Technical Note

High Efficiency Power Switches

Nasser Kutkut - PowerDesigners, LLC - Madison, WI

The revolution and wide spread of switchmode power conversion technology is greatly attributed to the
invention and rise of power semiconductor switching devices. These powerful switches gave designers
the ability to precisely switch power on and off at ever increasing speeds allowing them to process power
in a whole new way.

It all started with the mighty Bipolar Junction Transistor (BJT) in 1970, the first fully controllable and
commercially viable power switch. BJTs gave rise to switchmode power conversion by late 1970s and
made this class of converters a reality. Then came the Metal Oxide Field Effect Transistor (MOSFET) by
the late 1970s, a new class of power devices that offered significant performance improvements
compared to BJTs and extended the limits of power conversion technology as we know it today. In the
1980s, a new addition to the family of power devices was made with the invention of the Insulated Gate
Bipolar Transistor (IGBTs). The IGBT was built on the core MOSFET technology and extended MOSFET
operation into high power applications.

Bipolar Junction Transistors (BJTs)

A BJT is a current controlled device where the device is turned on and off by controlling the current into
its base junction (IB). A base drive circuit is normally employed to achieve that (Fig. 1). When a BJT is
turned on, a forward voltage drop is developed across the device terminals (collector-to-emitter), which
gives rise to power loss (conduction loss) and thus heat loss while the device is conducting current.
However, this voltage drop is relatively low and is easily tolerated by the external circuitry.

Collector

Drive Base
Controls Circuit BJT
IB
Emitter

Fig. 1: The BJT with drive and control circuitry

Due to the relatively low forward voltage drop and consequently low conduction loss of BJTs, they have
very high current handling capabilities and were used across the board in low to high power applications.
Although BJTs were the only real power transistors throughout the 1970’s, they had considerable
performance and control limitations, namely:
1. The drive circuitry was complex and quite sizeable since the base current require to turn-on and
off the device is quite high.
2. BJTs have relatively slow switching characteristics limiting their maximum operating switching
frequencies to the low kHz range.
3. The BJT is a negative temperature coefficient device, meaning that the device is liable for thermal
runaway as the device temperature increases
The above limitations accelerated the pace of searching for a new power device and yielded to the
development of the power MOSFET.

Metal Oxide Field Effect Transistors (MOSFETs)

A MOSFET is a voltage controlled device where the device is turned on and off by controlling the voltage
across the gate-source junction (VGS) (Fig. 2). Unlike BJTs, MOSFETs have high input impedances and
thus require minimal gate currents to turn-on and off. This greatly simplifies the drive circuitry and
reduces its cost. In addition, MOSFETs have very fast switching characteristics allowing them to operate
into the MHz range.

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Technical Note

Drain

Gate MOSFET
Source
Controls VGS

Fig. 2: The MOSFET with drive and control circuitry

When a MOSFET is turned on, it exhibits a resistive like behavior and will thus develop a forward voltage
drop across its terminals (drain-to-source). Similar to BJTs, this gives rise to power and heat loss
(conduction loss) in the device. Unlike BJTs, however, and since MOSFETs are merely resistors while
switched on, they have a positive temperature coefficient thus stopping thermal runaway.
In general, MOSFETs extended the performance advantages of BJTs in terms of high-current handling
capability while eliminating their drawbacks in terms of:

1. Ease of control: Simpler and lower cost drive circuitry.

2. Faster switching behavior: allowing operation into the MHz range. This resulted in the
miniaturization of power converters as the size of the passive and filtering components was
greatly reduced.
3. High current carrying capabilities: The positive temperature coefficient characteristics allow
MOSFETs to be paralleled which further increases their current handling capability.

The above has lead to MOSFETs becoming the devices of choice for power designers and to the
elimination of BJTs in low to medium power applications.
Well it is all good to be true for MOSFETs. MOSFETs do have limitations, namely:

1. Relatively low breakdown voltages: The breakdown voltage limit of the metal oxide junction is
limited to 1000-1200V. This has limited the use of power MOSFETs in high voltage applications.
2. High on-resistance especially at high breakdown voltages, which limits their current handling
capabilities. The resistive like behavior of MOSFETs entails that the voltage drop increases with
increasing currents (IR drop) as well as increasing temperatures (increased resistance). One
way to alleviate the forward drop limitation is to parallel MOSFETs to reduce the equivalent
resistance, similar to connecting resistors in parallel (Fig. 3). Just like resistors, the equivalent
resistance of the parallel configuration is divided down by the number of parallel devices. This
greatly reduces the conduction losses and increases the current carrying capability of power
MOSFETs.

Drain Drain

Gate MOSFET1 Gate MOSFET2

Source Source
Controls VGS

Fig. 3: Parallel connected MOSFETs for increased current handling capability and reduce conduction loss

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Technical Note

Insulated Gate Biploar Transistors (IGBTs)

An IGBT is a “combo” device derived from the power MOSFET and BJT technologies. In fact, the IGBT is
a “spinoff” from power MOSFETs invented to extend the performance limitations of power MOSFETs into
high voltage and high power applications. It combines the low conduction loss of a BJT with the relatively
high switching speed of a MOSFET.

The IGBT physical structure is a true representation of the “combo” technology the device incorporates
having a MOSFET input stage and a BJT output stage (see Fig. 4).

Collector Collector
MOSFET
Gate Gate

PNP BJT

Emitter
Emitter

IGBT IGBT
Fig. 4: IGBT symbol and equivalent internal structure showing the input MOSFET and the output BJT

Similar to power MOSFETs, the IGBTs are voltage controlled devices and have high input impedances
thus requiring minimal gate drive circuitry. In addition, IGBTs and can turn-on and off at speeds
comparable to MOSFETs. Unlike MOSFETs, however, IGBTs exhibit forward voltage drops and current
densities similar to BJTs while switching much faster. In addition, their breakdown voltages are much
higher than MOSFETs with readily available devices having breakdown voltages in excess of 5000V.
In summary, the performance improvements of IGBTs over MOSFETs and BJTs are summarized below:

1. MOSFET input stage which entails high input impedance, minimal drive requirements, and simple
and low cost drive circuitry
2. Fast switching behavior comparable MOSFETs
3. Low forward voltage drop resulting in lower conduction losses
4. High current carrying capabilities. Presently, IGBTs are available in current ratings in excess of
1000A.
5. High breakdown voltages approaching few thousand volts

The above performance improvements make IGBTs the devices of choice in high voltage and high power
applications. Specifically, IGBTs are better suited for voltages in excess of 600V and for power levels in
excess of 5-10kW.

Just like MOSFETs, it’s too good to be true. And yes, IGBTs have their own limitations. Some of the
major limitations of IGBTs include:

1. Lower switching speeds in comparison with MOSFETs. Although IGBTs switch faster than BJTs,
they are relatively slower than MOSFETs. This is in part due to the tail current effect they exhibit
when the device is turned off which may extend for few microseconds (see Fig. 5).
2. Higher switching losses compared to MOSFETs. Again, this is mainly due to the tail current
effect, which increases switching losses and limits the maximum switching frequency (see Fig. 5).
3. Possibility of uncontrollable latch-up (stays-on) under overstress conditions (high dv/dt or di/dt)

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Technical Note

Turn-off
Voltage

IGBT Current

MOSFET Current

IGBT Tail Current

Time
IGBT Turn-off Loss
MOSFET Turn-off Loss

Fig. 5: MOSFET and IGBT turn-off behavior

Comparison

Table 1 below summarizes the main performance characteristics of BJTs, MOSFETs, and IGBTs. As
shown in the table, BJTs performance is no longer favorable and their use is now limited to select
applications, mainly at low switching frequencies and where the applications requirements are low. On
the other hand, MOSFETs and IGBTs are now the devices of choice of almost all power designers.

Table 1: Charge Technology Comparison

COMPARISON CRITERIA BJTs MOSFETs IGBTs

Drive Method Current Voltage Voltage
Drive Circuit Complexity High Low Low
Switching Speeds Slow (µs) Very Fast (ns) Medium
Switching Frequencies few kHz Up to 1 MHz < 50 kHz
Forward Voltage Drop Low Medium Low
Current Carrying Capability High Medium High
Breakdown Voltage High Medium Very High
(<1500V) (~5000V)

Which Device is Better: a MOSFET or an IGBT

Well, the magic answer is: IT DEPENDS. There isn’t a clear line that can be easily drawn. The choice of
a MOSFET versus an IGBT in a given application depends greatly on the application needs and
requirements.

In developing a simple criteria to choose between MOSFETs and IGBTs in a given application, the
switching frequency and the voltage withstand requirements can be used. Figure 6 shows the application
range of MOSFETs and IGBTs based on the operational frequency and voltage requirements of a given
application. It is clear that MOSFETs are still the “king of the hill” in low voltage (<300V) and low to
medium power applications (<10kW). As the voltage requirements increase, IGBTs become more
appealing. However, at higher switching frequencies, MOSFETs are still superior due to their faster
switching speeds. Higher frequency operation of IGBTs is now feasible by employing soft switching
power conversion techniques.

© PowerDesigners, LLC • 931 E Main Street, #4, Madison, WI 53703 USA• Tel: 608-231-0450 • Fax: 608-231-9979
Technical Note

Voltage

*
IGBTs IGBTs ???
1000V
**
IGBTs MOSFETs / MOSFETs
**
IGBTs
300V

MOSFETs

25kHz 100kHz Frequency

* Switching frequencies above 25kHz only achievable with soft switching techniques
** The choice of MOSFETs vs IGBTs depends mainly on the application requirements

Fig. 6: MOSFETs and IGBTs Application Range

In summary, there has been euphoria and a push to claim IGBTs as a “new” technology while classifying
MOSFETs as being a “mature” old technology. Many have been pushing the notion that IGBTs have
significant performance improvements over MOSFETs and should be the device of choice in applications
above 300V. This is far from true especially with continual innovations in MOSFET device and
processing technologies that continue to push the limits of these devices into higher voltage and higher
power applications.

Selected References:
1- “IGBT or MOSFET: Choose Wisely”, IR Tech Note.
2- “Fast High Speed TrenchStop IGBT and Duo Pack”, Infineon Application Note.

© PowerDesigners, LLC • 931 E Main Street, #4, Madison, WI 53703 USA• Tel: 608-231-0450 • Fax: 608-231-9979