University of Bahrain

Course: Manufacturing Processes (MENG 312)

Outline:
• Mechanical Energy Processes
• Electrochemical Machining Processes
• Thermal Energy Processes
• Chemical Machining

Non-Traditional Machining
Processes
Instructor: Prof. Dr. G. Hussain

Department of Mechanical Engineering

Nontraditional Processes Defined
A group of processes that remove excess
material by various techniques involving
mechanical, thermal, electrical, or chemical
energy (or combinations of these energies)
 They do not use a sharp cutting tool in the
conventional sense
Classification of Nontraditional Cutting Processes
 Mechanical ‑ typical form of mechanical action
is erosion of work material by a high velocity
stream of abrasives or fluid (or both)
 Electrical ‑ electrochemical energy to remove
material (reverse of electroplating)
 Thermal – thermal energy usually applied to
small portion of work surface, causing that
portion to be fused and/or vaporized
 Chemical – chemical etchants selectively
remove material from portions of workpart,
while other portions are protected by a mask
 Mechanical Energy Processes
 Ultrasonic machining
 Water jet cutting
 Abrasive water jet cutting
 Abrasive jet machining
 Ultrasonic Machining (USM)
Abrasives contained in a slurry are driven at high velocity against
work by a tool vibrating at low amplitude (0.075mm) and high
frequency (larger than 20 KHZ)
 Tool oscillation is perpendicular to work surface
 Abrasives accomplish material removal
20-60%
 Tool is fed slowly into work
abrasive in
 Shape of tool is water
formed into part
Flow of slurry is
continuous?
To replace the
dull abrasive with
the fresh and to
https://www.youtube.com/watch?v=5w6szZtOg5w
remove chips
 Ultrasonic Machining
Tool materials: Soft steel and SS
Abrasive Materials: Boron Nitride, Boron Carbide, Al2O3, SiC & Diamond
Vibration Amplitude= Grit size
Tool/w.p Gap: > 2times of Grit Size
Smaller the grain size , better the surface finish
Abrasive action erodes both w/p & tool.
Stock removed to tool-wear ratio= 100:1
to 1:1 (glass to tool steel)
 USM Applications
 Hard, brittle work materials such as ceramics,
glass, and carbides
 Also successful on certain metals, such as
stainless steel and titanium
 Shapes include non-round holes
 “Coining operations” - pattern on tool is
imparted to a flat work surface
 Water Jet Cutting (WJC)
 Uses high pressure, high velocity stream of water
directed at work surface for cutting

Orifice size: Narrow for thin

sheets and larger for thick
sheets
-Larger orifice size produce
poor cutting surfaces
3.2mm

https://www.youtube.com/watch?v=VLsO3U6yjfI
https://www.youtube.com/watch?v=XfGkLsUm92Q
https://youtu.be/5w6szZtOg5w
 WJC Applications
 Usually automated by CNC or industrial
robots to manipulate nozzle along desired
trajectory
 Used to cut narrow slits in flat stock such as
plastic, textiles, composites, floor tile,
carpet, leather, and cardboard
 WJC Advantages
 No crushing or burning of work surface
 Minimum material loss
 No environmental pollution
 Ease of automation
Abrasive Water Jet Cutting (AWJC)
 When WJC is used on metals, abrasive
particles must be added to jet stream usually
 Additional process parameters: abrasive type,
grit size, and flow rate
 Abrasives: aluminum oxide, silicon dioxide,
and garnet (a silicate mineral)
 Grit sizes range between 60 and 120
 Grits added to water stream at about 0.25
kg/min (0.5 lb/min) after it exits nozzle
 Abrasive Jet Machining (AJM)
 High velocity stream of gas containing small
abrasive particles
 AJM Application Notes
 Usually performed manually by operator who
directs nozzle
 Normally used as a finishing process rather
than cutting process
 Applications: deburring, trimming and
deflashing, cleaning, and polishing
 Work materials: metal, thin flat stock of hard,
brittle materials (e.g., glass, silicon, mica,
ceramics)
 Good for imparting compressive stresses onto
the metal surface (process called shot blasting)
Electrochemical Machining Processes
 Electrical energy used in combination with
chemical reactions to remove material
 Reverse of electroplating
 Work material must be a conductor
 Processes:
 Electrochemical milling (ECM)
 Electrochemical grinding (ECG)
 Electrochemical Milling (ECM)
Material removal by anodic dissolution (disintegration),
using electrode (tool) in close proximity to work but
separated by a rapidly flowing electrolyte

RMR : Higher current density, Higher will be RMR

Feed rate: CI/A; I is current; A is x-sectional area
of electrode; C is specific removal rate (material
dependent)
Tm = l/fr
V- Volume removed
g- gap
r- Resistivity of electrolyte
E- Voltage
t- time
Why is tool insulated?
Tool/work Gap= 0.075- 0.75mm
Large Gap?
Small Gap?
 ECM Operation
Material is removed from anode workpiece
(positive pole) and transported to a cathode tool
(negative pole) in an electrolyte bath
 Electrolyte flows rapidly between two poles to
carry off removed material, so it does not
deposit onto tool
 Electrolyte Solution: Water with NaCl or NaNO3
 Electrode materials: Cu, brass, or stainless steel
 Tool has inverse shape of part
 Tool size and work shape must allow for the
gap
 ECM: Applications
Applications:
- Used when work material is very hard and difficult to machine by
conventional machining methods
- Hardness does not matter, as metal removal is not mechanical
- Irregular shape and contours (dies, tools, molds), multiple hole
drilling, irregular hole drilling
Advantages:
- Little surface damage to work
- No burrs on part as in conventional machining
- Low tool wear & relatively high RMR for hard metals
Disadvantages:
- High power consumption
- Electrolytic sludge is hazardous
 Electrochemical Grinding (ECG)
 Special form of ECM in which grinding wheel
with conductive bond material augments anodic
dissolution/breaking of metal part surface
Applications and Advantages of ECG
 Applications:
 Sharpening of cemented carbide tools
 Grinding of surgical needles, thin wall
tubes, and fragile parts
 Advantages:
 De-plating responsible for 95% of metal
removal
 Because machining is done mostly by
electrochemical action, grinding wheel
lasts much longer
 Higher grinding ratio (MR-WP/MR-GW)
Example
 Problem
The frontal working area of the electrode in an ECM operation is 2000 mm2. The applied
current = 1800 amps and the voltage = 12 volts. The material being cut is nickel (valence = 2),
whose specific removal rate is 3.42 x 10-2 mm3/A-s)
(a)If the process is 90% efficient, determine the rate of metal removal in mm3/min.
(b)If the resistivity of the electrolyte = 140 ohm-mm, determine the working gap

Solution:
(a) RMR = frA = (CI/A)A = CI = (3.42 x 10-2 mm3/A-s)(1800 A)
= 6156 x 10-2 mm3/s = 61.56 mm3/s = 3693.6 mm3/min
At 90% efficiency RMR = 0.9(3693.6 mm3/min) = 3324.2 mm3/min
(b)
fr = CE/gr ; CI/A=CE/gr ; g = AE/Ir = (12 V)(2000 mm2)/(1800 A)(140 ohm-mm) = 0.095 mm
Thermal Energy Processes - Overview
 Very high local temperatures
 Material is removed by fusion or
vaporization
 Physical and metallurgical damage to the new
work surface
 In some cases, resulting finish is so poor that
subsequent machining is required
 Thermal Energy Processes
 Electric discharge machining
 Electric discharge wire cutting
 Electron beam machining
 Laser beam machining
 Plasma arc machining
 Conventional thermal cutting processes??
 Electric Discharge Processes
Metal removal by a series of discrete electrical
discharges (sparks) causing localized
temperatures high enough to melt or vaporize
the metal
 Can be used only on electrically conducting
work materials
 Two main processes:
1. Electric discharge machining
2. Wire electric discharge machining
 Electric Discharge Machining (EDM)
Tool electrode: Cu, Brass, Graphite, Tungsten
Current: Dc pulsating or DC OR AC
Dielectric fluid: ionized water, kerosene oil

Difference between electrolyte and di-electric fluid?

Electric discharge machining (EDM): (a) overall setup, and (b) close‑up
view of gap, showing discharge and metal removal.
 EDM Operation
 One of the most widely used nontraditional processes
 Shape of finished work surface produced by a shape of
electrode tool
 Sparks occur across a small gap between tool and work
 Requires dielectric fluid, which creates a path for each
discharge as fluid becomes ionized in the gap
Frequency means sparking per sec
 Work Materials in EDM
 Work materials must be electrically
conducting
 Hardness and strength of work material
are not factors in EDM
 Material removal rate depends on melting
point of work material & Current
 EDM Applications
 Tooling for many mechanical processes:
molds for plastic injection molding, extrusion
dies, wire drawing dies, forging and heading
dies, and sheet-metal stamping dies
 Production parts: delicate parts not rigid
enough to withstand conventional cutting
forces, hole drilling where hole axis is at an
acute angle to surface, and machining of hard
and exotic metals
 Example
-

K: 664
 Wire EDM

 Special form of EDM uses small diameter

wire as electrode to cut a narrow kerf in work
 Operation of Wire EDM
 Work is fed slowly past wire along desired
cutting path, like a bandsaw operation
 CNC used for motion control
 Dielectric required, using nozzles directed at
tool‑work interface or submerging workpart
Example

= 49.4 mm3/min
 Electron Beam Machining (EBM)
 Uses high velocity stream of electrons
focused on workpiece surface to remove
material by melting and vaporization
W

Difference between beam and arc? 0.025 mm dia

EBM Operation
 EBM Applications
 Works on any material
 Ideal for micromachining
 Drilling small diameter holes ‑ down to 0.05
mm (0.002 in)
 Cutting slots only about 0.025 mm (0.001
in.) wide
 Drilling holes with very high depth‑to‑diameter
ratios
 Ratios greater than 100:1
 Laser Beam Machining (LBM)
 Uses the light energy from a laser to remove
material by vaporization and ablation

Laser: light amplification by stimulated

emission of radiations.
Electrical energy is converted into
coherent light beam
Laser light is monochromatic (one
wavelength) and highly collimated (rays
are parallel)
 LBM Applications
 Drilling, slitting, slotting, scribing, and marking
operations
 Drilling small diameter holes ‑ down to 0.025
mm (0.001 in)
 Generally used on thin stock
 Work materials: metals with high hardness
and strength, soft metals, ceramics, glass and
glass epoxy, plastics, rubber, cloth, and wood
Shortcoming: Laser reflects from AL plate
Laser beam cutting
operation performed
on sheet metal
 Plasma Arc Cutting (PAC)
 Uses plasma stream operating at very high
temperatures to cut metal by melting
Plasma = a superheated, electrically ionized
gas

Primary Gas: Used for

generating plasma. H2, Argon,
N2 or Mixture of these
Secondary Gas: Used for surrounding
plasma jet to help confine the arc and
clean the kerf
Electrode: Tungsten can be changed with
graphite; air can be used as secondary gas.
This process is called Gouging, used to
prepare plates edges for welding
 Operation of PAC
 PAC temperatures: >20000 C
 Plasma arc generated between electrode in
torch and anode workpiece
 The plasma flows through water‑cooled
nozzle that constricts and directs stream to
desired location
 Used for cutting plain C steels, SS and Al
metals. This is especially used for metals
oxide layer (2000 +) with oxide layer on surface (such as Al,
SS)
AL (600 C)
 Chemical Machining (CHM)
Material removal through contact with a strong
chemical etchant
 Processes include:
 Chemical milling
 Chemical blanking
 Chemical engraving
 Photochemical machining
 All utilize the same mechanism of material
removal
 Steps in Chemical Machining
1. Cleaning ‑ to ensure uniform etching
2. Masking ‑ a maskant (resist, chemically
resistant to etchant) is applied to portions of
work surface not to be etched
3. Etching ‑ part is immersed in etchant which
chemically attacks those portions of work
surface that are not masked
4. Demasking ‑ maskant is removed
 Steps in Chemical Machining
Masking & Etching are 02 important steps:
1.Masking:
Masking Materials: PVC, Neoprene, Polyethylene and other polymers
Types of Masking Methods:
a.Cut & Peel: Dip metal in resist/maskant, coating, spraying. Use knife to
cut the area to be machined. Part accuracy: ±0.125mm, low production
rate; Large part size
b.Photographic Resist: Photographic techniques are used for masking. The
masking material used here contains photosensitive chemicals. They are
applied on the metal surface and exposed in light through negative image
of area to be etched. The desired area is then cut using photographic
developing techniques.
Part accuracy: ±0.025mm ; High production rates; for small part size
c. Screen Resist: Use silk screen to apply masking paint (like ink) on
the metal surface, not to be etched
 Etchants
Types of Etchants:
- Etchant selection depends on the work material, RMR.
-Etchant should match with masking material: etchant should not react with
mask
-Depth of cut: 0.5” to a few micron; not affected by surface area of work
-In addition to cutting depth of work, etchant also cause side cutting, called
undercut. Fe =d/u ; Fe is called etch factor, d is depth of cut and u is
undercut (Ref Fig)

Feed rate= Penetration rate

Edge of
Maskant
 CHM Processes: Chemical Milling

- Mask is applied by cut-peel methods

- As depth increases, surface finish reduces
- Finish varies from material to material
- Process is used to remove large amount of extra material from car body
panels and plane wings to reduce weight

Surface finish in Ch-Milling

 CHM Processes: Chemical Blanking

Fig. Sequence
of processing steps in
chemical blanking:
(1) Clean raw part;
(2) apply resist
(maskant)
by painting through
screen; (3) etch
(partially
completed); (4) etch
(completed); and
(5) remove resist and
clean
- Mask is applied by photo/screen resist to yield finished part.
- Used for thin sheets ( 0.025 to 0.75 mm) where mechanical methods can not
be applied or not economical
- Intricate cutting for small size parts, method is not used for large size parts
- Can cut brittle and hard metal where mechanical methods can not work
- Accuracy ( 0.025mm) reduces as thickness increases
 CHM Processes: Photochemical Machining

The process is same as

blanking and engraving, except
the masking method
Anisotropy: etch factor in PCM
is called anisotropy
i.e. d/u

Fig. Sequence of processing steps in photochemical machining: (1) Clean raw part; (2) apply
resist (maskant) by dipping, spraying, or painting; (3) place negative on resist; (4) expose to
ultraviolet light; (5) develop to remove resist from areas to be etched; (6) etch (shown partially
etched); (7) etch (completed); (8) remove resist and clean to yield finished part.
- Mask is applied by photoresist method.
- Used for thin sheets ( 0.025 to 0.75 mm) where mechanical methods can not be
applied or not economical
- Intricate cutting for small size parts, method is not used for large size parts
- Accuracy ( 0.025mm) reduces as thickness increases
- Stress free parts
 Problem
Chemical milling is used in an aircraft plant to create pockets in wing sections made of an
aluminum alloy. The starting thickness of one workpart of interest is 20 mm. A series of
rectangular-shaped pockets 12 mm deep are to be etched with dimensions 200 mm by 400
mm. The corners of each rectangle are radiused to 15 mm. The part is an aluminum alloy
and the etchant is NaOH. The penetration rate for this combination is 0.024 mm/min and
the etch factor is 1.75. Determine (a) metal removal rate in mm3 /min, (b) time required to
etch to the specified depth, and (c) required dimensions of the opening in the cut and peel
maskant to achieve the desired pocket size on the part.

Solution:
(a)Area A = 200 x 400 – (30 x 30 - π(15)^2 ) = 80,000 – 193 = 79,807 mm2 ; RMR =
(0.024 mm/min)(79,807 mm2 ) = 1915.4 mm3 /min
(b) Time to machine (etch) Tm = 12/0.024 = 500 min = 8.33 hr.
(c)Given Fe = 1.75, undercut u = d/Fe = 12/1.75 = 6.86 mm
Maskant opening length = L – 2u = 400 – 2(6.86) = 386.28 mm
Maskant opening width = W – 2u = 200 – 2(6.86) = 186.28 mm
Radius on corners = R – u = 15 – 6.86 = 8.14 mm
 Homework
Prob 26. 8, 26.10, 26.13, 26.18, 26.7-26.13, 26.18