3d ic technology
By: VIVEK. BANDI
21X01A0489
Ece-B
CONTENT
S
Introduction
Background
Limitation of 2D IC Performance
3D Architecture
Technology used to build 3D ICs
Advantages of 3D IC
Characteristics
Challenges in 3D Circuit
Conclusion
Key Points
Introduction/Definition
A three-dimensional Integrated Circuit(3D IC) is a chip in which two
or more layers of active electronic components are integrated both
vertically and horizontally into a single circuit.
Fig:Schematic diagram of 3D integrated circuit.
Background
Integrated circuits were first invented in the 1950,
3D IC chip commercially used first back in 2004, psp
3D ICs was a great mutation to decrease the total area of the
Integrated Circuit
Improvements on 3D IC technology are expected to
dramatically enhance the
• Performance
• Functionality
• Device packaging density for micro-electro-mechanical
systems(MEMS) application
Limitation of 2D IC Performance
Complexity of the chip Design
Moore’s Law says that the number of transistors on a
microchip will double roughly every year
Integrated circuits are hitting hard physical limits
Losses within large interconnection
3D Architecture
Earliest known architect design of
the 3D IC Fabrication
Three-dimensional
integration to create multilayer
Concept for developing 3D IC
Three-dimensional integration to create multilayer Si ICs is a
concept that can significantly improve interconnect
performance,
• Increase transistor packing density
• Reduce chip area and power dissipation
3D ICs can be very effective large scale on chip integration of
different system.
In 3D design architecture, an entire 2D chips is divided into a
number of blocks in placed on separate layers of Si stocked on
top of eachother.
Each Si layer in 3D structure can have multiple layer of
interconnects
Technology Used to Build 3D ICs
DIE ON
DIE
The electronic components are built on multiple dies,
these dies are aligned and bonded together
An advantage is that each component die can be tested first
Advantages of 3D IC
The 3D architecture offers extra flexibility in system design
The 3D chip design technology can be exploited to build SoCs
by placing circuits with different voltage and performance
requirements in different layers
3D integration can be reduce the amount of wiring you use
• Reducing capacitances
• Power dissipation
• Chip area improves performance
Less Complex and more cost effective.
Characteristics of 3D IC Performance
Time
Energy
Challenges in 3D IC
Design challenges
Thermal issues
TSV induced overheads
Cross talk between layers
CONCLUSION
Over all, 3D integration is a significant development
which have a major impact on how future electronic
systems are designed and used.
References
Topol, A. W., Tulpe, L., Shi, L., Frank, D., Bernstein, K., &
Young, A. M. IBM Research group (2016, September).
Three-Dimensional Integrated Circuit. Retrieved April 4, 2020,
from https://signallake.com/innovation/topol.pdf
https://www.sciencedirect.com/topics/engineering/three-dime
nsional-integrated-circuits
https://gcn.com/articles/2020/01/06/2d-3d-integrated-circuits.
aspx
https://www.seminarsonly.com/electronics/3-%20D%20ICs.php
https://www.slideshare.net/mufeedulislam/3d-integrated-circui
ts
Key Points
Design: 3D IC technology allows for design flexibility for
innovators.
Functionality: Key process technology element being
optimized for the 3D IC enables the implementation of design
flexibility.
Device Packaging density: Active devices can be stacked
and size of chip footprint can be reduced which adds
dimension to the conventional 2D device layout.
Chip Performance: 3D technology enables the memory
arrays to be placed above or under logic circuitry, resulting in
an increased bandwidth.
Wafer-scale fabrication: A wafer-level stacking of 3D ICs
potentially enables a more cost-effective solution than the
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