SN54HC138, SN74HC138

SCLS107G – DECEMBER 1982 – REVISED OCTOBER 2021

SNx4HC138 3-Line To 8-Line Decoders/Demultiplexers

1 Features 3 Description
• Targeted Specifically for High-Speed Memory The SNx4HC138 devices are designed to be used
Decoders and Data-Transmission Systems in high-performance memory-decoding or data-routing
• Wide Operating Voltage Range (2 V to 6 V) applications requiring very short propagation delay
• Outputs Can Drive Up To 10 LSTTL Loads times. In high-performance memory systems, these
• Low Power Consumption, 80-µA Maximum ICC decoders can be used to minimize the effects of
• Typical tpd = 15 ns system decoding. When employed with high-speed
• ±4-mA Output Drive at 5 V memories using a fast enable circuit, the delay times
• Low Input Current of 1-µA Maximum of these decoders and the enable time of the memory
• Active Low Outputs ( Selected Output is Low) are usually less than the typical access time of the
• Incorporate Three Enable Inputs to Simplify memory. This means that the effective system delay
Cascading or Data Reception introduced by the decoders is negligible.
2 Applications Device Information
(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
• LED Displays
• Servers SN74HC138D SOIC (16) 9.90 mm x 3.90 mm
• White Goods SN74HC138DB SSOP (16) 6.20 mm x 5.30 mm
• Power Infrastructure SN74HC138N PDIP (16) 19.32 mm x 6.35 mm
• Building Automation SN74HC138NS SO (16) 10.20 mm x 5.30 mm
• Factory Automation SN74HC138PW TSSOP (16) 5.00 mm x 4.40 mm
SN54HC138J CDIP (16) 21.34 mm x 6.92 mm
SN54HC138W CFP (16) 10.16 mm x 6.73 mm
SN54HC138FK LCCC (20) 8.89 mm x 8.89 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.
Functional Block DIagram

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
1 Features............................................................................1 8.1 Overview..................................................................... 9
2 Applications..................................................................... 1 8.2 Functional Block Diagram........................................... 9
3 Description.......................................................................1 8.3 Feature Description.....................................................9
4 Revision History.............................................................. 2 8.4 Device Functional Modes..........................................10
5 Pin Configuration and Functions...................................3 9 Application and Implementation.................................. 11
Pin Functions.................................................................... 3 9.1 Application Information..............................................11
6 Specifications.................................................................. 4 9.2 Typical Application.................................................... 11
6.1 Absolute Maximum Ratings........................................ 4 10 Power Supply Recommendations..............................12
6.2 ESD Ratings: SN74HC138......................................... 4 11 Layout........................................................................... 12
6.3 Recommended Operating Conditions.........................4 11.1 Layout Guidelines................................................... 12
6.4 Thermal Information: SN74HC138..............................5 11.2 Layout Example...................................................... 12
6.5 Thermal Information: SN54HC138..............................5 12 Device and Documentation Support..........................13
6.6 Electrical Characteristics.............................................5 12.1 Documentation Support.......................................... 13
6.7 Electrical Characteristics: SN74HC138...................... 6 12.2 Related Links.......................................................... 13
6.8 Electrical Characteristics: SN54HC138...................... 6 12.3 Receiving Notification of Documentation Updates..13
6.9 Switching Characteristics............................................6 12.4 Support Resources................................................. 13
6.10 Switching Characteristics: SN74HC138....................7 12.5 Trademarks............................................................. 13
6.11 Switching Characteristics: SN54HC138....................7 12.6 Electrostatic Discharge Caution..............................13
6.12 Typical Characteristic................................................7 12.7 Glossary..................................................................13
7 Parameter Measurement Information............................ 8 13 Mechanical, Packaging, and Orderable
8 Detailed Description........................................................9 Information.................................................................... 13

4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (September 2003) to Revision F (September 2016) Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section................... 1
• Deleted Ordering Information table; see POA at the end of the data sheet....................................................... 1
• Changed RθJA values from 73 to 87.3 (D), from 82 to 104.3 (DB), from 67 to 54.8 (N), from 64 to 91.1 (NS),
and from 108 to 114.6 (PW)................................................................................................................................5

Changes from Revision F (September 2016) to Revision G (October 2021) Page

• Updated the ESD ratings table to fit modern data sheet standards....................................................................4

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5 Pin Configuration and Functions

SOIC, SSOP, PDIP, SO, TSSOP, CDIP, or CFP

Package
16-Pin D, DB, N, NS, PW, J or W NC: No internal connection
Top View LCCC Package
20-Pin FK
Top View

Pin Functions
PIN
SOIC, SSOP, PDIP, SO, I/O(1) DESCRIPTION
NAME LCCC
TSSOP, CDIP, CFP
A 1 2 I Select input A (least significant bit)
B 2 3 I Select input B
C 3 4 I Select input C (most significant bit)
G2A 4 5 I Active low enable A
G2B 5 7 I Active low enable B
G1 6 8 I Active high enable
GND 8 10 — Ground
NC — 1, 6, 11, 16 — No internal connection
VCC 16 20 — Supply voltage
Y0 15 19 O Output 0 (least significant bit)
Y1 14 18 O Output 1
Y2 13 17 O Output 2
Y3 12 15 O Output 3
Y4 11 14 O Output 4
Y5 10 13 O Output 5
Y6 9 12 O Output 6
Y7 7 9 O Output 7 (most significant bit)

(1) Signal Types: I = Input, O = Output, I/O = Input or Output.

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6 Specifications
6.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage range –0.5 7 V
(2)
IIK Input clamp current VI < 0 or VI > VCC ±20 mA
(2)
IOK Output clamp current VO < 0 or VO > VCC ±20 mA
IO Continuous output current VO = 0 to VCC ±25 mA
Continuous current through VCC or GND ±50 mA
TJ Junction temperature 150 °C
Tstg Storage temperature –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings: SN74HC138

VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000
V(ESD) Electrostatic discharge V
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2) ±1000

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN NOM MAX UNIT
VCC Supply voltage 2 5 6 V
VCC = 2 V 1.5
VIH High-level input voltage VCC = 4.5 V 3.15 V
VCC = 6 V 4.2
VCC = 2 V 0.5
VIL Low-level input voltage VCC = 4.5 V 1.35 V
VCC = 6 V 1.8
VI Input voltage 0 VCC V
VO Output voltage 0 VCC V
VCC = 2 V 1000
Δt/Δv Input transition rise or fall time VCC = 4.5 V 500 ns
VCC= 6 V 400
Cpd Power dissipation capacitance (no load) 85 pF
SN54HC138 –55 125
TA Operating free-air temperature °C
SN74HC138 –40 85

(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See TI application report, Implications
of Slow or Floating CMOS Inputs (SCBA004).

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6.4 Thermal Information: SN74HC138

SN74HC138
THERMAL METRIC(1) D (SOIC) DB (SSOP) N (PDIP) NS (SO) PW (TSSOP) UNIT
16 PINS 16 PINS 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 87.3 104.3 54.8 91.1 141.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 45.8 54.7 42.1 49.5 49.5 °C/W
RθJB Junction-to-board thermal resistance 44.8 54.9 34.8 51.5 59.6 °C/W
ψJT Junction-to-top characterization parameter 14.2 17.7 27 17.8 6.9 °C/W
Junction-to-board characterization
ψJB 44.5 54.4 34.7 51.2 59.1 °C/W
parameter

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.

6.5 Thermal Information: SN54HC138

SN54HC138(2)
THERMAL METRIC(1) J (CDIP) W (CFP) FK (LCCC) UNIT
16 PINS 16 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance — — — °C/W
RθJC(top) Junction-to-case (top) thermal resistance 45.4 68.1 49 °C/W
RθJB Junction-to-board thermal resistance — 118.4 47.7 °C/W
ψJT Junction-to-top characterization parameter — — 7.2 °C/W
ψJB Junction-to-board characterization parameter 62.5 — — °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 17.7 9 — °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2) RθJC follows MIL-STD-883, and RθJB follows JESD51.

6.6 Electrical Characteristics

TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VCC = 2 V 1.9 1.998
IOH = –20 µA VCC = 4.5 V 4.4 4.499
VOH VI = VIH or VIL VCC = 6 V 5.9 5.999 V
IOH = –4 mA, VCC = 4.5 V 3.98 4.3
IOH= –5.2 mA, VCC = 6 V 5.48 5.8
VCC = 2 V 0.002 0.1
IOL = 20 µA VCC = 4.5 V 0.001 0.1
VOL VI= VIH or VIL VCC = 6 V 0.001 0.1 V
IOL = 4 mA, VCC = 4.5 V 0.17 0.26
IOL = 5.2 mA, VCC = 6 V 0.15 0.26
II VI = VCC or 0, VCC = 6 V ±0.1 ±100 nA
ICC VI = VCC or 0, IO = 0, VCC = 6 V 8 µA
Ci VCC = 2 V to 6 V 3 10 pF

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6.7 Electrical Characteristics: SN74HC138

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VCC = 2 V 1.9
IOH = –20 µA VCC = 4.5 V 4.4
VOH VI = VIH or VIL VCC = 6 V 5.9 V
IOH = –4 mA, VCC = 4.5 V 3.84
IOH= –5.2 mA, VCC = 6 V 5.34
VCC = 2 V 0.1
IOL = 20 µA VCC = 4.5 V 0.1
VOL VI= VIH or VIL VCC = 6 V 0.1 V
IOL = 4 mA, VCC = 4.5 V 0.33
IOL = 5.2 mA, VCC = 6 V 0.33
II VI = VCC or 0, VCC = 6 V ±1000 nA
ICC VI = VCC or 0, IO = 0, VCC = 6 V 80 µA
Ci VCC = 2 V to 6 V 10 pF

6.8 Electrical Characteristics: SN54HC138

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
VCC = 2 V 1.9
IOH = –20 µA VCC = 4.5 V 4.4
VOH VI = VIH or VIL VCC = 6 V 5.9 V
IOH = –4 mA, VCC = 4.5 V 3.7
IOH= –5.2 mA, VCC = 6 V 5.2
VCC = 2 V 0.1
IOL = 20 µA VCC = 4.5 V 0.1
VOL VI= VIH or VIL VCC = 6 V 0.1 V
IOL = 4 mA, VCC = 4.5 V 0.4
IOL = 5.2 mA, VCC = 6 V 0.4
II VI = VCC or 0, VCC = 6 V ±1000 nA
ICC VI = VCC or 0, IO = 0, VCC = 6 V 160 µA
Ci VCC = 2 V to 6 V 10 pF

6.9 Switching Characteristics

TA = 25°C and CL = 50 pF (unless otherwise noted; see Section 7)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VCC = 2 V 67 180
From A, B, or C (input) to any Y (output) VCC = 4.5 V 18 36
VCC = 6 V 15 31
tpd ns
VCC = 2 V 66 155
From enable (input) to any Y (output) VCC = 4.5 V 18 31
VCC = 6 V 15 26
VCC = 2 V 38 75
tt To any output VCC = 4.5 V 8 15 ns
VCC = 6 V 6 13

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6.10 Switching Characteristics: SN74HC138

over recommended operating free-air temperature range and CL = 50 pF (unless otherwise noted; see Section 7)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VCC = 2 V 225
From A, B, or C (input) to any Y (output) VCC = 4.5 V 45
VCC = 6 V 38
tpd ns
VCC = 2 V 195
From enable (input) to any Y (output) VCC = 4.5 V 39
VCC = 6 V 33
VCC = 2 V 95
tt To any output VCC = 4.5 V 19 ns
VCC = 6 V 16

6.11 Switching Characteristics: SN54HC138

over recommended operating free-air temperature range and CL = 50 pF (unless otherwise noted; see Section 7)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VCC = 2 V 270
From A, B, or C (input) to any Y (output) VCC = 4.5 V 54
VCC = 6 V 46
tpd ns
VCC = 2 V 235
From enable (input) to any Y (output) VCC = 4.5 V 47
VCC = 6 V 40
VCC = 2 V 110
tt To any output VCC = 4.5 V 22 ns
VCC = 6 V 19

6.12 Typical Characteristic

Propagation Delay From A, B, C to any Y (ns)

70
65
60
55
50
45
40
35
30
25
20
15
2 2.5 3 3.5 4 4.5 5 5.5 6
Supply Voltage VCC (V) D001

Figure 6-1. Typical Propagation Delay vs Supply Voltage

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7 Parameter Measurement Information

From Output Test VCC
Under Test Point Input 50% 50%
0V
CL = 50 pF
(see Note A) tPLH tPHL

In-Phase VOH
90% 90%
Output 50% 50%
LOAD CIRCUIT 10% 10%
VOL
tr tf
tPHL tPLH
VCC
90% 90% VOH
Input 50% 50% Out-of-Phase 90% 90%
10% 10% 0 V 50% 50%
Output 10% 10%
VOL
tr tf tf tr

VOLTAGE WAVEFORM VOLTAGE WAVEFORMS

INPUT RISE AND FALL TIMES PROPAGATION DELAY AND OUTPUT TRANSITION TIMES

NOTES: A. CL includes probe and test-fixture capacitance.

B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. The outputs are measured one at a time with one input transition per measurement.
D. tPLH and tPHL are the same as tpd.

Figure 7-1. Load Circuit and Voltage Waveforms

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8 Detailed Description
8.1 Overview
The SNx4HC138 devices are 3-to-8 decoders and demultiplexers. The three input pins, A, B, and C, select
which output is active. The selected output is pulled LOW, while the remaining outputs are all HIGH. The
conditions at the binary-select inputs at the three enable inputs select one of eight output lines. Two active-low
and one active-high enable inputs reduce the requirement for external gates or inverters when expanding. A
24-line decoder can be implemented without external inverters, and a 32-line decoder requires only one inverter.
An enable input can be used as a data input for demultiplexing applications.
8.2 Functional Block Diagram

Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.

8.3 Feature Description

This device features three binary inputs to select a single active-low output. Three enable pins are also available
to enable or disable the outputs. One active high enable and two active low enable pins are available, and any
enable pin can be deactivated to force all outputs high. All three enable pins must be active for the output to be
enabled.

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8.4 Device Functional Modes

Table 8-1 lists the functions of the SNx4HC138 devices.
Table 8-1. Function Table
INPUTS
OUTPUTS
ENABLE SELECT
G1 G2A G2B C B A Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7
X H X X X X H H H H H H H H
X X H X X X H H H H H H H H
L X X X X X H H H H H H H H
H L L L L L L H H H H H H H
H L L L L H H L H H H H H H
H L L L H L H H L H H H H H
H L L L H H H H H L H H H H
H L L H L L H H H H L H H H
H L L H L H H H H H H L H H
H L L H H L H H H H H H L H
H L L H H H H H H H H H H L

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9 Application and Implementation

Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.

9.1 Application Information

The SN74HC138 is useful as a scanning column selector for an LED Matrix display as it can be used for the
low side drive of the LED string. The decoder functionality ensures that no more than one output is pulled to a
low-level logic voltage so that only a single column is enabled at any point in time.
9.2 Typical Application

SER
0V
GPIO Inputs QA
SRCLK
RCLK
SN74HC595B
3.3V
QH

3.3V 0V

HIGH Y0 Y7
A
GPIO Inputs HIGH B
SN74HC138
HIGH C

Copyright © 2016, Texas Instruments Incorporated

Figure 9-1. LED Matrix Driver Application

9.2.1 Design Requirements

These devices use CMOS technology and have balanced output drive. Take care to avoid bus contention
because it can drive currents that would exceed maximum limits. The high drive also creates fast edges into light
loads, so routing and load conditions must be considered to prevent ringing.
9.2.2 Detailed Design Procedure
1. Recommended Input Conditions
• For switch time specifications, see propagation delay times in Section 6.9.
• For input voltage level specifications for control inputs, see VIH and VIL in Section 6.6.
2. Recommended Output Conditions
• Outputs must not be pulled above VCC or below GND.

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9.2.3 Application Curve

5
VIH MIN
4.5 VIL MAX
4
3.5

Logic Level (V)

3
2.5
2
1.5
1
0.5
0
2 2.4 2.8 3.2 3.6 4 4.4 4.8 5.2 5.6 6
Supply Voltage VCC (V) D002

Figure 9-2. Input High and Input Low Thresholds vs Supply Voltage

10 Power Supply Recommendations

The power supply can be any voltage between the minimum and maximum supply voltage rating located in the
Section 6.3.
Each VCC terminal must have a good bypass capacitor to prevent power disturbance. A 0.1-µF bypass capacitor
is recommended to be placed close to the VCC terminal. It is acceptable to parallel multiple bypass capacitors
to reject different frequencies of noise; 0.1-µF and 1-µF capacitors are commonly used in parallel. The bypass
capacitor must be installed as close to the power terminal as possible for best results.
11 Layout
11.1 Layout Guidelines
Reflections and matching are closely related to loop antenna theory, but different enough to warrant their own
discussion. When a PCB trace turns a corner at a 90° angle, a reflection can occur. This is primarily due to the
change of width of the trace. At the apex of the turn, the trace width is increased to 1.414 times its width. This
upsets the transmission line characteristics, especially the distributed capacitance and self–inductance of the
trace (resulting in the reflection). It is a given that not all PCB traces can be straight, and so they have to turn
corners. Figure 11-1 shows progressively better techniques of rounding corners. Only the last example maintains
constant trace width and minimizes reflections.
11.2 Layout Example
WORST BETTER BEST
2W

1W min.

W
Figure 11-1. Trace Example

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12 Device and Documentation Support

12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
Implications of Slow or Floating CMOS Inputs (SCBA004)
12.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 12-1. Related Links
TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER SAMPLE & BUY
DOCUMENTS SOFTWARE COMMUNITY
SN54HC138 Click here Click here Click here Click here Click here
SN74HC138 Click here Click here Click here Click here Click here

12.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.4 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.5 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
12.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.

12.7 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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PACKAGING INFORMATION

Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)

5962-8406201VEA Active Production CDIP (J) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962-8406201VE
A
SNV54HC138J
5962-8406201VEA.A Active Production CDIP (J) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962-8406201VE
A
SNV54HC138J
5962-8406201VFA Active Production CFP (W) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962-8406201VF
A
SNV54HC138W
5962-8406201VFA.A Active Production CFP (W) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 5962-8406201VF
A
SNV54HC138W
84062012A Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 84062012A
SNJ54HC
138FK
8406201EA Active Production CDIP (J) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 8406201EA
SNJ54HC138J
8406201FA Active Production CFP (W) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 8406201FA
SNJ54HC138W
JM38510/65802B2A Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/
65802B2A
JM38510/65802B2A.A Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/
65802B2A
JM38510/65802BEA Active Production CDIP (J) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/
65802BEA
JM38510/65802BEA.A Active Production CDIP (J) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/
65802BEA
M38510/65802B2A Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/
65802B2A
M38510/65802BEA Active Production CDIP (J) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/
65802BEA
SN54HC138J Active Production CDIP (J) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SN54HC138J
SN54HC138J.A Active Production CDIP (J) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SN54HC138J
SN74HC138D Obsolete Production SOIC (D) | 16 - - Call TI Call TI -40 to 85 HC138

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 25-Jul-2025

Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)

SN74HC138DBR Active Production SSOP (DB) | 16 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138DBR.A Active Production SSOP (DB) | 16 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138DBR.B Active Production SSOP (DB) | 16 2000 | LARGE T&R - NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138DR Active Production SOIC (D) | 16 2500 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138DR.A Active Production SOIC (D) | 16 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138DRE4 Active Production SOIC (D) | 16 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138DRG4 Active Production SOIC (D) | 16 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138DRG4.A Active Production SOIC (D) | 16 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138DT Obsolete Production SOIC (D) | 16 - - Call TI Call TI -40 to 85 HC138
SN74HC138N Active Production PDIP (N) | 16 25 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 85 SN74HC138N
SN74HC138N.A Active Production PDIP (N) | 16 25 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 85 SN74HC138N
SN74HC138NE4 Active Production PDIP (N) | 16 25 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 85 SN74HC138N
SN74HC138NSR Active Production SOP (NS) | 16 2000 | LARGE T&R Yes NIPDAU | NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138NSR.A Active Production SOP (NS) | 16 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138PW Obsolete Production TSSOP (PW) | 16 - - Call TI Call TI -40 to 85 HC138
SN74HC138PW.B Obsolete Production TSSOP (PW) | 16 - - Call TI Call TI -40 to 85 HC138
SN74HC138PWR Active Production TSSOP (PW) | 16 2000 | LARGE T&R Yes NIPDAU | SN Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138PWR.A Active Production TSSOP (PW) | 16 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138PWRG4 Active Production TSSOP (PW) | 16 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138PWRG4.A Active Production TSSOP (PW) | 16 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 HC138
SN74HC138PWT Obsolete Production TSSOP (PW) | 16 - - Call TI Call TI -40 to 85 HC138
SNJ54HC138FK Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 84062012A
SNJ54HC
138FK
SNJ54HC138FK.A Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 84062012A
SNJ54HC
138FK
SNJ54HC138J Active Production CDIP (J) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 8406201EA
SNJ54HC138J
SNJ54HC138J.A Active Production CDIP (J) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 8406201EA
SNJ54HC138J

Addendum-Page 2
 PACKAGE OPTION ADDENDUM

www.ti.com 25-Jul-2025

Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)

SNJ54HC138W Active Production CFP (W) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 8406201FA
SNJ54HC138W
SNJ54HC138W.A Active Production CFP (W) | 16 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 8406201FA
SNJ54HC138W

(1)
Status: For more details on status, see our product life cycle.

(2)
Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,
reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional
waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

(3)
RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4)
Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum
column width.

(5)
MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.
Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

(6)
Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.

Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two
combined represent the entire part marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and
makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative
and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers
and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF SN54HC138, SN54HC138-SP, SN74HC138 :

• Catalog : SN74HC138, SN54HC138

Addendum-Page 3
 PACKAGE OPTION ADDENDUM

www.ti.com 25-Jul-2025

• Automotive : SN74HC138-Q1, SN74HC138-Q1

• Military : SN54HC138
• Space : SN54HC138-SP

NOTE: Qualified Version Definitions:

• Catalog - TI's standard catalog product

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

Addendum-Page 4
 PACKAGE MATERIALS INFORMATION

www.ti.com 24-Jul-2025

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74HC138DBR SSOP DB 16 2000 330.0 16.4 8.35 6.6 2.4 12.0 16.0 Q1
SN74HC138DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74HC138DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74HC138DRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74HC138NSR SOP NS 16 2000 330.0 16.4 8.45 10.55 2.5 12.0 16.2 Q1
SN74HC138PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74HC138PWRG4 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 24-Jul-2025

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HC138DBR SSOP DB 16 2000 353.0 353.0 32.0
SN74HC138DR SOIC D 16 2500 340.5 336.1 32.0
SN74HC138DR SOIC D 16 2500 340.5 336.1 32.0
SN74HC138DRG4 SOIC D 16 2500 340.5 336.1 32.0
SN74HC138NSR SOP NS 16 2000 353.0 353.0 32.0
SN74HC138PWR TSSOP PW 16 2000 356.0 356.0 35.0
SN74HC138PWRG4 TSSOP PW 16 2000 353.0 353.0 32.0

Pack Materials-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 24-Jul-2025

TUBE

T - Tube
height L - Tube length

W - Tube
width

B - Alignment groove width

*All dimensions are nominal

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
5962-8406201VFA W CFP 16 25 506.98 26.16 6220 NA
5962-8406201VFA.A W CFP 16 25 506.98 26.16 6220 NA
84062012A FK LCCC 20 55 506.98 12.06 2030 NA
8406201FA W CFP 16 25 506.98 26.16 6220 NA
JM38510/65802B2A FK LCCC 20 55 506.98 12.06 2030 NA
JM38510/65802B2A.A FK LCCC 20 55 506.98 12.06 2030 NA
M38510/65802B2A FK LCCC 20 55 506.98 12.06 2030 NA
SN74HC138N N PDIP 16 25 506 13.97 11230 4.32
SN74HC138N N PDIP 16 25 506 13.97 11230 4.32
SN74HC138N.A N PDIP 16 25 506 13.97 11230 4.32
SN74HC138N.A N PDIP 16 25 506 13.97 11230 4.32
SN74HC138NE4 N PDIP 16 25 506 13.97 11230 4.32
SN74HC138NE4 N PDIP 16 25 506 13.97 11230 4.32
SNJ54HC138FK FK LCCC 20 55 506.98 12.06 2030 NA
SNJ54HC138FK.A FK LCCC 20 55 506.98 12.06 2030 NA
SNJ54HC138W W CFP 16 25 506.98 26.16 6220 NA
SNJ54HC138W.A W CFP 16 25 506.98 26.16 6220 NA

Pack Materials-Page 3
 PACKAGE OUTLINE
NS0016A SCALE 1.500
SOP - 2.00 mm max height
SOP

8.2 SEATING PLANE

TYP
7.4
A PIN 1 ID 0.1 C
AREA
14X 1.27
16
1

10.4 2X
10.0 8.89
NOTE 3

8
9
0.51
16X
5.4 0.35
B 0.25 C A B 2.00 MAX
5.2
NOTE 4

0.15 TYP

SEE DETAIL A
0.25 0.3
GAGE PLANE 0.1

0 - 10
1.05
0.55 DETAIL A
TYPICAL
(1.25)

4220735/A 12/2021

NOTES:

1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.

www.ti.com
 EXAMPLE BOARD LAYOUT
NS0016A SOP - 2.00 mm max height
SOP

16X (1.85) SEE

SYMM DETAILS

1 16

16X (0.6)

SYMM

14X (1.27)

8 9

(R0.05) TYP

(7)

LAND PATTERN EXAMPLE

SCALE:7X

SOLDER MASK SOLDER MASK METAL

METAL OPENING OPENING

0.07 MAX 0.07 MIN

ALL AROUND ALL AROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED

SOLDER MASK DETAILS

4220735/A 12/2021

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
NS0016A SOP - 2.00 mm max height
SOP

16X (1.85) SYMM

1 16

16X (0.6)

SYMM

14X (1.27)

8 9

(R0.05) TYP (7)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE:7X

4220735/A 12/2021

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.

www.ti.com
 PACKAGE OUTLINE
DB0016A SCALE 1.500
SSOP - 2 mm max height
SMALL OUTLINE PACKAGE

C
8.2
TYP
A 7.4
0.1 C SEATING
PIN 1 INDEX AREA
PLANE
14X 0.65
16
1

2X
6.5
4.55
5.9
NOTE 3

8
9
0.38
16X
0.22
5.6
B 0.1 C A B
5.0
NOTE 4

0.25
0.09

SEE DETAIL A
2 MAX
0.25
GAGE PLANE

0.95 0.05 MIN

0 -8 0.55

DETAIL A
A 15

TYPICAL

4220763/A 05/2022

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-150.

www.ti.com
 EXAMPLE BOARD LAYOUT
DB0016A SSOP - 2 mm max height
SMALL OUTLINE PACKAGE

16X (1.85) SYMM

1 (R0.05) TYP

16X (0.45) 16

SYMM

14X (0.65)

8 9

(7)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE: 10X

SOLDER MASK METAL UNDER SOLDER MASK

METAL
OPENING SOLDER MASK OPENING

EXPOSED METAL EXPOSED METAL

0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND

NON-SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)
SOLDER MASK DETAILS
15.000

4220763/A 05/2022
NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
DB0016A SSOP - 2 mm max height
SMALL OUTLINE PACKAGE

16X (1.85) SYMM

(R0.05) TYP
1
16X (0.45) 16

SYMM

14X (0.65)

8 9

(7)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE: 10X

4220763/A 05/2022
NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.

www.ti.com
 GENERIC PACKAGE VIEW
FK 20 LCCC - 2.03 mm max height
8.89 x 8.89, 1.27 mm pitch LEADLESS CERAMIC CHIP CARRIER

This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.

4229370\/A\

www.ti.com
 PACKAGE OUTLINE
PW0016A SCALE 2.500
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

SEATING
PLANE
6.6 C
TYP
A 6.2
0.1 C
PIN 1 INDEX AREA
14X 0.65
16
1

2X
5.1 4.55
4.9
NOTE 3

4X (0 -12 )

8
9
0.30
4.5 16X 1.2 MAX
B 0.17
4.3
NOTE 4 0.1 C A B

(0.15) TYP
SEE DETAIL A

0.25
GAGE PLANE
0.15
0.05

0.75
0.50
0 -8
DETAIL A
A 20

TYPICAL

4220204/B 12/2023

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.

www.ti.com
 EXAMPLE BOARD LAYOUT
PW0016A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

16X (1.5) SYMM

(R0.05) TYP
1
16X (0.45) 16

SYMM

14X (0.65)

8 9

(5.8)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE: 10X

SOLDER MASK METAL UNDER SOLDER MASK

METAL SOLDER MASK OPENING
OPENING

EXPOSED METAL EXPOSED METAL

0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND

NON-SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED) SOLDER MASK DETAILS
15.000

4220204/B 12/2023
NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
PW0016A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

16X (1.5) SYMM

(R0.05) TYP
1
16X (0.45) 16

SYMM

14X (0.65)

8 9

(5.8)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE: 10X

4220204/B 12/2023
NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

www.ti.com
 IMPORTANT NOTICE AND DISCLAIMER
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DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
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