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High Efficiency RF Power Transistor

The document describes Polyfet RF devices, specifically silicon VDMOS and LDMOS transistors designed for broadband RF applications, including military radios and cellular amplifiers. It provides technical specifications such as maximum ratings, RF characteristics, and electrical characteristics, highlighting features like high efficiency and low noise. Additionally, it includes graphical data on power output versus input and capacitance versus voltage.
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0% found this document useful (0 votes)
29 views2 pages

High Efficiency RF Power Transistor

The document describes Polyfet RF devices, specifically silicon VDMOS and LDMOS transistors designed for broadband RF applications, including military radios and cellular amplifiers. It provides technical specifications such as maximum ratings, RF characteristics, and electrical characteristics, highlighting features like high efficiency and low noise. Additionally, it includes graphical data on power output versus input and capacitance versus voltage.
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

polyfet rf devices

L88016

General Description
Silicon VDMOS and LDMOS
transistors designed specifically SILICON GATE ENHANCEMENT MODE
for broadband RF applications.
Suitable for Militry Radios,
RF POWER LDMOS TRANSISTOR
Cellular and Paging Amplifier Base
Stations, Broadcast FM/AM, MRI, 30.0 Watts Push - Pull
Laser Driver and others.
TM Package Style AQ
"Polyfet" process features
low feedback and output capacitances
resulting in high F t transistors with high
HIGH EFFICIENCY, LINEAR
input impedance and high efficiency. HIGH GAIN, LOW NOISE
o
ABSOLUTE MAXIMUM RATINGS ( T = 25 C )
Total Junction to Maximum Storage DC Drain Drain to Drain to Gate to
Device Case Thermal Junction Temperature Current Gate Source Source
Dissipation Resistance Temperature Voltage Voltage Voltage
o o o o
80 Watts 1.80 C/W 200 C -65 C to 150 C 4.5 A 70 V 70 V 20 V

RF CHARACTERISTICS ( 30.0 WATTS OUTPUT )


SYMBOL PARAMETER MIN TYP MAX UNITS TEST CONDITIONS

Gps Common Source Power Gain 14 dB Idq = 0.40 A, Vds = 28.0 V, F = 500 MHz
η Drain Efficiency 55 % Idq = 0.40 A, Vds = 28.0 V, F = 500 MHz
VSWR Load Mismatch Tolerance 20:1 Relative Idq = 0.40 A, Vds = 28.0 V, F = 500 MHz

ELECTRICAL CHARACTERISTICS ( EACH SIDE )


SYMBOL PARAMETER MIN TYP MAX UNITS TEST CONDITIONS

Bvdss Drain Breakdown Voltage 65 V Ids = 0.10 mA, Vgs = 0V

Idss Zero Bias Drain Current 1.0 mA Vds = 28.0 V, Vgs = 0V

Igss Gate Leakage Current 1 uA Vds = 0V Vgs = 30V

Vgs Gate Bias for Drain Current 1 7 V Ids = 0.10 A, Vgs = Vds

gM Forward Transconductance 0.8 Mho Vds = 10V, Vgs = 5V

Rdson Saturation Resistance 0.90 Ohm Vgs = 20V, Ids = 2.50 A

Idsat Saturation Current 5.50 Amp Vgs = 20V, Vds = 10V

Ciss Common Source Input Capacitance 30.0 pF Vds = 28.0 Vgs = 0V, F = 1 MHz

Crss Common Source Feedback Capacitance 1.0 pF Vds = 28.0 Vgs = 0V, F = 1 MHz

Coss Common Source Output Capacitance 15.0 pF Vds = 28.0 Vgs = 0V, F = 1 MHz

POLYFET RF DEVICES REVISION 04/27/2001


1110 Avenida Acaso, Camarillo, Ca 93012 Tel:(805) 484-4210 FAX: (805) 484-3393 EMAIL:Sales@[Link] URL:[Link]
L88016

POUT VS PIN GRAPH CAPACITANCE VS VOLTAGE


L88016 POUT vs PIN F=500 MHZ; IDQ=0.4A; VDS=28V L2B 1 DIE CAPACITANCE

40 18.00
100

35
Ciss
16.00
30 10

Coss
25 Efficiency = 55% 14.00

1 Crss
20
12.00
15

0.1
10 10.00
0 5 10 15 20 25 30
0 0.5 1 1.5 2 2.5 3 3.5 4
PIN IN WATTS VDS IN VOLTS
POUT GAIN

IV CURVE ID & GM VS VGS


L2B 1 DIE ID, GM vs VG
L2A 1 DICE IV 100
6

4 10
ID
ID IN AMPS

2
1

1 GM

0
0 2 4 6 8 10 12 14 16 18 20
0.1
VDS IN VOLTS
0 2 4 6 8 10 12 14
vg=2v Vg=4v Vg=6v vg=8v vg=10v vg=12v
Vgs in Volts

Zin Zout PACKAGE DIMENSIONS IN INCHES

Tolerance .XX +/-0.01 .XXX +/-.005 inches

POLYFET RF DEVICES REVISION 04/27/2001


1110 Avenida Acaso, Camarillo, Ca 93012 Tel:(805) 484-4210 FAX: (805) 484-3393 EMAIL:Sales@[Link] URL:[Link]

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