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VLSI

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0% found this document useful (0 votes)
13 views13 pages

VLSI

Uploaded by

shouviksingh089
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPT, PDF, TXT or read online on Scribd
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PowerPoint Presentation

for
Six Months Industrial Training
in
Fundamentals of VLSI Chip Design

Submitted By –
Shouvik Singh
UNR Roll No.- 21305011

Under The Guidance Of -


Dr. Koushik Guha
HOD NIT Silchar

ELECTRONICS AND COMMUNICATION DEPARTMENT


BATCH : 2021 - 2025
VLSI Design
• What is VLSI?
– “Very Large Scale Integration”
– Defines integration level
– 1980s hold-over from outdated taxonomy for integration levels
• Obviously influenced from frequency bands, i.e. HF, VHF, UHF
– Sources disagree on what is measured (gates or transistors?)

• SSI – Small-Scale Integration (0-102)


• MSI – Medium-Scale Integration (102-103)
• LSI – Large-Scale Integration (103-105)
• VLSI – Very Large-Scale Integration (105-107)
• ULSI – Ultra Large-Scale Integration (>=107)
Integration Level Trends

Obligatory historical Moore’s law plot


Integrated Circuits/MEMs
• Today, VLSI refers to systems impl. w/integrated circuits
– Integrated circuit refers mostly to general manufacturing technique
• micro/nano-scale devices on a semiconductor (crystalline) substrate
• Formed using chemical/lithography processing

• What kind of devices / structures?


– transistors (bipolar, MOSFET)
– wires (interconnects and passive devices)
– diodes (junction, LEDs, VCSELs, MSM, photoconductor, PiN)
– MEMs (integration of piezoelectrics and mechanics based on static
electrical fields: accelerometers, gyroscopes, pressure sensors, micro-
mirrors)

• For CMOS digital design, we only use MOSFET transistors (used as


switches) and wires
Chips
• Integrated circuits consist of:
– A small square or rectangular “die”, < 1mm thick
• Small die: 1.5 mm x 1.5 mm => 2.25 mm2
• Large die: 15 mm x 15 mm => 225 mm2
– Larger die sizes mean:
• More logic, memory
• Less volume
• Less yield
– Dies are made from silicon (substrate)
• Substrate provides mechanical support and electrical common point
VLSI Design
• Draw polygons that represent layers deposited-on or infused-into the
substrate
– More of an art than science

Scale:
approximately
10 um x 10 um

• One 2-input NAND gate with 4 transistors


• Typical microprocessor contains 50 – 200 million transistors (10-50
million gates)
VLSI Design
• Manual layout design is obviously not practical
• Design complexity:
– Manually drawing layout for a billion transistors would take too long
– Even if we could…
• How to verify (test) designs for functionality, speed, power, etc.?
– Complexity scales faster than actual design
• How to reuse designs?
• How to create human-readable designs?
• How to speed-up design process?

• These problems form a great deal of work


– Electronic Design Automation (EDA)
– a.k.a. CAD
• Advancing EDA technology, fabrication technology, designs and microarchitectures,
and IP form bulk of work (and money) in the industry
EDA Tools
• Conclusion:
– This course is about using design tools to manage design complexity of
VLSI systems
– Only way to learn tools: practice and work with tools individually
– Must teach IC fundamentals, but prevent course from becoming
semiconductor theory, analog electronics, circuits, or digital logic
course
• Target large-scale integration and EDA
• Reach good balance between fundamental IC theory and automated large-
scale design methodology

• 80-90% of course time will be spent in lab


– Tutorials will provide basic knowledge
– Must learn the tools on your own (assisted by instructor)
Course Overview
• This course is called “Fundamentals of VLSI Chip Design”
• Focus on large-scale system design (CAD tools)
• CAD tools manage design and verification complexity

• What we have…
– Latest, most advanced CAD tools in the EDA industry
– Three primary players
• Synopsys, #258 ($1.2 billion revenue)
• Cadence Design Systems, #259 ($1.1 billion revenue)
• Mentor Graphics, ?
• Comparison: Microsoft #95 ($36.8 billion), Intel #102 ($34.2 billion)

– Fabrication award for 500 nm CMOS fabrication process


• AMI C5N process with academic design kit (NCSU CDK)
• 1.5 mm x 1.5 mm die size, multiple dies, packaging
EDA Tools
• Big companies, lots of money, 40 years of integrated circuit design
experience, conferences, journals, powerful PCs… what’s the
problem?

• IC CAD tools are difficult to use


– Written by electrical engineers (not professional programmers)
– Incredibly buggy
– Not documented
– Rely on ancient, outdated file formats for interoperability
– Still mostly rely on command-line interfaces
– Utilize outdated, primitive, buggy APIs for GUIs
– Inherently required to solve hard problems
• Place components, route wires
• Must utilize advanced heuristics that are only as good as fabrication process
technology information and user input (garbage-in, garbage-out)
EDA Tools
• Cadence tools
– “IC-Tools” => IC5141 package (Linux)
– Collection of tools managed by Design Framework II (dfII)
• Virtuoso schematic/layout editor
• Analog Environment
• Spectre simulator
• Diva DRC, EXT, LVS
• Other Cadence tools
– SignalStorm => TSI42 package (Linux)
– Abstract Generator => DSMSE54 (Solaris)
– First Encounter => SOC42 package (Linux)
• Synopsys
– Design Compiler (Linux)
• Mentor
– HDL Designer (Linux)
What EDA Tools Can Do
• Manual layout vs. EDA is like:
– Manual transmission vs. automatic transmission
– HTML programming vs. Frontpage
– Assembly code programming vs. compiled high-level language

• Manual layout for small, optimized designs will always be superior

• EDA techniques for larger-scale designs will always be superior


(verification, reusability, NRE, etc.)

• Goal: do careful, manual design of smaller components (cells) and


use EDA to combine them for large-scale design
What EDA Tools Can Do
• “My” Design Flow process
info, cell
Abstract Generation abstracts
Circuit Sim
Digital cell library Cadence AbGen
Cadence IC-Tools
design
Cadence IC-Tools Characterization char. info
Cadence SignalStorm

Design Standard Cell Library


Specification
Behavioral VHDL Synthesis
Design Place-and-Route
Synopsys Design
Mentor HDL Designer Analyzer Cadence First
VHDL Verilog
Encounter

Behavioral Simulation Cell Timing Simulation Interconnect Timing


Mentor ModelSim Simulation
Mentor ModelSim
Mentor ModelSim

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