High Thermal Conductivity Graphite Foam for Electronics by Alex DeTrana, Commercialization Manager
- 1. High Thermal Conductivity Graphite Foam for Electronics Presenter: Alex DeTrana Principal Investigator: James Klett, Ph.D. Commercialization Manager: Alex DeTrana
- 2. Technology Description • Foam made of pure carbon with unique characteristics – Surface area 100x greater than traditional heat exchangers – Weight 1/5 that of aluminum – Thermal conductivity 5x that of copper 2 Managed by UT-Battelle for the U.S. Department of Energy Presentation_name
- 3. Technology Opportunity • Material being manufactured by two companies • Material has been extensively tested and evaluated • Only remaining work is engineering for specific applications • Technology currently being deployed in a variety of applications: – Space radiator – LED cooling – Fluorescent cooling 3 Managed by UT-Battelle for the U.S. Department of Energy Presentation_name
- 4. Technology Leadership • Unique technology – Unmatched combination of surface area, thermal conductivity, and weight • Unique capabilities and characteristics – Very high thermal conductivity – Very low density – Very little thermal expansion – RF shielding – Sound insulation 4 Managed by UT-Battelle for the U.S. Department of Energy Presentation_name
- 5. Applications – Target Customers – Current Practice Application #1 Microprocessor 5 Managed by UT-Battelle Application Description Target Customers Current Practice cooling Computer component manufacturers for the U.S. Department of Energy Presentation_name Copper or aluminum heat sinks/heat pipes Application #2 Embassy secure communications American and foreign governments Complicated and expensive materials and anti-RF active technology
- 6. Competitive Differentiation Product Name Manufacturer Relevance Fan/heatsink combination 6 Managed by UT-Battelle Various Achieves similar result using a for the U.S. Department of Energy Presentation_name different (active) approach Dense metal/active countermeasures Various Achieves similar result using a complex and less effective approach
- 7. Revenue and Profit Potential • Market size: – Global thermal management: $7.5B in 2010, growing to $10.5B in 2015 – Thermal management hardware accounts for 84% of market • Incremental cost increase per laptop will be nominal – May be lower due to part reduction/simplification • Could increase laptop performance and durability • Could create a premium product for certain applications 7 Managed by UT-Battelle for the U.S. Department of Energy Presentation_name – Government/military applications
- 8. Contact Information • Alex DeTrana Senior Commercialization Manager Oak Ridge National Laboratory 865-576-9682 [email protected] 8 Managed by UT-Battelle for the U.S. Department of Energy Presentation_name