DISCRETE SEMICONDUCTORS

DATA SHEET
dbook, halfpage

M3D088

BAS116 Low-leakage diode

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Product data sheet

Low-leakage diode
FEATURES Plastic SMD package Low leakage current: typ. 3 pA Switching time: typ. 0.8 s Continuous reverse voltage: max. 75 V Repetitive peak reverse voltage: max. 85 V Repetitive peak forward current: max. 500 mA.
lumns

BAS116
PINNING PIN 1 2 3 DESCRIPTION anode not connected cathode

APPLICATION Low leakage current applications in surface mounted circuits. DESCRIPTION Epitaxial medium-speed switching diode with a low leakage current in a small SOT23 plastic SMD package.
Top view
Marking code: JVp = made in Hong Kong; JVt = made in Malaysia; JVW = Made in China.

2 n.c. 3 3

MAM106

Fig.1

Simplified outline (SOT23) and symbol.

ORDERING INFORMATION PACKAGE TYPE NUMBER NAME BAS116 DESCRIPTION plastic surface mounted package; 3 leads VERSION SOT23

LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VRRM VR IF IFRM IFSM PARAMETER repetitive peak reverse voltage continuous reverse voltage continuous forward current repetitive peak forward current non-repetitive peak forward current square wave; Tj = 25 C prior to surge; see Fig.4 tp = 1 s tp = 1 ms tp = 1 s Ptot Tstg Tj total power dissipation storage temperature junction temperature Tamb = 25 C; note 1 65 4 1 0.5 250 +150 150 A A A mW C C see Fig.2; note 1 CONDITIONS MIN. MAX. 85 75 215 500 UNIT V V mA mA

Note 1. Device mounted on an FR4 printed-circuit board. 2003 Dec 12 2

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Product data sheet

Low-leakage diode
ELECTRICAL CHARACTERISTICS Tj = 25 C unless otherwise specified. SYMBOL VF PARAMETER forward voltage see Fig.3 IF = 1 mA IF = 10 mA IF = 50 mA IF = 150 mA IR reverse current see Fig.5 VR = 75 V VR = 75 V; Tj = 150 C Cd trr diode capacitance reverse recovery time f = 1 MHz; VR = 0; see Fig.6 when switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA; see Fig.7 CONDITIONS TYP.

BAS116

MAX. 0.9 1 1 .1 1. 25

UNIT V V V V nA nA pF s

0.003 5 3 2 0.8 80 3

THERMAL CHARACTERISTICS SYMBOL Rth(j-tp) Rth(j-a) Note 1. Device mounted on an FR4 printed-circuit board. PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient note 1 CONDITIONS VALUE 330 500 UNIT K/W K/W

2003 Dec 12

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Product data sheet

Low-leakage diode
GRAPHICAL DATA
MLB755

BAS116

handbook, halfpage

300

handbook, halfpage

300

MLB752 - 1

IF (mA) 200

IF (mA) 200
(1) (2) (3)

100

100

0 0 100 T amb ( oC) 200

0 0 0.4 0.8 1.2 V F (V) 1.6

Device mounted on an FR4 printed-circuit board.

(1) Tj = 150 C; typical values. (2) Tj = 25 C; typical values. (3) Tj = 25 C; maximum values.

Fig.2

Maximum permissible continuous forward current as a function of ambient temperature.

Fig.3

Forward current as a function of forward voltage.

102 handbook, full pagewidth IFSM (A)

MBG704

10

101 1 10

102

103

tp (s)

104

Based on square wave currents; Tj = 25 C prior to surge.

Fig.4 Maximum permissible non-repetitive peak forward current as a function of pulse duration.

2003 Dec 12

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Product data sheet

Low-leakage diode

BAS116

102 IR (nA) 10
(1)

mlb754

handbook, halfpage

MBG526

Cd (pF)

1
101

102

(2)

103

0
0 50 100 150 Tj (C) 200

10

15

VR (V)

20

(1) Maximum values. (2) Typical values. VR = 75 V.

f = 1 MHz; Tj = 25 C.

Fig.5

Reverse current as a function of junction temperature.

Fig.6

Diode capacitance as a function of reverse voltage; typical values.

handbook, full pagewidth

tr D.U.T. 10% SAMPLING OSCILLOSCOPE R i = 50 VR 90%

tp t

R = 50 S V = VR I F x R S

IF

IF

t rr t

(1)

MGA881

input signal

output signal

(1) IR = 1 mA.

Fig.7 Reverse recovery time test circuit and waveforms.

2003 Dec 12

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Product data sheet

Low-leakage diode
PACKAGE OUTLINE
Plastic surface-mounted package; 3 leads

BAS116

SOT23

HE

v M A

Q A A1

1
e1 e bp

2
w M B detail X Lp

1 scale

2 mm

DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.9 A1 max. 0.1 bp 0.48 0.38 c 0.15 0.09 D 3.0 2.8 E 1.4 1.2 e 1.9 e1 0.95 HE 2.5 2.1 Lp 0.45 0.15 Q 0.55 0.45 v 0.2 w 0.1

OUTLINE VERSION SOT23

REFERENCES IEC JEDEC TO-236AB JEITA

EUROPEAN PROJECTION

ISSUE DATE 04-11-04 06-03-16

2003 Dec 12

NXP Semiconductors

Product data sheet

Low-leakage diode
DATA SHEET STATUS DOCUMENT STATUS(1) Objective data sheet Preliminary data sheet Product data sheet Notes 1. Please consult the most recently issued document before initiating or completing a design. PRODUCT STATUS(2) Development Qualification Production DEFINITION

BAS116

This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.

2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions 2003 Dec 12 7 above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

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Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version.

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NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands R76/04/pp8 Date of release: 2003 Dec 12 Document order number: 9397 750 12391