STMicroelectronics MASTERGAN1 Half-Bridge Driver
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The document provides a comprehensive reverse costing analysis of the STMicroelectronics MasterGaN1 half-bridge driver, detailing its components, manufacturing processes, and cost structures. It covers aspects such as physical analysis, supply chain evaluations, and comparisons with other GAN devices. Key findings include insights into the cost of HEMT and IC dies, packaging costs, and selling price estimations.
STMicroelectronics MASTERGAN1 Half-Bridge Driver
- 1. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 1 22 Bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr STMicroelectronics MASTERGAN1 Half-Bridge Driver The first 600V system-in-package half bridge driver from STMicroelectronics integrating two GaN-based HEMTs SP20580 - Power Electronics report by Taha AYARI Laboratory analysis by Youssef EL GMILI November 2020 – Sample REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
- 2. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 2 Table of Contents Overview / Introduction 5 o Executive Summary o Market o Reverse Costing Methodology Company Profile 13 o STMicroelectronics Physical Analysis 17 o Summary of the Physical Analysis o Package Analysis ✓ Package Opening ✓ Package Cross-Sections o HEMT Die ✓ HEMT Die Views & Dimensions ✓ HEMT Die Process ✓ HEMT Die Cross-Section ✓ HEMT Die Process Characteristics o IC Die ✓ IC Die Views & Dimensions ✓ IC Die Process ✓ IC Die Cross-Section ✓ IC Die Process Characteristics Manufacturing Process Flow 47 o HEMT Die Front-End Process o HEMT Die Fabrication Unit o IC Die Front-End Process o IC Die Fabrication Unit o Packaging Process Flow Cost Analysis 61 o Supply Chain and Yields o HEMT Die ✓ HEMT Wafer Front-End Cost and Front-End Cost per Process Step ✓ HEMT Back-End0 Cost: Die Probe Test, Thinning & Dicing ✓ HEMT Die Cost o IC Die ✓ IC Front-End Cost ✓ IC Back-End0 Cost: Die Probe Test, Thinning & Dicing ✓ IC Die Cost o Packaging Assembly Cost o Component Cost ✓ Back-End: Final Test Cost ✓ Component Cost Price Analysis 79 o Definition of prices o Estimation of selling price Comparison 82 o Technology and Cost Comparison between GaN Devices from ST, Power Integrations and Navitas Feedbacks 85 System Plus Consulting Services 87
- 3. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 3 Overview / Introduction o Executive Summary o Market o Reverse Costing Methodology Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison Feedback Related reports About System Plus The reverse costing analysis is conducted in 3 phases: Teardown analysis Package is analyzed and measured. The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking. Setup of the manufacturing process Costing analysis Setup of the manufacturing environment Cost simulation of the process steps Selling price analysis Supply chain analysis Analysis of the selling price Reverse Costing Methodology
- 4. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 4 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Package o GaN HEMT o IC Die Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison Feedback Related reports About System Plus Summary of the Physical Analysis
- 5. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 5 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Package o GaN HEMT o IC Die Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison Feedback Related reports About System Plus Package Opening – Wire bonding
- 6. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 6 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Package o GaN HEMT o IC Die Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison Feedback Related reports About System Plus GaN HEMT Cross-Section - Contacts
- 7. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 7 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Package o GaN HEMT o IC Die Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison Feedback Related reports About System Plus GaN HEMT Cross-Section – Gate/Field plate Consulting
- 8. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 8 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Package o GaN HEMT o IC Die Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison Feedback Related reports About System Plus GaN HEMT Cross-Section – Epitaxy
- 9. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 9 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Package o GaN HEMT o IC Die Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison Feedback Related reports About System Plus IC Die – Delayering
- 10. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 10 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Package o GaN HEMT o IC Die Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison Feedback Related reports About System Plus IC Die – Cross-Section
- 11. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 11 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow o HEMT Fab Unit o HEMT Process Flow o ICs Fab Unit o ICs Process Flow o Component Packaging Cost Analysis Selling Price Analysis Comparison Feedback Related reports About System Plus GaN Transistor - Process Flow (6/6) Drawing not to Scale
- 12. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 12 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis o Supply Chain and Yields o GaN HEMT Cost o IC Cost o Packaging Cost o Component Cost Selling Price Analysis Comparison Feedback Related reports About System Plus Component Cost
- 13. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 13 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison Feedback Related reports About System Plus Estimated Selling Price
- 14. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 14 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison o ST vs Power Integrations o ST vs Navitas Feedback Related reports About System Plus STMicroelectronics vs PI - Component Comparison Note: Detailed teardown of the PI device can be found here.
- 15. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 15 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison o ST vs Power Integrations o ST vs Navitas Feedback Related reports About System Plus STMicroelectronics vs Navitas - GaN HEMT Comparison
- 16. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 16 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison Feedback Related reports About System Plus Related Reports MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT POWER ELECTRONICS & COMPOUND SEMI • Compound Semiconductor Quarterly Market Monitor • Status of the Power Electronics Industry 2020 • Power GaN 2019: Epitaxy, Devices, Applications & Technology Trends REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING POWER SEMICONDUCTORS & COMPOUND • GaN Power Transistor Comparison 2020 • GaN-on-Sapphire HEMT Power IC by Power Integrations • Innoscience’s 650 V GaN-on-Si Transistor • Navitas 650V GaNFast Power IC Family • Nexperia’s AEC-Q101 qualified 650 V GaN based power device
- 17. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 17 COMPANY SERVICES
- 18. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 18 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison Feedback Related reports About System Plus o Company services o Contacts Business Models Fields of Expertise Custom Analyses (>130 analyses per year) Reports (>60 reports per year) Costing Tools Trainings
- 19. ©2020 by System Plus Consulting | SP20580 - STMicroelectronics MASTERGAN1 Half-Bridge Driver | Sample 19 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis Comparison Feedback Related reports About System Plus o Company services o Contacts Contact www.systemplus.fr NANTES Headquarters FRANKFURT/MAIN Europe Sales Office LYON YOLE HQ TOKYO YOLE KK GREATER CHINA YOLE KOREA YOLE Headquarters 22 bd Benoni Goullin 44200 Nantes FRANCE +33 2 40 18 09 16 [email protected] Europe Sales Office Lizzie LEVENEZ Frankfurt am Main GERMANY +49 151 23 54 41 82 [email protected] Asia Sales Office Takashi ONOZAWA Tokyo JAPAN T : +81 804 371 4887 [email protected] Mavis WANG TAIWAN T :+886 979 336 809 CN: +8613661566824 [email protected] America Sales Office Steve LAFERRIERE WESTERN US T : +1 310 600 8267 [email protected] Chris YOUMAN EASTERN US & CANADA T : +1 919 607 9839 [email protected] CORNELIUS YOLE Inc.