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Chapter 1 Heat Transfer Assignments

The document outlines assignments for Chapter 1, due on January 31, 2025, with no acceptance of late submissions. It includes various heat transfer problems related to thermal management in different scenarios, such as cooling coffee, silicon chips, vacuum systems, and canisters. Each assignment is followed by a space for solutions, indicating a focus on practical applications of thermal principles.

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peter1019zhang
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0% found this document useful (0 votes)
62 views13 pages

Chapter 1 Heat Transfer Assignments

The document outlines assignments for Chapter 1, due on January 31, 2025, with no acceptance of late submissions. It includes various heat transfer problems related to thermal management in different scenarios, such as cooling coffee, silicon chips, vacuum systems, and canisters. Each assignment is followed by a space for solutions, indicating a focus on practical applications of thermal principles.

Uploaded by

peter1019zhang
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

Name: ____________________________

Student ID: ____________________________

Assignments of Chapter 1

Due date: Jan. 31, 2025 (11:59 pm (EST))


Note: Late submission will not be accepted

52
Assignment 1-1
A closed container filled with hot coffee is in a
room whose air and walls are at a fixed
temperature. Identify all heat transfer
processes that contribute to the cooling of the
coffee. Comment on features that would
contribute to a superior container design.

53
Assignment 1-1
Solution:

54
Assignment 1-2
A square silicon chip (k = 150 W/m.K) is of width w = 5 mm on a side and of
thickness t = 1 mm. The chip is mounted in a substrate such that its side and back
surfaces are insulated, while the front surface is exposed to a coolant. If 4 W are
being dissipated in circuits mounted to the back surface of the chip, what is the
steady-state temperature difference between back and front surfaces?

55
Assignment 1-2
Solution:

56
Assignment 1-3
A square isothermal chip is of width w 5 = mm on a side and is mounted in a
substrate such that its side and back surfaces are well insulated; the front surface is
exposed to the flow of a coolant at T = 15C. From reliability considerations, the
chip temperature must not exceed T = 85C.

If the coolant is air and the corresponding convection coefficient is h = 200 W/m2.K,
what is the maximum allowable chip power? If the coolant is a dielectric liquid for
which h = 3000 W/m2.K, what is the maximum allowable power?

57
Assignment 1-3
Solution:

58
Assignment 1-4
A vacuum system, as used in sputtering electrically conducting thin films on
microcircuits, is comprised of a baseplate maintained by an electrical heater at 300 K
and a shroud within the enclosure maintained at 77 K by a liquid-nitrogen coolant
loop. The circular baseplate, insulated on the lower side, is 0.3 m in diameter and has
an emissivity of 0.25.

(a) How much electrical power must be


provided to the baseplate heater?
(b) At what rate must liquid nitrogen be
supplied to the shroud if its heat of
vaporization is 125 kJ/kg?
(c) To reduce the liquid nitrogen
consumption, it is proposed to bond a
thin sheet of aluminum foil (ε = 0.09)
to the baseplate. Will this have the
desired effect?

59
Assignment 1-4
Solution:

60
Assignment 1-5
A spherical, stainless steel (AISI 302) canister is used to store reacting chemicals that
provide for a uniform heat flux to its inner surface. The canister is suddenly
submerged in a liquid bath of temperature T < Ti, where Ti is the initial temperature
of the canister wall.
(a) Assuming negligible temperature gradients in the canister wall and a constant heat flux
qi”, develop an equation that governs the variation of the wall temperature with time
during the transient process. What is the initial rate of change of the wall temperature if
qi” = 105 W/m2?
(b) What is the steady-state temperature of the wall?

61
Assignment 1-5
Solution:

62
Assignment 1-6
Electronic power devices are mounted to a heat sink having an exposed surface area of
0.045 m2 and an emissivity of 0.80. When the devices dissipate a total power of 20 W
and the air and surroundings are at 27C, the average sink temperature is 42C. What
average temperature will the heat sink reach when the devices dissipate 30 W for the
same environmental condition?

63
Assignment 1-6
Solution:

64

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