INTEGRATED CIRCUITS
DATA SHEET
For a complete data sheet, please also download:
• The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications
• The IC06 74HC/HCT/HCU/HCMOS Logic Package Information
• The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines
74HC/HCT109
Dual JK flip-flop with set and reset;
positive-edge trigger
Product specification 1997 Nov 25
Supersedes data of December 1990
File under Integrated Circuits, IC06
Philips Semiconductors Product specification
Dual JK flip-flop with set and reset;
74HC/HCT109
positive-edge trigger
FEATURES (SD) and reset (RD) inputs; also complementary Q and Q
outputs.
• J, K inputs for easy D-type flip-flop
• Toggle flip-flop or “do nothing” mode The set and reset are asynchronous active LOW inputs
and operate independently of the clock input.
• Output capability: standard
The J and K inputs control the state changes of the
• ICC category: flip-flops
flip-flops as described in the mode select function table.
The J and K inputs must be stable one set-up time prior to
GENERAL DESCRIPTION
the LOW-to-HIGH clock transition for predictable
The 74HC/HCT109 are high-speed Si-gate CMOS devices operation.
and are pin compatible with low power Schottky TTL
The JK design allows operation as a D-type flip-flop by
(LSTTL). They are specified in compliance with JEDEC
tying the J and K inputs together.
standard no. 7A.
Schmitt-trigger action in the clock input makes the circuit
The 74HC/HCT109 are dual positive-edge triggered, JK
highly tolerant to slower clock rise and fall times.
flip-flops with individual J, K inputs, clock (CP) inputs, set
QUICK REFERENCE DATA
GND = 0 V; Tamb = 25 °C; tr = tf = 6 ns
TYPICAL
SYMBOL PARAMETER CONDITIONS UNIT
HC HCT
tPHL/ tPLH propagation delay
nCP to nQ, nQ 15 17 ns
CL = 15 pF;
nSD to nQ, nQ 12 14 ns
VCC = 5 V
nRD to nQ, nQ 12 15 ns
fmax maximum clock frequency 75 61 MHz
CI input capacitance 3.5 3.5 pF
CPD power dissipation 20 22 pF
notes 1 and 2
capacitance per flip-flop
Notes
1. CPD is used to determine the dynamic power dissipation (PD in µW):
PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where:
fi = input frequency in MHz
fo = output frequency in MHz
∑ (CL × VCC2 × fo) = sum of outputs
CL = output load capacitance in pF
VCC = supply voltage in V
2. For HC the condition is VI = GND to VCC
For HCT the condition is VI = GND to VCC − 1.5 V.
ORDERING INFORMATION
See “74HC/HCT/HCU/HCMOS Logic Package Information”.
1997 Nov 25 2
Philips Semiconductors Product specification
Dual JK flip-flop with set and reset;
74HC/HCT109
positive-edge trigger
PIN DESCRIPTION
PIN NO. SYMBOL NAME AND FUNCTION
1, 15 1RD, 2RD asynchronous reset-direct input (active LOW)
2, 14, 3, 13 1J, 2J, 1K, 2K synchronous inputs; flip-flops 1 and 2
4, 12 1CP, 2CP clock input (LOW-to-HIGH, edge-triggered)
5, 11 1SD, 2SD asynchronous set-direct input (active LOW)
6, 10 1Q, 2Q true flip-flop outputs
7, 9 1Q, 2Q complement flip-flop outputs
8 GND ground (0 V)
16 VCC positive supply voltage
Fig.1 Pin configuration. Fig.2 Logic symbol. Fig.3 IEC logic symbol.
1997 Nov 25 3
Philips Semiconductors Product specification
Dual JK flip-flop with set and reset;
74HC/HCT109
positive-edge trigger
FUNCTION TABLE
OPERATING INPUTS OUTPUTS
MODE SD RD CP J K Q Q
asynchronous set L H X X X H L
asynchronous reset H L X X X L H
undetermined L L X X X H H
toggle H H ↑ h l q q
load “0” (reset) H H ↑ l l L H
load “1” (set) H H ↑ h h H L
hold “no change” H H ↑ l h q q
Notes
1. H = HIGH voltage level
h = HIGH voltage level one set-up time prior to the LOW-to-HIGH CP transition
L = LOW voltage level
I = LOW voltage level one set-up time prior to the LOW-to-HIGH CP transition
q = lower case letters indicate the state of the referenced output one set-up time
prior to the LOW-to-HIGH CP transition
X = don’t care
Fig.4 Functional diagram.
↑ = LOW-to-HIGH CP transition
handbook, full pagewidth
Q
C C C C
K
J
C C C C
CP
C MBK217
Fig.5 Logic diagram (one flip-flop).
PACKAGE OUTLINES
See “74HC/HCT/HCU/HCMOS Logic Package Outlines”.
1997 Nov 25 4
Philips Semiconductors Product specification
Dual JK flip-flop with set and reset;
74HC/HCT109
positive-edge trigger
DC CHARACTERISTICS FOR 74HC
For the DC characteristics see “74HC/HCT/HCU/HCMOS Logic Family Specifications”.
Output capability: standard
ICC category: flip-flops
AC CHARACTERISTICS FOR 74HC
GND = 0 V; tr = tf = 6 ns; CL = 50 pF
Tamb (°C) TEST CONDITIONS
74HC
SYMBOL PARAMETER UNIT VCC WAVEFORMS
+25 −40 to +85 −40 to +125
(V)
min. typ. max. min. max. min. max.
50 175 220 265 2.0
propagation delay
tPHL/ tPLH 18 35 44 53 ns 4.5 Fig.6
nCP to nQ, nQ
14 30 37 45 6.0
30 120 150 180 2.0
propagation delay
tPLH 11 24 30 36 ns 4.5 Fig.7
nSD to nQ
9 20 26 31 6.0
41 155 195 235 2.0
propagation delay
tPHL 15 31 39 47 ns 4.5 Fig.7
nSD to nQ
12 26 33 40 6.0
41 185 230 280 2.0
propagation delay
tPHL 15 37 46 56 ns 4.5 Fig.7
nRD to nQ
12 31 39 48 6.0
39 170 215 255 2.0
propagation delay
tPLH 14 34 43 51 ns 4.5 Fig.7
nRD to nQ
11 29 37 43 6.0
19 75 95 110 2.0
output transition
tTHL/ tTLH 7 15 19 22 ns 4.5 Fig.6
time
6 13 16 19 6.0
80 19 100 120 2.0
clock pulse width
tW 16 7 20 24 ns 4.5 Fig.6
HIGH or LOW
14 6 17 20 6.0
80 14 100 120 2.0
set or reset pulse
tW 16 5 20 24 ns 4.5 Fig.7
width HIGH or LOW
14 4 17 20 6.0
70 19 90 105 2.0
removal time
trem 14 7 18 21 ns 4.5 Fig.7
nSD, nRD to nCP
12 6 15 18 6.0
70 17 90 105 2.0
set-up time
tsu 14 6 18 21 ns 4.5 Fig.6
nJ, nK to nCP
12 5 15 18 6.0
5 0 5 5 2.0
hold time
th 5 0 5 5 ns 4.5 Fig.6
nJ, nK to nCP
5 0 5 5 6.0
6.0 22 5.0 4.0 2.0
maximum clock
fmax 30 68 24 20 MHz 4.5 Fig.6
pulse frequency
35 81 28 24 6.0
1997 Nov 25 5
Philips Semiconductors Product specification
Dual JK flip-flop with set and reset;
74HC/HCT109
positive-edge trigger
DC CHARACTERISTICS FOR 74HCT
For the DC characteristics see “74HC/HCT/HCU/HCMOS Logic Family Specifications”.
Output capability: standard
ICC category: flip-flops
AC CHARACTERISTICS FOR 74HCT
GND = 0 V; tr = tf = 6 ns; CL = 50 pF
Tamb (°C) TEST CONDITIONS
74HCT
SYMBOL PARAMETER UNIT VCC
+25 −40 to +85 −40 to +125 WAVEFORMS
(V)
min. typ. max. min. max. min. max.
propagation delay
tPHL/ tPLH 20 35 44 53 ns 4.5 Fig.6
nCP to nQ, nQ
propagation delay
tPLH 13 26 33 39 ns 4.5 Fig.7
nSD to nQ
propagation delay
tPHL 19 35 44 53 ns 4.5 Fig.7
nSD to nQ
propagation delay
tPHL 19 35 44 53 ns 4.5 Fig.7
nRD to nQ
propagation delay
tPLH 16 32 40 48 ns 4.5 Fig.7
nRD to nQ
tTHL/ tTLH output transition time 7 15 19 22 ns 4.5 Fig.6
clock pulse width
tW 18 9 23 27 ns 4.5 Fig.6
HIGH or LOW
set or reset pulse width
tW 16 8 20 24 ns 4.5 Fig.7
HIGH or LOW
removal time
trem 16 8 20 24 ns 4.5 Fig.7
nSD, nRD to nCP
set-up time
tsu 18 8 23 27 ns 4.5 Fig.6
nJ, nK to nCP
hold time
th 3 −3 3 3 ns 4.5 Fig.6
nJ, nK to nCP
maximum clock
fmax 27 55 22 18 MHz 4.5 Fig.6
pulse frequency
1997 Nov 25 6
Philips Semiconductors Product specification
Dual JK flip-flop with set and reset;
74HC/HCT109
positive-edge trigger
AC WAVEFORMS
The shaded areas indicate when the
input is permitted to change for
predictable output performance.
Fig.6 Waveforms showing the clock (nCP) to output (nQ, nQ) propagation delays, the clock pulse width, the nJ,
nK to nCP set-up, the nCP to nJ, nK hold times, the output transition times and the maximum clock pulse
frequency.
handbook, full pagewidth
nCP INPUT VM(1)
trem
nSD INPUT VM(1)
tW trem
tW
nRD INPUT VM(1)
tPLH tPHL
nQ OUTPUT VM(1)
tPHL tPLH
nQ OUTPUT VM(1)
MBK216
(1) HC: VM = 50%; VI = GND to VCC.
HCT: VM = 1.3 V; VI = GND to 3 V.
Fig.7 Waveforms showing the set (nSD) and reset (nRD) input to output (nQ, nQ) propagation delays, the set
and reset pulse widths and the nRD, nSD to nCP removal time.
1997 Nov 25 7
Philips Semiconductors Product specification
Dual JK flip-flop with set and reset;
74HC/HCT109
positive-edge trigger
SOLDERING Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
Introduction
the binding agent. Preheating duration: 45 minutes at
There is no soldering method that is ideal for all IC 45 °C.
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed WAVE SOLDERING
on one printed-circuit board. However, wave soldering is
Wave soldering can be used for all SO packages. Wave
not always suitable for surface mounted ICs, or for
soldering is not recommended for SSOP and TSSOP
printed-circuits with high population densities. In these
packages, because of the likelihood of solder bridging due
situations reflow soldering is often used.
to closely-spaced leads and the possibility of incomplete
This text gives a very brief insight to a complex technology. solder penetration in multi-lead devices.
A more in-depth account of soldering ICs can be found in
If wave soldering is used - and cannot be avoided for
our “IC Package Databook” (order code 9398 652 90011).
SSOP and TSSOP packages - the following conditions
must be observed:
DIP
• A double-wave (a turbulent wave with high upward
SOLDERING BY DIPPING OR BY WAVE pressure followed by a smooth laminar wave) soldering
The maximum permissible temperature of the solder is technique should be used.
260 °C; solder at this temperature must not be in contact • The longitudinal axis of the package footprint must be
with the joint for more than 5 seconds. The total contact parallel to the solder flow and must incorporate solder
time of successive solder waves must not exceed thieves at the downstream end.
5 seconds.
Even with these conditions:
The device may be mounted up to the seating plane, but • Only consider wave soldering SSOP packages that
the temperature of the plastic body must not exceed the have a body width of 4.4 mm, that is
specified maximum storage temperature (Tstg max). If the SSOP16 (SOT369-1) or SSOP20 (SOT266-1).
printed-circuit board has been pre-heated, forced cooling
• Do not consider wave soldering TSSOP packages
may be necessary immediately after soldering to keep the
with 48 leads or more, that is TSSOP48 (SOT362-1)
temperature within the permissible limit.
and TSSOP56 (SOT364-1).
REPAIRING SOLDERED JOINTS During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
Apply a low voltage soldering iron (less than 24 V) to the
applied by screen printing, pin transfer or syringe
lead(s) of the package, below the seating plane or not
dispensing. The package can be soldered after the
more than 2 mm above it. If the temperature of the
adhesive is cured.
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is Maximum permissible solder temperature is 260 °C, and
between 300 and 400 °C, contact may be up to 5 seconds. maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
SO, SSOP and TSSOP 6 seconds. Typical dwell time is 4 seconds at 250 °C.
REFLOW SOLDERING A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Reflow soldering techniques are suitable for all SO, SSOP
and TSSOP packages.
REPAIRING SOLDERED JOINTS
Reflow soldering requires solder paste (a suspension of
Fix the component by first soldering two diagonally-
fine solder particles, flux and binding agent) to be applied
opposite end leads. Use only a low voltage soldering iron
to the printed-circuit board by screen printing, stencilling or
(less than 24 V) applied to the flat part of the lead. Contact
pressure-syringe dispensing before package placement.
time must be limited to 10 seconds at up to 300 °C. When
Several techniques exist for reflowing; for example, using a dedicated tool, all other leads can be soldered in
thermal conduction by heated belt. Dwell times vary one operation within 2 to 5 seconds between
between 50 and 300 seconds depending on heating 270 and 320 °C.
method.
1997 Nov 25 8
Philips Semiconductors Product specification
Dual JK flip-flop with set and reset;
74HC/HCT109
positive-edge trigger
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Nov 25 9
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