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@DajanaV DajanaV commented Nov 27, 2025

This PR updates example projects to use SimpleLink SDK 8.20.00.119, replacing the previous dependency 8.10.01.02

TI wireless connectivity and others added 5 commits November 19, 2025 17:21
This commit updates ble5stack examples F2 and F3 SDK versions
eb7eb2ee SimpleLink lpf3-8.20.00.119 update

git-subtree-dir: simplelink-lowpower-f3-sdk
git-subtree-split: eb7eb2ee0476f05e7f1baf5ce53e2046e86200b7
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Explore the complete analysis inside the Version Insights

Pull Request Performance Summary

PR #18: SimpleLink F3 SDK Update (8.10.01.02 → 8.20.00.119)

This SDK update introduces measurable performance changes across all 8 analyzed binaries, primarily affecting the ICall inter-task communication layer and Radio Control Layer. The modifications represent intentional SDK enhancements for improved functionality and feature support.

Key Findings

ICall Layer Impact:
The ICall_getMaxMSecs function shows the most significant change across all binaries. Response time increased by 3457 ns (69 ns → 3526 ns) with throughput rising by 452 ns. The function transitioned from a simple timeout return to a multi-call implementation with validation logic. This affects every ICall_wait() operation in the BLE stack event processing.

Radio Control Layer Impact:
The LL_DirectTestRxTest function in the PTM binary exhibits substantial response time increase of 48105 ns (3190 ns → 51295 ns), with minimal function body change of 51 ns. The degradation originates from callees in the RCL command submission and scheduler interaction paths. This impacts Production Test Mode execution duration.

Scan Processing Changes:
The BLEAppUtil_processScanEventMsg function shows throughput increase of 455 ns (129 ns → 584 ns) with response time rising by 30277 ns. The implementation now includes extended advertising format handling, enhanced data validation, and filtering logic, reflecting BLE 5.x feature support.

Power Consumption Analysis:
Computational power consumption increased across all binaries:

  • CC2340R5.basic_ble_ptm.out: +5486 nJ (+2.64%)
  • CC2340R5.basic_ble.out: +2026 nJ (+0.91%)
  • CC2340R5.connection_monitor.out: +2231 nJ (+1.06%)
  • CC1354P10_1.basic_ble.out: +2026 nJ (+0.91%)
  • CC1354P10_6.basic_ble.out: +2026 nJ (+0.91%)
  • CC2340R53.basic_ble.out: +2026 nJ (+0.91%)
  • CC23X0R5.basic_ble.out: +2026 nJ (+0.91%)
  • CC23X0R22.basic_ble.out: +2026 nJ (+0.91%)

The PTM binary shows the highest impact due to the RCL layer changes affecting direct test mode operations.

Configuration Changes:
FreeRTOS heap size increased to 40960 bytes for CC2340R53 devices (from 19792 bytes), indicating enhanced memory requirements for SDK 8.20 features. The RCL include path and USE_RCL preprocessor define were removed, reflecting RCL integration changes in the new SDK version.

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