UDN2987 6 Datasheet
UDN2987 6 Datasheet
Typical Application
IN1 OUT1
IN2 OUT2
IN3 OUT3
IN4 OUT4
2987 1 to 8 Load
CPU IN5 OUT5 Components
IN6 OUT6
IN7 OUT7
IN8 OUT8
FAULT GND
OE/R¯ VS
4.75 to 35 V
29876-DS, Rev. 6
DABIC-5 8-Channel Source Driver
UDN2987x-6
with Overcurrent Protection
Description (continued)
The inputs are compatible with 5 and 12 V logic systems: TTL, The UDN2987LW-6 is supplied in a 20-lead small-outline (SOIC-W)
Schottky TTL, DTL, PMOS, and CMOS. In all cases, the output is plastic package. All packages are lead (Pb) free, with 100% matte-
switched ON by an active high input level. Compared to predecessor tin leadframe plating.
devices, the UDN2987LW-6 has a significantly faster TPHL (200 ns
typical) and a lower driver supply voltage rating (4.75 V), which
allows the use of 5 V logic.
Selection Guide
Part Number Packing Package
UDN2987LWTR-6-T 1000 pieces/13-in. reel 20-pin SOIC, wide body
VS
Thermal
Shut Down
OE/R¯ FAULT
<1Ω
+
–
R S
Q
IN1
OUT1
Driver 1 of 8 drivers
IN8 OUT8
GND
Pin-Out Diagram
Terminal List Table
Number Name Description
IN1 1 20 OUT1 1 IN1 Logic input 1
2 IN2 Logic input 2
2 19 OUT2
IN2
3 IN3 Logic input 3
IN3 3 18 OUT3 4 IN4 Logic input 4
5 IN5 Logic input 5
4 17 OUT4
IN4
6 IN6 Logic input 6
IN5 5 16 OUT5 7 IN7 Logic input 7
8 IN8 Logic input 8
IN6 6 15 OUT6
9 FAULT Fault output
IN7 7 14 OUT7 10 OE/ R̄¯ Logic input for Output Enable and Reset
11 VS Supply voltage
IN8 8 13 OUT8
12 GND Supply ground
x8
FAULT 9 OEN 12 GND 13 OUT8 Output 8 to load
OE
FF
14 OUT7 Output 7 to load
OE/R 10 SENSE N 11 VS
15 OUT6 Output 6 to load
16 OUT5 Output 5 to load
Dwg. PP-067
17 OUT4 Output 4 to load
18 OUT3 Output 3 to load
19 OUT2 Output 2 to load
20 OUT1 Output 1 to load
THERMAL CHARACTERISTICS
Characteristics Symbol Test Conditions Rating Unit
Package Thermal Resistance* RθJA Package LW, on 4-layer board based on JEDEC standard 48 °C/W
*Additional thermal information is available on the Allegro Web site.
3.5
3.0
2.5
Pa
PD (W)
(R cka
g
= e LW
QJ
2.0 A
48
ºC
/W
)
1.5
1.0
0.5
0
25 50 75 100 125 150
TA (°C)
Characteristic Performance
VIN(A) = VIN(B)
tPLH tPHL
— tRTB
OE/R
Output (A) shorted
ISH
IOUT(A)
tBLANK
IM
IOUT(B)
Momentary fault or capacitive charging (<1μs)
400 400
Quantity of outputs conducting simultaneously Quantity of outputs conducting simultaneously
8 7 6 5 4 3 8 7 6 5 4 3 2
350 350
Collector Current (mA)
300 300
250 250
200 200
150 150
100 100
50 50
0 0
0 10 20 30 40 50 60 70 80 90 100 0 10 20 30 40 50 60 70 80 90 100
Duty Cycle (%) Duty Cycle (%)
As with all power integrated circuits, the UDN2987LW-6 pared to the voltage drop across a reference resistor with
has a maximum allowable output current rating. The a constant current. The two resistors are matched to
500 mA rating does not imply that operation at that value eliminate errors due to manufacturing tolerances or tem-
is permitted or even obtainable. The channel output current perature effects. Each channel includes a comparator and
trip point is specified as –370 mA, minimum; therefore, its own latch. An overcurrent fault (VSENSE > VREF) will
attempted operation at current levels greater than –370 mA set the affected latch and shut down only that channel.
may cause a fault indication and channel shutdown. The All other channels will continue to operate normally. The
device is tested at a maximum of –350 mA and that is the latch includes a 1 μs blanking delay, tBLANK, to prevent
recommended maximum output current per driver. It pro- unwanted triggering due to crossover currents generated
vides protection for current overloads or shorted loads up to when switching inductive loads. For an abrupt short circuit,
30 V. the blanking and output switching times will allow a brief,
¯ input high. permissible current in excess of the trip current before the
All outputs are enabled by pulling the OE/R
¯ is low or allowed to float (internal pull-down), output driver is turned off.
When OE/R
all outputs are inhibited and the latches are reset. Note that A common thermal shutdown disables all outputs if the
the reset pulse duration (OE/R¯ low) should be at least 1 μs. chip temperature exceeds 165°C. At thermal shutdown, all
This will ensure safe operation under attempted reset condi- latches are reset. The outputs are disabled until the chip
tions with a shorted load. The latches are also reset during cools down to approximately 150°C (thermal hysteresis).
power-up, regardless of the state of the OE/R ¯ input.
In the event of an overcurrent condition on any channel, or
The load current causes a small voltage drop across the chip thermal shutdown, the FAULT open-collector output is
internal low-value sense resistor. This voltage is com- pulled low (turned on).
+ +
Matched
VREF VSENSE
– –
To Fault Latch – SENSE
+
REF
ILOAD
IREF
A
+0.44
0.84 –0.43
1 2
1 2 0.65 1.27
0.25
Revision History
Revision Revision Date Description of Revision
Rev. 6 April 30, 2012 Update product availability