© 2004 – 2010
Sherlock Automated Design
Analysis™
© 2004 - 2007© 2004 - 2010
9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Model Simplifications for Rapid Assessment of
Interconnects
o Unique scaling challenge of modeling the
robustness of soldered interconnects of
electronics
o Large assembly with thousands of small solder joints
(sub mm)
o Sherlock uses simplified component structures that
approximate the mass and stiffness of the electronic
component without modeling the actual interconnects
© 2004 - 2007© 2004 - 2010
9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Model Comparison
o Quarter symmetric model of BGA device under
board bending moment.
o Sherlock uses package dependent board level
strain fatigue models for vibration predictions
© 2004 - 2007© 2004 - 2010
9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Models
o Board parameters are identical
o Detailed part includes individual solder joints, die,
substrate and lid
o Simplified part just includes substrate
© 2004 - 2007© 2004 - 2010
9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
o Identical bending moments applied to board
edges
Displacement Results
≈ 2% Difference
Detailed
0.2618 mm
Simplified
0.2672 mm
© 2004 - 2007© 2004 - 2010
9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Principal Board Strains
Simplified
Detailed
Similar corner
PCB strains
© 2004 - 2007© 2004 - 2010
9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com
Discussion
o Based on the board level deflections the
difference between the two models will not have
a significant impact on the dynamic response of
the circuit board.
o Both models generate similar PCB strains

More Related Content

PDF
Intro to Sherlock_Linkedin
PDF
Reliability of power modules using sherlock
PDF
Using Physics of Failure to Predict System Level Reliability for Avionic Systems
PDF
Overcoming 25 year life reliability challenges in solar electronics
PDF
Preventing Pad Cratering During ICT Using Sherlock
PDF
Selecting a Printed Circuit Board Surface Fnish
PDF
A new-method-for-testing-electrolytic-capacitors-to-compare-life-expectancy
PDF
Selecting a Printed Circuit Board Surface Finish
Intro to Sherlock_Linkedin
Reliability of power modules using sherlock
Using Physics of Failure to Predict System Level Reliability for Avionic Systems
Overcoming 25 year life reliability challenges in solar electronics
Preventing Pad Cratering During ICT Using Sherlock
Selecting a Printed Circuit Board Surface Fnish
A new-method-for-testing-electrolytic-capacitors-to-compare-life-expectancy
Selecting a Printed Circuit Board Surface Finish

What's hot (15)

PPT
MEG-Array® Connector System
PDF
UnitedSiC UJN1205K 1200V SiC JFET report published by System Plus Consulting
PDF
Alternative Methods for Qualifying EEE Parts for CubeSats
PDF
Axis P1375-E Network Camera
PDF
InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sens...
PPTX
Gecko overview PTM
PDF
STMicroelectronics MASTERGAN1 Half-Bridge Driver
PDF
HTC Vive Virtual Reality Head-Mounted Display - teardown reverse costing repo...
PDF
Samsung LPDDR5 12GB Mobile Memory
PDF
Root Cause Analysis of HALT Failures
PPTX
EZ-Test points PTM
PDF
Prysmian BICON 376 Orion Cable Cleats - Spec Sheet
PPTX
RELIABLE CABLE INSTALLATIONS FOR INDUSTRIAL ENVIRONMENTS
 
PPTX
Commscope-Andrew 114EZDM
PPTX
Commscope-Andrew CSG78-12B2U
MEG-Array® Connector System
UnitedSiC UJN1205K 1200V SiC JFET report published by System Plus Consulting
Alternative Methods for Qualifying EEE Parts for CubeSats
Axis P1375-E Network Camera
InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sens...
Gecko overview PTM
STMicroelectronics MASTERGAN1 Half-Bridge Driver
HTC Vive Virtual Reality Head-Mounted Display - teardown reverse costing repo...
Samsung LPDDR5 12GB Mobile Memory
Root Cause Analysis of HALT Failures
EZ-Test points PTM
Prysmian BICON 376 Orion Cable Cleats - Spec Sheet
RELIABLE CABLE INSTALLATIONS FOR INDUSTRIAL ENVIRONMENTS
 
Commscope-Andrew 114EZDM
Commscope-Andrew CSG78-12B2U
Ad

Simplified vs. Detailed

  • 1. © 2004 – 2010 Sherlock Automated Design Analysis™
  • 2. © 2004 - 2007© 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com Model Simplifications for Rapid Assessment of Interconnects o Unique scaling challenge of modeling the robustness of soldered interconnects of electronics o Large assembly with thousands of small solder joints (sub mm) o Sherlock uses simplified component structures that approximate the mass and stiffness of the electronic component without modeling the actual interconnects
  • 3. © 2004 - 2007© 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com Model Comparison o Quarter symmetric model of BGA device under board bending moment. o Sherlock uses package dependent board level strain fatigue models for vibration predictions
  • 4. © 2004 - 2007© 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com Models o Board parameters are identical o Detailed part includes individual solder joints, die, substrate and lid o Simplified part just includes substrate
  • 5. © 2004 - 2007© 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com o Identical bending moments applied to board edges Displacement Results ≈ 2% Difference Detailed 0.2618 mm Simplified 0.2672 mm
  • 6. © 2004 - 2007© 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com Principal Board Strains Simplified Detailed Similar corner PCB strains
  • 7. © 2004 - 2007© 2004 - 2010 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com Discussion o Based on the board level deflections the difference between the two models will not have a significant impact on the dynamic response of the circuit board. o Both models generate similar PCB strains