Creative Technology PCB Design and fabrication
1. Introduction to PCB (Printed Circuit Board)
Definition: PCB is the foundation of electronic devices, mechanically supporting and electrically
connecting components. It serves as a platform that houses various electronic components such as
resistors, capacitors, and microchips, ensuring proper connectivity and functionality.
Common PCB Problems:
Incorrect component placement: Leads to malfunctioning or failure of the circuit.
Manufacturing errors: Includes issues like poor soldering and misaligned layers.
Design errors: Mistakes in circuit layout can cause inefficiencies or non-functional boards. This
is the common error in PCB.
Short circuits: Can result from improper trace routing or solder bridging, potentially damaging
components.
2. PCB Components and Construction
Through-hole vs. Surface Mount Components
Through-hole Components: Have long leads that pass through drilled holes in the PCB and are
soldered on the opposite side. They provide strong mechanical bonds but take up more space.
Surface-mount Components: Are directly soldered onto the PCB surface, allowing for compact designs
and high-speed assembly but requiring precise placement.
Inventor of PCB: Paul Eisler, an Austrian engineer, invented the modern PCB in 1936, revolutionizing
the electronics industry.
Heat Dissipation Solutions:
Use of thermal vias: Small plated holes that allow heat to dissipate.
Heatsinks: Absorb and disperse excess heat away from sensitive components.
Thermal pads: Enhance heat transfer between components and the PCB surface
3. PCB Manufacturing Process
First Step: Designing the PCB layout using specialized software to ensure correct component
placement and signal flow.
Standard File Format: Extended Gerber files contain essential design information, such as
copper layer details, solder mask, and silkscreen layers.
Software for PCB Design: Altium Designer is widely used for advanced PCB manufacturing,
supporting high-speed designs and signal integrity analysis.
Gerber Files: These are the industry-standard files that manufacturers use to produce PCBs,
ensuring accurate replication of circuit designs.
Flexible PCB Material: Polyimide, known for its durability and flexibility, is commonly used in
wearable electronics like smartwatches.
PCB Structure Material: Fiberglass (FR4) provides rigidity and strength while being lightweight
and durable.
Purpose of Solder Mask: Insulates and protects copper traces from oxidation and prevents
solder bridges between adjacent components.
4. PCB Testing and Quality Control
Identifying Manufacturing Defects:
Delamination: Separation of PCB layers due to excessive heat or poor adhesion, which can
cause electrical failure.
Testing for Delamination: Thermal cycling test exposes the PCB to temperature variations to
check for weak bonding.
Solutions: Implementing better material choices and precise temperature control during the
lamination process.
Ensuring PCB Quality:
Rigorous quality control: Inspections at every stage prevent defects from propagating.
Importance of Each Step: Ensures functionality, reliability, and long-term durability.
Key PCB Layers and Functions:
Substrate: Provides structural integrity and mechanical strength.
Copper Layer: Conducts electrical signals across the PCB.
Solder Mask: Insulates and protects copper traces from environmental damage.
Silkscreen: Displays labels, component identifiers, and markings for easy assembly.
5. PCB Manufacturing Techniques
Lamination Process: This step bonds copper layers and dielectric materials using high
pressure and heat to create multilayer PCBs.
Etching Process:
Uses ferric chloride to dissolve unwanted copper, leaving only the desired circuit
pattern.
Photoresist Layer: Shields specific areas during etching, ensuring only unnecessary
copper is removed.
Safe Disposal of Ferric Chloride:
Contact hazardous waste disposal companies to handle it safely.
Avoid environmental contamination by not pouring it down drains.
Screen Printing in PCB Manufacturing:
Applies solder mask, component labels, and other markings using stencils.
Essential for precise layer building and circuit definition.
Common Tools in PCB Fabrication:
Soldering Iron: Melts solder to connect components.
Mini Drill: Creates holes for through-hole components.
Side Cutter: Trims excess component leads and wiring.
6. Safety and Equipment in PCB Manufacturing
Personal Protective Equipment (PPE):
Safety Goggles: Protects eyes from solder splashes and chemical exposure.
Lab Coat: Prevents chemical spills from contacting clothing.
Gloves: Shields hands from hazardous materials like ferric chloride.
PCB Cutting Methods:
CNC Milling: Best for intricate shapes and precision cuts.
Utility Knife: Ideal for small modifications and fine adjustments.
Functional Testing:
Ensures PCB functionality before mass production.
X-ray Inspection: Detects internal defects and soldering issues.
7. EMC and EMI Compliance
Electromagnetic Compatibility (EMC): Prevents devices from interfering with each other.
Types of EMI (Electromagnetic Interference):
Conducted Emission (CE): Interference via power lines.
Radiation Emission (RE): Unwanted electromagnetic waves.
Conducted Immunity (CI): Device’s ability to resist EMI.
Role of EMC:
Ensures stability and proper operation of electronic systems.
Reduces signal distortion and electronic noise.
8. PCB Design and Production Workflow
Steps in PCB Design:
1. Schematic Capture: Defines electrical connections.
2. Layout Design: Determines physical component placement.
3. PCB Production: Uses Gerber files to create the board.
4. Assembly: Components are soldered onto the board.
Bill of Materials (BOM): A comprehensive list of all required components for PCB assembly.
9. Surface Finishing in PCB Manufacturing
Purpose: Enhances solderability and protects copper from oxidation.
Common Surface Finishes:
ENIG (Electroless Nickel/Immersion Gold): Provides excellent corrosion resistance.
Immersion Silver: Cost-effective and good for fine-pitch applications.
Organic Solderability Preservative (OSP): Eco-friendly but less durable.
Selecting a Surface Finish:
Consider the application requirements, such as durability and conductivity.
Poor selection can reduce solderability and product lifespan.
