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Mems introduction
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- 2. AIM TO GIVE ANOVERVIEW ABOUT MEMS
- 3. PREVIEW • MEMS Introduction •History • Fabrication and Basic techniques • Applications • Advantages & Disadvantages • Future Trends • MEMS in India • Conclusion • References
- 4. • Technology ofMicroscopic devices & miniaturized Integrated systems • Components 1 and 100 micrometres in size. • Devices 20 micrometres to a millimetre (i.e. 0.02 to 1.0 mm) • Micro-sized components assembled & working together as a system INTRODUCTION
- 5. WHAT IS MEMS? •Technique of combining Electrical & Mechanical disiciplines. • System of miniature dimensions. • Micro fabrication technologies. • Both sense on Micro scale effect on Macro scale • Control the environment. • Potential to effect all of our lives 5
- 6. WHAT IS MEMS? 6 •Micro-electronics - Brain of the system. • Micro-sensors - Arms ,eyes, nose etc. • Micro-actuator - Switch or trigger. • Micro-structure -Micromachining
- 7. ON SIZE ANDSCALE
- 9. WHY MICROMACHINE • Minimizeenergy and mtrls use in manufacturing. • Integration with electronics, reduction of power budget. • Faster devices, incr selectivity and sensitivity. • Cost/Performance advantages. • Improved reproducibility (batch fabrication). • Improved accuracy and reliability. • Minimally invasive (e.g. pill camera).
- 10. HISTORY • 1947 :Telephone by Bell • 1958 : First IC (Ge).01 Transistor, 03 Resistors, 01 Capacitor. • 1959: Richard Feynman, California “There’s Plenty of Room at the Bottom”. $1000 for car 1/64th of an inch. • 1961: First si pressure sensor demonstrated. • 1967: Invention of surface micromachining. • 1970: First silicon accelerometer demonstrated. • 1979: First micromachined inkjet nozzle.
- 11. HISTORY • 1980: Firstexperiments in surface micromachined silicon. • 1982: Disposable blood pressure transducer and LIGA • 1988: MEMS was coined ,First MEMS conference. • 1990: Micromachining towards improving sensors. • 1992: Multi-User MEMS Process (MUMPS) by DARPA). • 2001: Triaxis accelerometers appear on the market. • 2004: TI’s DLP chip sales rose to $900 million. • 2007: MEMS industry group (MEMS-IG) • 2017: MEMS devices permeate our lives.
- 12. SUBTRATES • Silicon • Glass •Polymers • Metals - Metals like Gold, Ni, Al, Cr, Pl, and Ag • Ceramics 12
- 13. FABRICATION 13 Basic Process Deposition PatterningEtching Chemical Wet Dry Physical Lithography Photolithography
- 14. BASIC PROCESS OFFABRICATION • Deposition – Deposition that happen because of a Chemical reaction or Physical reaction. • Patterning – Transfer to a photosensitive material, exposure to UV light. – Developed in solution after exposure to UV. – Material Etch away. • Etching – Strong acid to cut into the unprotected parts of a metal surface to create a design. – Two classes : • Wet Etching • Dry Etching. 14
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- 18. DEPOSITION a) Physical VapourDeposition. • Thin films one atom (or molecule) • Physical coating. • Deposition of aluminium or gold conductors. b) Chemical Vapour Deposition. • Volatile precursors on wafer react and/or decompose • High-purity, high-performance solid materials.
- 19. MEMS MANUFACTURING TECHNOLOGY 19 a) BulkMicromachining. b) Surface Micromachining. c) High Aspect Ratio (HAR) Si Micromachining. • LIGA • SLIGA
- 20. LIGA 20 Lithographie (Lithography), Galvanoformung(Electroforming), & Abformung (Molding) • Additive Process • HARMST-High Aspect Ratio Microstructure Technology. • Precise dimensions and good surface roughness. • Output- Finished parts, molds, or stamps • SLIGA (Sacrificial LIGA). lower manufacturing infrastructures
- 21. LIGA Photo sensitive MaterialPMMA –Poly methyl metha crylate
- 22. PACKAGING a) Protection &robust to operating environment. b) Access and connections to physical domain. c) Minimize electrical interference. d) Dissipate heat for high operating temperatures. e) Minimize stress from external loading. f) Electric Power handling without signal disruption.
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- 24. MEMS APPLICATION MICRO NANO WORLD MEMSIN DEF BIO MEMS MICRO PROBING (STF,AFM) PRESSURE ,FORCE,INTERTIAL ,SOUNDS MICRO MAGNETICS RF MEMS MICRO FLUIDICS MICRO IT
- 25. MEMS ADVANTAGES IC COMPATIBLE LOWCOST RUGGEDNESS SMALLER BATCH FABRICATION MINIATURIZATION LOW POWER CONSUMPTION HIGHER PERFORMANCE
- 26. DISADVANTAGES • Impossible totransfer of Power impossible. • Poly-Si (a brittle material), Cannot be load and force limitations. • Disruptive technology, need different capabilities and competencies. • Scaling, Packaging and Testing Issues. • Challenges associated with developing manufacturing processes. • Critical technological bottlenecks, economic feasibility. • Time & expense.
- 27. FUTURE OF MEMS Challenges •Access to Foundries. • Design Simulation & Modelling • Packaging and Testing • Standardization • Education and Training. • Micro-sized objects allow us to go places where no objects have gone before.
- 28. MEMS IN INDIA •Jul 2002 first Lab ( IISc & CSI Ltd) • Microelectronics Group & Suman Mashruwala Micro- engineering Lab, IIT Bombay • Fabrication facilities at: • CEERI Pilani, ITI, BEL in Bangalore, SCL Chandigarh etc. • Microelectronics Laboratories in close interaction with Indian industries (BEL, DRDO , ISRO etc) • MEMS work in Acoustic Sensor & Ultrasound sensors, in GSLV & PSLV. • Development of analytic tools and software.
- 29. CONCLUSION • Promising technologyfor the 21st Century. • Disruptive technology differs significantly from existing technology. • Challenges associated with developing manufacturing processes. • Automotive industry varied signatures in all fields. • MEMS has gradually made its way out of research laboratories and into everyday products.
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Editor's Notes
- #6 The question that arises in our mind is what is mems or micro Electro-mechanical system? It is a technique of combining control on electrical and mechanical components together on a chip. It produce a system of miniature(small version of something) dimensions i.e the system having thickness less than the thickness of human hair. The components are integrated on a single chip using micro fabrication technology which allows the microsystem to both sense & control the environment.
- #7 Microelectronics- Brain of the system, receives data/info, process this information and signal the microactuators to react and create some form of changes to the environment. b) Microsensors- arms ,eyes, nose etc. They collect data and detect changes in the system’s environment by measuring mechanical, thermal, magnetic, chemical phenomena or electromagnetic information and pass this information to microelectronics for processing. c) A microactuator acts as a switch or a trigger to activate an external device. As the processed data is received. It takes decisions based on this data, sometimes activating an external device. d) Microstructure tiny structures built through micromachachining right into the silicon of the MEMS. These microstructures can be used as valves to control the flow of a substance or as very sm
- #13 Excellent electronic characteristics & chemical and mechanical properties,Abundant, inexpensive, processed to unparalleled purity. Hookean Material Glass Microfluidics and Optics.CheaperChemical inertness, Isolator.Surface finish, Thermal stability
- #15 Wafer [light thin flat surface] , Thin film - facilitate the deposition or formation of very thin films of different materials on a silicon wafer. D (deposit thin film material on object) - Spin-on(spin liquid into the wafer surface) , thermal oxidation , Chemical vapour deposition(film deposit using chemical reaction) , electroplating(forming film on cathode –ve charge) Wet Etching: where the material is dissolved when immersed in a chemical solution. Dry Etching: where the material is sputtered or dissolved using reactive ions or an etching agent.
- #34 The MEMS devices, in marine sensing maybe attached to: Ships Floating devices (buoys) in the sea Fixed sea structures (like oil rigs) Sea bed using links AUVs(Autonomous Underwater Vehicle)
- #35 The MEMS devices, in marine sensing maybe attached to: Ships Floating devices (buoys) in the sea Fixed sea structures (like oil rigs) Sea bed using links AUVs(Autonomous Underwater Vehicle)