps, and then moves close to the two luminance level steps.
4-26
7 Set the basic parameters and judgment conditions parameters.
1. Open the "Basic" tab, and set the "Status" in the basic parameters to "Comparison".
2. Open the "Judge" tab and set the following items.
"Judge" parameters
Status: Comparison
24440-P6-00
Memor y No1
Select memory No. "1" set at Step 2.
Memor y No2
Select memory No. "2" set at Step 5.
4
TIP
Inspection is performed at comparison steps with difference in luminance obtained by subtracting the "Memory No2"
luminance from "Memory No1" luminance.
Target of Compare
Luminance
Inspection status
Performs a comparison with the difference in the luminance measurement results for steps set at the
memory No. settings.
Thickness (YSI-X)
Performs a comparison with the difference in the thickness measurement results for steps set at the
memory No. settings.
Detection data
Difference =: This is the difference in luminance between two measured steps.
2. Take a note of and check the detection data, and then press the [End] button.
9 Set the "Min Area" and "Max Area" in the "Judge" parameters.
Set by referring to the inspection data Difference.
Minimum
Enter approximately 80% of the Difference. An NG result is judged if the difference in luminance is less
than this value.
Maximum
Enter approximately 120% of the Difference. An NG result is judged if the difference in luminance is
greater than this value.
4-27
1.10 Shape Check
Use this inspection mode to inspect the shapes of inspection objects. This description takes an aspect ratio
comparison as an example.
4 24441-P6-00
"Detect" parameters
Status: Shape Check
24442-P6-00
4-28
3 Set the "Judge" parameters.
Open the "Judge" tab and set the following parameters.
"Judge" parameters
Status: Shape Check
24443-P6-00
Inspection Shape
Select the shape to be inspected from the following four types. "Aspect Ratio" is selected here.
4
Size : Performs an inspection by comparing step size and detected step size.
Circularity : Inspects the roundness of round parts.
Convexity : Inspects the degree of smoothness.
Aspect Ratio : Inspects the percentage of the detection object vertical length relative to the
horizontal length (horizontal = 100%).
Inspection status
Min, Max Match Ratio (%)
This setting is valid when other than "Size" is selected for "Inspection Shape". Sets the match ratio for the
inspection object shape standard. For example, if "Inspection Shape" is set to "Aspect ratio", in the
example in the drawing at Step 1, the vertical length is approximately twice the horizontal length, and
therefore the "Min Match Ratio (%)" is set to "170%", and the "Max Match Ratio (%)" is set to "230%". (Set
an appropriate value set Step 5.)
Tolerance X, Y (mm)
This setting is valid when "Size" is selected for "Inspection Shape". An OK result is judged if the recognized
step lies inside the step size dimensional tolerance.
4-29
4 Perform a "step" test.
1. Press the [Step] button at the "Tuning" tab to perform a test for the created step.
Test results and detection data are displayed when testing is complete. When doing so, there is no
problem if the test result is "NG".
Detection data
Threshold No .: This is the threshold No. applied to inspection.
4
dX=, dY= : This the amount of displacement between the step frame and center of the
detection area.
Aspect Ratio= : This is a ratio based on the inspection shape.
2. Take a note of and check the detection data, and then press the [End] button.
Inspection status
5 Set the "Min Match Ratio" and "Max Match Ratio" in the "Judge" parameters.
Min Match Ratio (%)
Enter a value approximately 80% of the inspection data Aspect Ratio.
6 Set the Min Detect Size X, Y (mm) for the detection conditions parameters.
1. Press the [Detail] button to display the "Test Results" screen.
2. Take a note of the test results maximum X width and maximum Y width values, and then press the
[Close] button to close the screen.
3. Set a value approximately 70% of the maximum X width for "Min Detect Size X (mm)" in the detection
conditions parameters, and set a value approximately 70% of the maximum Y width for "Min Detect
Size Y (mm)".
TIP
The inspection object is the largest shape within the step frame. The [Auto Calculation] button is disabled.
4-30
1.11 Code Recognition
This inspection status is used to read QR Codes and so on affixed to boards to identify boards IDs. The board
ID is the file name used when outputting SPC data, and when outputting results to the Repair Station (option).
n NOTE
If using this inspection status for a newly created inspection program, set at the [Data Edit] - "CodeScan" tab.
4
24445-P6-00
Inspection status
2 Set the "LIGHT" parameters.
1. Open the "LIGHT" tab and select "Luminance" at "Light Sampling Type".
2. Press the button to the right of the sampling light value field to open the sampling light list, select
"Mb+Lb" from the list, and then press the [OK] button.
"Judge" parameters
Status: Code Recognition
24446-P6-00
4-31
Algorithm Type
Select the object to be inspected from the following three types.
QRcode : Select to recognize QRcode.
D-matrix : Select to recognize Data matrix.
Barcode : Select to recognize barcodes.
Cell Number
Select the code size if "QRcode" or "D-matriX" is selected for the algorithm type.
4
Inspection status
Detection data
Code : This is the recognized code characters.
2. Take a note of and check the detection data, and then press the [End] button.
3. If the test result is not judged correctly, review all parameters while referring to the detection data.
4-32
1.12 Foreign object check
This inspection status is used to detect foreign objects such as solder balls.
24448-P6-00
Inspection status
3. Set "Use" for "Thresh 1", and use the threshold slide bar to set the lower limit to 100, and upper limit to
255.
"LIGHT" parameters
Status: Foreign Object
24449-P6-00
4. Press the [Detected] button in the button area, and verify that only solder balls or foreign objects are
red in the field-of-view screen. If only the target object fails to turn red, correct the sampling light or
threshold value.
4-33
3 Set the "Detect" parameters.
Open the "Detect" tab and set the following parameters.
"Detect" parameters
Status: Foreign Object
24450-P6-00
"Judge" parameters
Inspection status
24451-P6-00
4-34
5 Perform a step test.
1. Press the [Step] button to perform a test for the created step. Test results and detection data are
displayed when testing is complete.
Detection data
Position Align dX =, dY = : These are the values corrected with position correction.
Threshold No. : This is the threshold No. applied to inspection.
MaXLength X =
MaXLength Y =
Foreign Level =
: This is the maximum detection width X.
: This is the maximum detection width Y.
: This the maximum foreign object level.
4
2. Take a note of and check the detection data, and then press the [End] button.
Inspection status
3. If the test result is not judged correctly, review all parameters while referring to the detection data.
TIP
Foreign object check steps can be created for all views by pressing the [Edit Assist] button and selecting the "Foreign
Object" tab.
4-35
1.13 Ball joint check (YSi-X)
This inspection status is used to detect the solder ball joint status on parts such as BGAs and CSPs.
24453-P6-00
fault plane height setting bar up and down to set the inspection height. Press the [OK] button at the
position where the solder in the CT image appears largest to end setting, and then close the "Insp.
Img" screen.
3. Press the [X] button to display the X-ray image.
4. Press the [Detected] button. Adjust the sampling thickness slide bar to show only solder balls in red.
4-36
3 Set the "Detect" parameters.
Open the "Detect" tab and set the following parameters.
"Detect" parameters
Status: Boll Joint Check
24455-P6-00
4
"Judge" parameters
Status: Boll Joint Check
Inspection status
24456-P6-00
2
Std Area (mm )
An NG result is judged if the percentage (%) relative to the area calculated from the detection area
ball radius is smaller than the lower limit, or larger than the upper limit.
Position Check
An NG result is judged if the center of the detection area is displaced more than the setting value from
the step center. By selecting the "Inspection" field check box, the relevant item is subject to inspection.
4-37
4 Perform a step test.
1. Press the [Step] button to perform a test for the created step. Test results and detection data are
displayed when testing is complete.
Detection data
Height Offset= : This is the height offset value used to correct board warp.
Threshold No. : This is the threshold No. applied to inspection.
4
Area= : This is the percentage (%) of the recognition area with respect to the standard area.
Radius Min= : This is the detection area minimum radius.
Radius Max= : This is the detection area maximum radius.
2. Take a note of and check the detection data, and then press the [End] button.
Inspection status
4-38
1.14 Void check (YSi-X)
This inspection status is used to inspect solder voids.
24458-P6-00
Inspection status
only the box indicating an image from directly above should be selected.
3. Press the [Detected] button. Adjust the sampling thickness slide bar to show only voids in red.
4. Set the area shown in red with difference in luminance level between neighboring dots in the "Slant
Thresh" - "Std. Size (mm)" setting. (Set an area which balances the luminance.)
5. Set the area shown in red with difference in luminance level between the source image and
balanced image in the "Relative Thresh" - "Std. Size (mm)" setting. (Set an area which balances the
luminance.)
24459-P6-00
4-39
3 Set the "Detect" parameters.
Open the "Detect" tab and set the following parameters.
"Detect" parameters
Status: Void Check
24460-P6-00
4
"Judge" parameters
Status: Void Check
Inspection status
24461-P6-00
4-40
5 Perform a step test.
1. Press the [Step] button to perform a test for the created step. Test results and detection data are
displayed when testing is complete.
2. Take a note of and check the detection data, and then press the [End] button. When doing so,
there is no problem if the test result is "NG".
Detection data
4
Height Offset= : This is the height offset value used to correct board warp.
Threshold No. : This is the threshold No. applied to inspection.
Void Num.= : This is the number of detected voids.
Occupancy= : This is the void occupancy ratio.
Inspection status
6 Review each parameter and perform a step test again.
If the test result is judged incorrectly, review all parameters.
4-41
1.15 Height measurement (option)
This inspection status can be used if equipped with the optional laser height sensor. The height of the
inspection object is measured using the laser height sensor to check whether the result lies within the standard.
After measuring with the board surface and so on as the reference height at "Height Measure" screen, the
height of the inspection object position is measured, and the difference between the reference height is taken
as the parts height. For details, see "Laser Height Sensor" at the end of the Operator's Manual.
4 24463-P6-00
[Detect] tab
24464-P6-00
Measure Type
Select "Reference" from the drop-down list.
Measure Angle
Select the laser beam emission direction (angle) when measuring the parts height as the laser unit
rotates from a drop-down list.
If "AUTO" is selected, the laser emission direction will be the part outer direction.
4-42
Measure Method
Select the method used to obtain the height measurement value from the following four types.
• Spot
Measures the height at the coordinate position in the center of the step.
• Scan Maximum
Measures the height along the step length direction center line and takes the maximum height as
the measurement value.
• Scan Mean
Measures the height along the step length direction center line and takes the average height as the
measurement value.
• Scan Minimum
Measures the height along the step length direction center line and takes the minimum height as the
measurement value.
[Detect] tab
Inspection status
24465-P6-00
Measure Type
Select "Point measurement" or "Line measurement" from the drop-down list.
• Point measurement
Measures the height at the coordinate position in the center of the step.
• Line measurement
Measures the height along the step length direction center line.
Retr y
Sets whether to retry height measurement. Measurement is performed as follows if "Use" is selected.
• If the measurement type is "Point measurement", measurement is performed after rotating the head
180°.
• If the measurement type is "Line measurement", the head performs measurement as it moves and
returns.
4-43
5 Set the "Judge" parameters.
Open the "Judge" tab, and enter the OK part height for "Min offset (mm)" and "Max offset (mm)". If the
standard has not been set, decide the minimum and maximum offset values based on the height
measurement result.
[Judge] tab
24466-P6-00
4 An NG result is judged if the difference between the reference step reference height and point or line
measurement height is greater than this value. Judgment is not made if set to "SKIP".
n NOTE
If height measurement is continued using the same reference height, copy and paste the step, and move it to the
Inspection status
height measurement location. The height reference will always be the previous height reference measurement step. If
the reference height measurement step position and height measurement step position are at a distance from one
another, measurement may be affected by board warp.
4-44
Chapter 5 Inspection machine settings
Contents
n NOTE
The settings described here can also be specified or edited by administrators with level 10 authority.
It is recommended that operator registration and work level editing be carried out before using the machine.
Select "Administrators".
Select "Administrator".
24501-P6-00
5-1
3 Press the [Operator Management] button on the Setup screen.
When the "Operator Management" screen appears, press the [Operator Setting] button.
The "Operator Setting" screen appears.
Operator setting
3
4
5
2
24502-P6-00
1. GROUP NAME
Two group names "Administrators" and "Operators" are registered by default. New groups can be registered as needed by
the administrator or the registered groups can be deleted. Refer to "B.2.2 Editing groups" explained later on.
2. Operator list
5 TIP
This list shows the operator names and their access levels registered in each group.
3. [INS] button
Inspection machine settings
Pressing this button opens the "EDIT OPERATOR" screen. Register a new operator and set the password and access level.
4. [EDIT] button
Press this button when you want to change a registered operator name, access level, and/or password.
c CAUTION
The "Administrator" and "Default Operator" names that are registered by default cannot be changed.
5. [DEL] button
Use this button to delete a registered operator. Select the operator you want to delete and then press this button.
c CAUTION
The "Administrator" and "Default Operator" that are registered by default cannot be deleted.
5-2
4 Press the [INS] button to register an operator.
The "EDIT OPERATOR" screen appears. Set each item as explained below.
3
6
4
5
24503-P6-00
1. OPERATOR NAME
Register the name of an operator who will use this machine. Enter the operator name using alphanumeric characters. The
number of input characters is not limited, but about only 35 characters will appear in the "OPERATOR NAME" box of the
"EDIT OPERATOR" screen.
n NOTE
The following characters can be used in operator names.
abcdefghijklmnopqrstuvwxyzABCDEFGHIJKLMNOPQRSTUVWXYZ0123456789_
Double quotation marks ( " ) and commas ( , ) cannot be used.
2. OPERATOR ID
Not Use
3. LEVEL (access level)
5
Machine operating restrictions are classified by level. Select the applicable level from the drop-down list.
TIP
If changing the previously set work level, see section, "1.4 Editing the level", described later.
n NOTE
The Level 0 operation range is the most restrictive, while the Level 10 operation range allows full access.
5. VERIFICATION OF PASSWORD
To prevent typing mistakes, again enter the password you have just entered in the "PASSWORD" box.
6. GROUP
Set the operator name in a group.
Select the group where the operator name should be registered. You can select "Administrators" or "Operators" or any
group you have registered, by checking the corresponding check box.
TIP
For details on group registration, see section, "1.3 Editing groups", described later.
5-3
1.2 Changing registered operator details
The access level and password of a registered operator can be changed. Also refer to the previous section "1.1
Registering a new operator" for on-screen operation.
TIP
The "Administrator" is allowed to change all operators' passwords.
5
Inspection machine settings
5-4
1.3 Editing groups
This section describes how to rename or add a group, or add or delete an operator.
2
3
4
24504-P6-00
5
Pressing this button opens the following screen that allows you to add a new group. Enter the new group name in the
"GROUP NAME" box and press the [OK] button.
24505-P6-00
5-5
3. [EDIT] button
This section describes how to change the registered group name, operator names inside the group, and the operator level.
A list of registered operators and operators registered by default are displayed in the "EDIT OPERATOR" screen. Operators
with "Entry" check box selected belong to the selected group.
• To change the group name:
Enter a new name in the "GROUP NAME" box.
• If adding an operator to a group
Select the "Entry" check box for the operator to be added to the group. Clear the "Entry" check box for the operator to
be removed from the group. The same operator can be registered in multiple groups.
c CAUTION
The "Administrator" operator in the "Administrators" group cannot be unregistered (check mark cannot be removed).
The "Default Operator" in the "Operators" group cannot be unregistered (check mark cannot be removed).
c CAUTION
The "Administrator" and "Default Operator" access levels cannot be changed.
4. [DEL] button
Use this button to delete a registered group. Select the group you want to delete and press this button. When a
confirmation dialog box appears, press the [OK] button.
n NOTE
If an operator was only registered in the group you have deleted, that operator is automatically registered in the
"Operators" group that is registered by default.
c CAUTON
The pre-registered "Administrators" and "Operators" groups cannot be deleted.
5-6
1.4 Editing access levels
This section describes how to set work levels for each type of work. The level can only be set by operators with
level equal to or higher than the work level.
24507-P6-00
5
Select the applicable item, and set the level from the "LEVEL" field drop-down list.
24508-P6-00
5-7
2. Machine settings
Press the [Machine] button in the button area to specify default settings for all machine functions and to
specify detailed settings. This section describes the tree view items and operation buttons in the machine
settings screen. The settings that appear when tree view items are selected are described from section 2.1,
"Installation settings".
c CAUTON
• Administrator privileges are required to change machine settings.
• All machine settings and parameters are set before the machine is shipped (or installed). The machine may not
operate correctly if changes are made to the machine settings, and therefore caution is advised.
• After changing machine settings, press the "Setup" screen - [System Backup] button to save the system backup.
• If checking the settings, or when it is necessary to specify the settings again, refer to the following description.
Tree view
Setting items
5
[Apply] button
24509-P6-00
in this chapter.)
Sets the board loading and unloading positions. (See 2.2, Conveyor
Conveyor Setting
transfer settings", in this chapter.)
Specifies secondary judgment settings. NG reasons can also be edited.
Second Judge Setting
(See 2.3, Secondary judgment settings", in this chapter.)
Specifies option software settings and data save path settings.
Server Setting
(See 2.4, Server settings", in this chapter.)
Specifies library settings.
Lib Setting
(See 2.5, Library settings", in this chapter.)
Specifies settings when the machine is equipped with optional Repair
Station or marking unit.
• If the machine is equipped with a Repair Station, the board ID
Board ID Setting when transmitting inspection results is specified.
• If the machine is equipped with a marking unit, the board ID
written on the board is specified.
Refer to the respective operation manuals for details.
Specifies signal tower and buzzer settings based on the machine
Signal Tower Edit operation and inspection status.
(See 2.6, Editing signal tower settings", in this chapter.)
Sets conditions when converting mount data (YGX) to inspection
Data Conversion Setting machine data.
(See 2.7, Data conversion settings", in this chapter.)
Special functions can be added, and the use or non-use of functions
Special Setting Function Setting
can be specified.
Detail Setting Specifies details for special settings.
[Apply] button Press the [Apply] button to save the changed content.
c CAUTON
If settings are changed, press the [Apply] button to save the settings. If a message appears, follow the instructions provided.
5-8
2.1 Installation settings
Installation settings are used to specify default machine settings.
24510-P6-00
Item Details
5
Inspection is terminated the moment a defect is detected during
board inspection, and the defect location displays on the NG
monitor. Judgment is made while viewing defect location images.
Counter is initialized When set to "Use", the total production quantity is initialized to "0"
2 after program loading when reading inspection data.
Selects the steps to be skipped when an NG occurs.
5-9
"Machine settings" screen
"Setting" m "Machine Information" m "Installation Setting" 2/2
4
5
6
8
9
24511-P6-00
Item Details
X-Ray (YSi-X) X-Ray source Type Displays the X-ray source installed on the machine.
6 X-Ray Zoom Enables the capture of enlarged X-ray images when set to "Use".
X-Ray Tilt sight Enables the capture of tilted X-ray images when set to "Use".
5
X-Ray Shading Data
Sets the cycle for X-ray shading.
Update Cycle (min)
Conveyor Fixed Conveyor Displays the standard conveyor when changing the conveyor width.
Board Cooling (sec) Sets the waiting time at the conveyor entrance for board cooling.
Board Wating Timer Specifies the conveyor idling time until the board is clamped after
(msec) hitting the stopper when performing board loading.
Carry Out Timer (msec) Specifies the conveyor idling time when unloading boards.
Sets the specification for the transfer of board signals with the
Upper Handing
upstream machine.*
7
Sets the specification for the transfer of board signals with the
Lower Handing
downstream machine.*
Stops the machine and sets the timing of the message output when
an NG board occurs during automatic inspection.
Select from "No Use", "Before Export", and "After Export".
• No Use
NG Stop This function is not used.
• Before Export
Displays a message at the inspection position.
• After Export
Displays a message after unloading the board from the machine.
Sets the board transfer method from "NORMAL", "DEMO U-TURN",
Transter Mode
or "DEMO Fixed".
Selects the NG stocker type if equipped with an NG stocker. Select
NG Stocker Type
"Through" if not equipped with an NG stocker.
5-10
Item Details
Maker Maker Unit Set to "Use" if the machine is equipped with a marking unit (option).
24512-P6-00
Details
1
Board Transter
control
IN
OUT
Sets the board entrance.
5-11
2.3 Secondar y judgment settings
By setting "Second Judge Func" to "Use", a "Judge" tab is added to the "Auto" screen, and an OK or NG result is
judged for all NG steps when board inspection is complete. Furthermore, by registering the NG reason and
color in the "NG Reason List", the NG reasons used when performing judgment can be changed. The position
of the parts on the board image displays with a line in the registered color. For details on the "Judge" tab, see
section 1.5, ""Judge" screen", in Chapter 1.
24513-P6-00
1 Second Judge Func Select "Use" to use the secondary judgment function.
5
By selecting this check box, OK/NG judgment is possible in step
3 Judgment by Step
units. If not selected, judgment is performed in parts units.
Press this button to register a new NG reason.
By selecting a registered NG reason and pressing this button, a
4 Add New
new entry row is added below the selected NG reason.
NG Reason List Enter a new NG reason in the added row, and then select a color.
Press this button to delete a registered NG reason.
Inspection machine settings
5 Delete
Select the NG reason to be selected and press the [Delete] button.
5-12
2.4 Ser ver settings
Specifies option software settings and server path settings.
1 2
3
4
5
24514-P6-00
Item Details
Repair Station
1 Repair Station Sets whether to use the Repair Station.
(option) *1
5
*1 Press the [Browse] button and specify the "RPST.tdt" file located in
2 Repair Station Path: (option)
the folder used for storing Repair Station data.
Remote Judge Remote Judgment
3 Sets whether to use remote judgment.
(option) *2 Station
*2 Press the [Browse] button and specify the "RPST.tdt" file located in
4 Remote Judgment Path: (option)
the folder used for storing Repair Station data.
Save OK Image Select this check box to save images with "OK" inspection result.
Save OK Continue Select this check box to save images with "OK continue" inspection
Image result.
Save NG Image Select this check box to save images with "NG" inspection result.
5-13
2.5 Librar y settings
Specifies settings relating to parts libraries.
24515-P6-00
Item Details
5
Inspection machine settings
5-14
2.6 Editing signal tower settings
This section describes how to specify signal tower display settings for all machine statuses. Settings are
specified for the first lamp to the third lamp. (The signal tower lamps are arranged in order first lamp, second
lamp, third lamp, from top to bottom.)
Signal tower display settings
Signal tower display settings are specified for all machine statuses. "No Control", "OFF", "BLINK", or "ON" can be set for
each lamp. Refer to the following table for details on the items that can be set.
Buzzer settings
Buzzer ON/OFF settings are specified for all machine statuses.
24516-P6-00
Item Status
5
Color Lamp color display
Waiting for Judgment Waiting for judgment from secondary judgment, semi-auto screen
Waiting for External Judgment Waiting for judgment from Remote Judgment Station (option)
5-15
2.7 Data conversion settings
Specifies detailed settings when converting mount data to inspection machine data.
TIP
For details on data conversion operation, see section 2.2, "Data conversion", in Chapter 2.
24517-P6-00
Item Details
YGX Data Path Specifies the folder in which the YGX data to be converted is saved.
5
Only reference steps for the parts exterior size are created.
• Inspection Step
Step Convert Type Reference steps and parts check steps for the parts exterior size (some steps
will also be OK) are created.
• Inspection + Visual Step"
Reference steps and parts check steps for the parts exterior size (all steps will
be NG) are created.
Inspection machine settings
If set to "Use", the library parts names set in the library table are set for the step
Use Database chart library parts names when converting data. If set to "No Use", library parts names
are not set when converting data.
Specifies whether to set the YGX data "Parts Name" or "Comment" as the
Parts Name Convert
inspection data parts name when converting data.
Specifies whether to set the library table "Parts Name" or "Comment" as the
Sharp Find Key
inspection data parts name when converting data.
Skip Data Conversion Sets whether to convert parts skipped in YGX data to inspection machine data.
5-16
Appendix
Appendix
Contents
Appendix
List of shortcut key functions
F1 F3 Ins
Del
F Home
End
Ctrl C V Del
23002-P6-00
Home Moves the cursor to the first step in the selected view.
End Moves the cursor to the last step in the selected view.
Displays steps that have not been set in the library. Displays
F3
the next unset step when pressed again F3 .
i
INDEX Editing Assistance 3-28
Editing groups 5-5
Measurement results 3-27
Missing part 2-5
INDEX
Editing pin Nos. 3-30 Multiple threshold value settings 3-12
Editing signal tower settings 5-15 Multi-test 3-24
A
Electrode Check 4-5 N
All Set button 3-8
Ending the automatic inspection 1-35 NG monitor 1-32
Analysis button 3-26
F O
Area button 3-5
Auto Calculation button 3-27 Fiducial function 2-15 OCR Reg. button 3-8
Auto creation function buttons 2-31 Fiducial screen 1-5 Offset Limit 3-6
Auto inspection screen 1-13 Fillet 2-7 Operation screen 1-1
Flowchart for creating an inspection Operator access control 5-1
B
program 2-9 OPERATOR NAME 5-3
Back fillet 2-8
Foreign object check 4-33 Operator selection screen 1-25
Bad mark function 2-24
Foreign object check deployment 3-32 Optical inspection 2-2
Bad Mark screen 1-6,1-16
Free area 1-1 Origin 1-3,1-21
Bad mark settings 2-26
G Output screen 1-15
Ball joint check 4-36
Basic parameters 2-16 GROUP 5-3 P
Batch replacement 3-34 H Page layout iv
Board parameter 1-4 Height Correct screen 1-11 Parts Check 4-2
Board screen 1-4 Height measurement 4-42 PASSWORD 5-3
Bridge 2-6 Height Measure screen 1-17 Pin Information Deployment 3-28
Brightness Level 4-22 History 1-24 Pin position editing 3-33
Button area 1-1,1-2 I Pitch input and copy of multiple views
Carry Log screen 1-19 Inspection method 2-2 Pitch Rep 1-7
Changing registered operator details 5-4 Inspection with optical camera 2-5 Position Correction 4-19
Character Recognition 4-11 Inspection with X-ray camera 2-8 Position deviation 2-5
S-1
Shortening inspection time 2-31
Solder inspection of lower surface
INDEX
S-2
PROGRAMMING MANUAL
High-speed High-precision Hybrid AOI
V2.2
Aug. 2013Version 1.00
© YAMAHA MOTOR CO., LTD. IM Operations
All rights reserved. No part of this publication may be
reproduced in any form without the permission of
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