Unit Three : Maintain/repair the unit

This learning guide is developed to provide you the

necessary information regarding the following
content coverage and topics:
• Using Personal protective equipment’s.
• Following electro-static discharge (ESD) protection
procedure.
• Replacing defective parts/components.
• Soldering, mounting and repairing parts/components.
• Performing control settings/adjustments.
• Performing repair activity
• Observing care and extreme precaution the unit/product
• Performed Cleaning of units.
 Common Personal Protective
Equipment (PPE)
• During diagnose and troubleshoot Mechatronics
system, the following Personal Protective
Equipment or PPE are most commonly used.
• Safety hat
• Safety shoes
• Ear muffs
• Goggles
• Mask
• Gloves
• Safety belt/Harness
Fig . PPE
 If technicians not use appropriate PPE

• The followings are some of the main risks of not using

appropriate personal protective equipment:
• The lungs will be affected, example, from breathing in
contaminated air
• The head and feet will be affected, example from falling
materials
• The eyes, example from flying particles or splashes of
corrosive liquids
• The skin will affected, example from contact with
corrosive materials
• The body will affected, example from extremes of heat
or cold.
 Electrostatically Sensitive Devices (ESD)

• What is ESD?
• Static charge is an unbalanced electrical charge at rest.
Typically, it is created by insulator surfaces rubbing
together or pulling apart. One surface gains electrons,
while the other surface loses electrons. This results in
an unbalanced electrical condition known as static
charge. When a static charge moves from one surface
to another, it becomes ESD. ESD can occur in any one
of four different ways: a charged body can touch an IC,
a charged IC can touch a grounded surface, a charged
machine can touch an IC, or an electrostatic field can
induce a voltage across a dielectric sufficient to break
it down.
 Electrostatically Sensitive Devices Stress Models

ESD can have serious detrimental effects on all

semiconductor ICs and the system that contains
them. Standards are developed to enhance the
quality and reliability of ICs by ensuring all
devices employed have undergone proper ESD
design and testing, thereby, minimizing the
detrimental effects of ESD. Three major stress
methods are widely used in the industry today
to describe uniform methods for establishing
ESD withstand thresholds (highest passing
level).
• Integrated circuits (IC) & some field-effect
transistors are examples of ESD devices. These
components can be easily damaged by static
electricity. There are several techniques which
can reduce the incidence of component
damage, caused by static electricity.
• Immediately, before handling any ESD devices
drain the electrostatic charge from your body by
touching a known earth ground.
• Store ESD devices in conductive foam pad until
installation in circuit.
• Wear a grounding strap, attached to your wrist.
 Replacing defective parts/components.

• Troubleshooting and repairing Microwave can be easy but you will get
frustrated if you could not locate the spare parts. Sometimes the repair job
can be done in few minutes. However, when finding the original parts, you
may end up spending more time to locate the parts than when you do the
repair work on SMPS. In order to make things easier, You may visit the blog at
http://www.JestineYong.com under the category of Electronic suppliers to get
the components you want.
• If possible, get back the same part number to avoid repeating failure in SMPS
that you have repaired and also to maintain the specifications within
acceptable limits with respect to line isolation and to minimize fire hazards.
However, if you still could not get the exact replacement parts for substitution
please refer to any semiconductor data books to search for replacement.
• In data books there would be suggestions as to which part numbers are
suitable for replacement. This kind of data book is a must for anyone who
works in electronic repair line. Apart from that, you could also find your own
replacement by comparing the specification between the original and the
replacement transistor.
Figure2.1 Semiconductor Replacement data book
 Location and the type of faulty component
• Once the fault location and the type of faulty component is
identified in the fault diagnosis section, obviously the next task is
to correct (trouble shoot) it. It is act of connecting the
disconnecting circuit or replacing the faulted component with the
same type, rate and size components. The selection of
components according to their correct specification and soldering
skill are determining factor for the replacement is effective.
A. To replace the defective component:
• Prepare soldering tools and equipment’s, new component to be
replaced
• Remove the defective one by applying correct disordering
technique.
• Put in place the new component in the correct direction (keep
correct polarity)
• Solder it by applying good soldering technique
 B. Safety
• Take care of not to touch high voltage side
• Wear apron, Glove, safety shoe
• Follow all cautions, warnings, and instructions
marked on the equipment.
• Ensure that the voltage and frequency rating of
the power outlet matches the electrical rating
labels on the system.
• Use properly grounded power outlets.
• Disconnect the power before you replace/repair
the faulty device
• Discharge capacitor first before replacing it.
 3.4. Soldering, mounting and repairing
parts/components.
• There are two basic forms of electronic
component construction, those with leads for
through-hole mounting and those for surface
mounting. Through-hole mounting gives a very
rugged construction and uses well established
soldering methods. Surface mounting has the
advantages of high packing density plus high-
speed automated assembly. With all
components, excessive forces or heat can cause
serious damage and should always be avoided.
 3.4.1. Soldering
• Avoid any force on the body or leads during or immediately after
soldering
• Do not correct the position of an already soldered device by
pushing, pulling or twisting the body
• Avoid fast cooling after soldering
• The maximum allowable soldering time is determined by:
• Package type
• Mounting environment
• Soldering method
• Soldering temperature
• Distance between the point of soldering and the seal of the
component body
The maximum permissible temperature of the solder is 260 °C; this
temperature must not be in contact with the joint for more than 5s.
The total contact time of successive solder waves must not exceed
5s.
 3.4.2. Mounting
• If the rules for handling and soldering are observed,
the following mounting or process methods are
allowed:
• Preheating of the printed-wiring board before soldering
up to a maximum of 100 °C
• Flat mounting with the diode body in direct contact
with the printed-wiring board with or without metal
tracks on both sides and/or plated-through holes
• Flat mounting with the diode body in direct contact
with hot spots or hot tracks during soldering
• Upright mounting with the diode body in direct contact
with the printed-wiring board if the body is not in
contact with metal tracks or plated-through holes
 3.4.3. Repairing soldered joints
• Apply the soldering iron to the component pin(s) below
the seating plane, or not more than 2 mm above it. If the
temperature of the soldering iron bit is below 300 °C, it
may remain in contact for up to 10s. If it is over 300 °C
but below 400 °C, it may only remain in contact for up to
5s.
3.4.4. Surface mount devices (SMDs)
• Since the introduction of surface mount devices (SMDs),
component design and manufacturing techniques have
changed almost beyond recognition. Smaller pitch,
minimum footprint area and reduced component volume
all contribute to a more compact circuit assembly.
Consequently, when designing PCBs, the dimensions of
the footprints are perhaps more crucial than ever before.
• One of the first steps in this design process is to consider which
soldering method, either wave or reflow, will be used during
production. This determines not only the solder footprint
dimensions, but also the minimum spacing between
components, the available area underneath the component
where tracks may be laid, and possibly the required component
orientation during soldering.
• Although reflow soldering is recommended for SMDs, many
manufacturers use, and will continue to use for some time to
come, a mixture of surface-mount and through-hole components
on one substrate (a mixed print).
• The mix of components affects the soldering methods that can
be applied. A substrate having SMDs mounted on one or both
sides, but no through-hole components is likely to be suitable for
reflow or wave soldering. A double-sided mixed print that has
through-hole components and
• some SMDs on one side and densely packed SMDs
on the other normally undergoes a sequential
combination of reflow and wave soldering. When
the mixed print has only through-hole
components on one side and all SMDs on the
other, wave soldering is usually applied.
• To help with your circuit board design, this
guideline gives an overview of both reflow and
wave soldering methods and is followed by some
useful hints on hand soldering for repair purposes,
and the recommended footprints for SMD discrete
semiconductor packages.
 3.4.5. Reflow soldering process
• There are three basic process steps for single-
sided PCB reflow soldering, these are:
• Applying solder paste to the PCB
• Component placement
• Reflow soldering.
 3.5. Performing control settings/adjustments.

3.5.1. Switching On the Appliance for the First Time

A. Setting the Clock: after connecting your appliance or after an extended
power outage, 12:00 will flash on the display. Set the time of day.
• Confirm each setting by pressing the KNOB. The oven will also work if the
clock is not set. However, timer functions are not available in this case (see
chapter
B. Setting the Timer Functions.
• After a few minutes of idling, the appliance will switch to standby mode.
C. Changing The Clock Setting : Clock settings may be changed when no
timer function is activated
D. Selecting The Language: If you are not happy with the language in
which the messages on the display are presented, select another one.
English is the preset language. Rotate the KNOB and select your
language from the list. CONFIRM the selection. The main menu will
appeal
 I. Automatic mode
• In this mode, first select the type of food. This is
followed by automatic setting of the quantity, level
of doneness, and cooking end time. The program
offers a large choice of preset recipes reviewed by
professional chefs and nutrition experts.
II. Microwaves
• This mode is suitable for cooking, roasting, and
defrosting of food.
III. Professional mode
• Use this mode when you wish to prepare any type
and amount of food. All settings are selected by the
user.
 3.5.2. Cooking By Selecting The Type Of
Food (Auto Mode)
• Confirm each setting by pressing the KNOB.
• Rotate the KNOB and select the Auto mode. C
• Confirm the setting by pressing on the KNOB.
• Select the type of food and the dish.
• Confirm the selection.
• Preset values will appear.
• Rotate the KNOB and confirm by pressing the
KNOB to change these settings
 3.6. Performing repair activity

3.6.1 Routine Repairing Activity

• The maintenance required by a drying oven is
simple and no complex routine maintenance is
necessary. General maintenance routines to
carry as necessary are described next. The
procedures vary depending on the type of oven
and designs from diff erent manufacturers.
Warning: Before carrying out any maintenance
routine on the oven, verify that it is at room
temperature and disconnected from the
electrical feed outlet.
• Access to electronic components Frequency:
Whenever necessary The oven’s electronic
components are usually located in its lower part.
• In order to be able to check them, proceed as
follows:
1. Disconnect the oven from the electrical feed outlet.
2. Move the oven forward until the front part of the
base is aligned with the edge of the working space.
3. Place two wedges of approximately 3 cm in thickness
below each front support. This will elevate the front
part of the oven and facilitate the inspection of
electronic elements once the lower cover is removed.
4. Remove the screws securing the lower cover and lift
it. Next, check the electronic control components.
• In general, the following elements are located in this
compartment.
– The programmable control panel
– A safety release
– The main switch and circuit breaker (combined)
5. Replace the cover once checking has been completed.
 Changing of the heating resistors Frequency:
Whenever necessary The procedure explained next must
be performed by personnel with a good knowledge of
electricity.
1. Disconnect the oven from the electrical feed outlet.
2. Remove the thermometer from the upper part of the
chamber.
3. Open the door and remove the shelves.
4. Disconnect the thermometer’s probe.
5. Remove the screws that secure the lower panel.
6. Remove the lower panel.
7. Remove the screws that secure the resistor’s
electrical feed cables and disconnect the terminals
fastening these to the resistors.
8. Remove the screws that secure the resistors as
well as the external resistors.
9. Install new resistors with the same characteristics
as the originals.
10. Reinstall the parts and reconnect the electrical
components.
B. Changing the cooling ventilator Frequency:
• Whenever necessary To change the cooling ventilator (generally
located in the lower part), these procedures must be followed:
• 1. Proceed as explained for opening the electronic compartment.
• 2. Disconnect the ventilator’s electrical feed terminals.
• 3. Undo the screws that secure the ventilator.
• 4. Install a ventilator with the same specifi cations as the
original; connect the wires feeding the ventilator to the
terminals.
• 5. Replace the protective cover.
• C. Changing of the door gasket Frequency:
• Whenever necessary The door’s gasket is usually made of
silicone.
• 1. Turn off the oven and open the door.
• 2. Loosen the safety devices that keep the gasket
in place.
• 3. Remove the gasket using a screwdriver for
disengaging it from the retention guide. Avoid
using excessive force which can distort the
housing.
• 4. Install the replacement gasket starting from
the upper part. Next, move the rest of the gasket
towards the sides, securing it with the assembly
elements which fasten it to the door. Finish the
procedures on the lower part of the door in the
same fashion.
A. Changing of the thermocouple Frequency:
• Whenever necessary
• 1. Open the electronic control compartment.
• 2. Remove the thermocouple’s connecting cables
from their connection points on the control card.
• 3. Loosen the thermocouple assembly from the
upper part of the oven. Move it towards the front
part until a free length of at least 15 cm of
connector cable is left exposed.
• 4. Cut the cable from the thermocouple to remove
its wrapping. 5. Secure the cut ends of the
defective thermocouple with the cables from the
replace
 3.7.1. Precautions for Safe Use to
Excessive Microwave Energy

A. DO NOT Attempt to Operate This Oven With:

• Object Caught in Door.
• Door That Does Not Close Properly.
• Damaged Door, Hinge, Latch, or Sealing Surface
 3.8. Performing Cleaning of units.

3.8.1. Procedure of Cleaning and Care

• Turn off the oven and unplug the power cord from the wall when
cleaning.
• Keep the inside of the oven clean. When food splatters or spilled
liquids adhere to oven walls, wipe with a damp cloth. Mild
detergents may be used if the oven gets very dirty. Avoid using
spray or other harsh cleaners. They may stain, streak or dull the
door surface.
• The outside of the oven should be cleaned with a damp cloth. To
prevent damage to the operating parts inside the oven, water
should not be allowed to seep into the ventilation openings.
• Wipe the door and window on both sides, the door seals and
adjacent parts frequently with a damp cloth to remove any spills
or spatters. Do not use abrasive cleaner.
• A steam cleaner is not be used.
• Do not allow the control panel to become wet.
Clean with a soft, damp cloth. When cleaning the
control panel, leave oven door open to prevent
oven from accidentally turning on.
• If steam accumulates inside or around the outside
of the oven door, wipe with a soft cloth. This may
occur when the microwave oven is operated
under high humidity condition. And it is normal.
• It is occasionally necessary to remove the glass
tray for cleaning. Wash the tray in warm sudsy
water or in a dishwasher.
• The roller ring and oven floor should be cleaned regularly to
avoid excessive noise. Simply wipe the bottom surface of
the oven with mild detergent. The roller ring may be washed
in mild, soapy water or in a dishwasher. When removing the
roller ring, be sure to replace it in the proper position.
• Remove odors from your oven by combining a cup of water
with the juice and skin of one lemon in a microwaveable
bowl. Microwave for 5 minutes. Wipe thoroughly and dry
with a soft cloth.
• If the light bulb burns out, please contact customer service
to have it replaced.
• The oven should be cleaned regularly and any food deposits
should be removed. Failure to maintain the oven in a clean
condition could lead to deterioration of surface that could
adversely affect the life of the unit and could possibly result