MCP8063

3-Phase Brushless Sinusoidal Sensorless Motor Driver

Features Description
• Automotive AEC-Q100 Qualified, PPAP available The MCP8063 device is a highly integrated 3-phase,
upon request full-wave sensorless driver for brushless motors. It
• Position Sensorless BLDC Drivers (no Hall features a 180° sinusoidal drive, high torque output,
Sensor required) and silent drive. Its integrated features and the wide
• 180° Sinusoidal Drive for High Efficiency and Low power supply range (2V to 14V) make the MCP8063 an
Acoustic Noise ideal candidate for a broad range of motor
characteristics, requiring no external tuning. Speed
• Supports 2V to 14V Power Supplies
control can be achieved through either power supply
• Speed Control through Power Supply Modulation modulation (PSM) or pulse-width modulation (PWM).
(PSM) and/or Pulse-Width Modulation (PWM)
Due to the compact packaging and minimum bill of
• Built-In Frequency Generator (FG output signal)
materials (power transistors integrated, no Hall sensor,
• Built-In Lock-Up Protection and Automatic no external tuning), the MCP8063 is optimized for fan
Recovery Circuit (external capacitor not applications that require high efficiency and low
necessary) acoustic noise at competitive costs. Frequency
• Built-In Overcurrent Limitation (1.5A) generator output enables precision speed control in
• Built-In Overvoltage Protection closed-loop applications. The MCP8063 driver
• Built-In Thermal Shutdown Protection includes a Lock-Up Protection mode, which turns off
the output current when the motor is under lock
• Thermally Enhanced 8-Lead 4 mm x 4 mm DFN
condition, and an automatic recovery that enables the
Package with Exposed Pad
fan to restart when the lock condition is removed.
• 23 kHz PWM Output Frequency Features such as motor overcurrent limitation and
• No External Tuning Required thermal shutdown protection improve motor system
• Optimized for Fan Cooling Systems reliability without additional efforts from design
engineers.
Typical Applications The MCP8063 is available in a compact
thermally-enhanced 8-lead 4 mm x 4 mm DFN
• Silent Notebook CPU/GPU Cooling Fans
package with exposed pad.
• Air Ventilation System
• 12V 3-Phase BLDC Motors Package Types
MCP8063
4x4 DFN*

FG 1 8 PWM
VBIAS 2 EP 7 VDD
OUT1 3 9 6 OUT3
OUT2 4 5 GND

Top View

* Includes Exposed Thermal Pad (EP); see Table 3-1.

 2014 Microchip Technology Inc. DS20005257B-page 1

MCP8063
Functional Block Diagram

VDD
VREF
Motor Phase
Detection Circuit

VBIAS Regulator
Overcurrent
Limitation
VDD
FG

Output Drive Circuit

MCU OUT3
VBIAS OUT2
OUT1
PWM
PWM
Input

GND
Thermal
Protection

DS20005257B-page 2  2014 Microchip Technology Inc.

 MCP8063
Typical Application – Fan Motor Driver Using the MCP8063

VLOGIC PWM Input

(Controller Side) (0.02-100 kHz)

R1
1 FG PWM 8 VDD

MCP8063
2 VBIAS VDD 7
C1 C2
3 OUT1 OUT3 6

4 OUT2 EP GND 5
9

Recommended External Components for Typical Application

Element Type/Value Comment

C1 ≥1 µF Connect as close as possible to IC input pins

C2 ≥10 µF Connect as close as possible to IC input pins
R1 ≥10 kΩ Connect to Vlogic on controller side

 2014 Microchip Technology Inc. DS20005257B-page 3

MCP8063
1.0 ELECTRICAL † Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
CHARACTERISTICS
This is a stress rating only and functional operation of
the device at those or any other conditions above those
Absolute Maximum Ratings† indicated in the operational listings of this specification
Power Supply Voltage (VDD_MAX) .................... -0.7 to +16.0V is not implied. Exposure to maximum rating conditions
Maximum OUT1,2,3 Voltage (VOUT_MAX) ........ -0.7 to +16.0V for extended periods may affect device reliability.
Maximum Output Current(1) (IOUT_MAX) ........... -1.7A to +1.7A Note 1: OUT1, OUT2, OUT3 (Continuous,
FG Maximum Output Voltage (VFG_MAX) ......... -0.7 to +16.0V 100% duty cycle).
FG Maximum Output Current (IFG_MAX) .....................5.0 mA
VBIAS Maximum Voltage (VBIAS_MAX) ................ -0.7 to +4.0V
PWM Maximum Voltage (VPWM_MAX) ................ -0.7 to +4.0V
Maximum Junction Temperature (TJ) .......................... +150°C
HBM ESD protection on all pins....................................... 4 kV

ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits are established for VDD = 12.0V,
Temperature = +25°C.
Parameters Sym. Min. Typ. Max. Units Conditions
Power Supply Voltage VDD 2 — 14 V
Power Supply Current IVDD — 10 — mA Rotation Mode
— 5 — mA Lock-Protection Mode
OUT1/2/3 RON(H) — 0.6 1 Ω IOUT = 0.5A, VDD = 3.3V to 14V
High Resistance (Note 1)
OUT1/2/3 RON(L) — 0.6 1 Ω IOUT = -0.5A, VDD = 3.3V to 14V
Low Resistance (Note 1)
OUT1/2/3 RON(H+L) — 1.2 2 Ω IOUT = 0.5A, VDD = 3.3V to 14V
Total Resistance (Note 1)
OUT1/2/3 Maximum IOUT_LIM 1.4 1.5 1.6 A Note 1
Current Limitation
VBIAS Output Voltage VBIAS — 3 — V VDD = 3.3V to 14V
— VDD – 0.2 — V VDD < 3.3V
PWM Input Frequency fPWM 0.02 — 100 kHz
PWM Input H Level VPWM_H 0.8 × VBIAS — 3.6 V
PWM Input L Level VPWM_L 0 — 0.2 × VBIAS V
PWM Internal Pull-Up IPWM_L 17 34 — µA PWM = GND, VDD = 3.3V to 14V
Current 8 17 — µA PWM = GND, VDD < 3.3V
PWM Output fPWM_O — 23 — kHz
Frequency
FG Output Pin Low VOL_FG — — 0.25 V IFG = -1 mA
Level Voltage
FG Output Pin Leakage ILH_FG — — 10 µA VFG = 14V
Current
Lock Protection TRUN — 0.5 — s
Operating Time
Lock Protection TWAIT 4.0 4.5 5.0 s
Waiting Time
Note 1: Minimum and maximum parameter is not production tested and is specified by design and validation.
Reference PCB, according to JEDEC standard EIA/JESD 51-9.

DS20005257B-page 4  2014 Microchip Technology Inc.

 MCP8063
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise specified, all limits are established for VDD = 12.0V,
Temperature = +25°C.
Parameters Sym. Min. Typ. Max. Units Conditions
Thermal Shutdown TSD — 170 — °C
Thermal Shutdown TSD_HYS — 25 — °C
Hysteresis
Input Over Voltage VOV — 18.5 — V
Note 1: Minimum and maximum parameter is not production tested and is specified by design and validation.
Reference PCB, according to JEDEC standard EIA/JESD 51-9.

TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise specified, all limits are established for VDD = 12.0V, TA = +25°C.
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Operating Temperature TOPR -40 — +125 °C
Storage Temperature Range TSTG -55 — +150 °C
Package Thermal Resistances
Thermal Resistance, 8LD 4x4 DFN JA — 48 — °C/W
JC — 7 — °C/W
Note 1: Minimum and maximum parameter is not production tested and is specified by design and validation.
Derating applies for ambient temperatures outside the specified operating range (refer to Figure 1-1).

2.5
DFN-8
2
PDMAX (W)

1.5

0.5

0
10
20
30
40
50
60
70
80
90

110
-10
0

100

120
130
140
150

TA (°C)
FIGURE 1-1: Allowable Power Dissipation (PD_MAX) as a Function of Ambient Temperature (TA).

 2014 Microchip Technology Inc. DS20005257B-page 5

MCP8063
2.0 TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated, TA = +25°C, VDD = 14V, OUT1, 2, 3 and PWM open.

16 75
Oscillator Frequency Deviation

14
12 70

PWM VIH (% of VBIAS)

10
VDD = 14V 65
8
(%)

VDD = 2V
6
VDD = 2V 60
4
2
55
0 VDD = 14V

-2 50
-40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (C°) Temperature (C°)

FIGURE 2-1: Oscillator Frequency FIGURE 2-4: Input (PWM) VIH vs.
Deviation vs. Temperature. Temperature.

3.5 1
VDD = 14V
0.9
3
0.8
VDD = 3.3V RON(H)
2.5 0.7
RON (ȍ)
VBIAS (V)

0.6
2
0.5
VDD = 2V RON(L)
1.5 0.4
1 0.3
0.2
0.5
0.1
0 0
-40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (C°) Temperature (C°)

FIGURE 2-2: Internal Regulated Voltage FIGURE 2-5: Output RON Resistance vs.
(VBIAS) vs. Temperature. Temperature (VDD = 3.3V).

50 8.2
8 VDD = 14V
45
IVDD Current (mA)

VDD = 14V
7.8
PWM VIL (% of VBIAS)

7.6
40
7.4
VDD = 2V
35 7.2
7
30
6.8
6.6
25
-40 -25 -10 5 20 35 50 65 80 95 110 125
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (C°)
Temperature (C°)
FIGURE 2-3: Input (PWM) VIL vs. FIGURE 2-6: Supply Current vs.
Temperature. Temperature.

DS20005257B-page 6  2014 Microchip Technology Inc.

 MCP8063
Note: Unless otherwise indicated, TA = +25°C, VDD = 14V, OUT1, 2, 3 and PWM open.

0.12
0.11
FG Pin Drive (V)

0.1
VDD = 2V
0.09
0.08
0.07
0.06 VDD = 3.3V

0.05
0.04
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (C°)

FIGURE 2-7: FG Output Pin Low Level FIGURE 2-10: Typical Outputs on Closed
Voltage (IFG = -1 mA). Loop.

0
-5
PWM Pull-Up Current (µA)

-10
-15 VDD = 2V

-20
-25
-30
VDD = 14V
-35
-40
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (C°)

FIGURE 2-8: PWM Pull-Up Current vs. FIGURE 2-11: Typical Rotor Lock Situation.
Temperature.

FIGURE 2-9: Typical Output on Start-Up.

 2014 Microchip Technology Inc. DS20005257B-page 7

MCP8063
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: MCP8063 PIN FUNCTION TABLE

MCP8063
Symbol Type Description
4x4 DFN
1 FG O Motor Speed Indication Output Pin
2 VBIAS P Internal Regulator Output Pin (for decoupling only)
3 OUT1 O Single-Phase Coil Output Pin
4 OUT2 O Single-Phase Coil Output Pin
5 GND P Negative Voltage Supply Pin (Ground)
6 OUT3 O Single-Phase Coil Output Pin
7 VDD P Positive Voltage Supply for Motor Driver Pin
8 PWM I PWM Input Signal for Speed Control Pin
9 EP P Exposed pad is used for thermal dissipation. Connect to GND.
Legend: I = Input; O = Output; P = Power

DS20005257B-page 8  2014 Microchip Technology Inc.

 MCP8063
4.0 FUNCTIONAL DESCRIPTION 4.3 Lock-Up Protection and Automatic
Restart
The MCP8063 device generates a full-wave signal to
drive a 3-phase sensorless BLDC motor. High If the motor is stopped (blocked) or if it loses
efficiency and low power consumption are achieved synchronization with the driver, a lock-up protection
due to DMOS transistors and synchronous rectification circuit detects this situation and ties the outputs to GND
drive type. The current carrying order of the output is as in order to dissipate the remaining energy from the
follows: OUT1  OUT2  OUT3. rotor with a minimum of self heating. After a “waiting
time” (TWAIT), the lock-up protection is released and
4.1 Speed Control normal operation resumes for a given time (TRUN). In
case the motor is still blocked, a new period of waiting
The rotational speed of the motor can be controlled time is started. TWAIT and TRUN timings are fixed
either through the PWM digital input signal or by internally, so that no external capacitor is needed.
varying the power supply (VDD). When the PWM signal
is “High” (or left open), the motor rotates at full speed.
4.4 Overcurrent Limitation
When the PWM signal is “Low”, the motor is stopped
(and the driver outputs are set to high impedance). By The motor peak current is limited by the driver to a fixed
changing the PWM duty cycle, the speed can be value (defined internally), thus limiting the maximum
adjusted. Notice that the PWM frequency has no power dissipation in the coils.
special meaning for the motor speed and is
asynchronous with the activation of the output 4.5 Thermal Shutdown
transistors. Thus, the user has maximum freedom to
choose the PWM system frequency within a wide range The MCP8063 device has a thermal protection function
(from 20 Hz to 100 kHz), while the output transistor which detects when the die temperature exceeds
activation always occurs at a fixed rate, which is TSD = +170°C. When this temperature is reached, the
outside the range of audible frequencies. The typical circuit enters Thermal Shutdown mode and the outputs
output frequency of MCP8063 is 23 kHz. OUT1, OUT2 and OUT3 are tied to GND in order to
dissipate the remaining energy from the rotor with a
minimum of self-heating. Once the junction
4.2 Frequency Generator Function
temperature (TSD) has dropped below +145°C, the
The Frequency Generator output is a “Hall-sensor normal operation resumes (the thermal detection
equivalent” digital output, giving information to an circuit has +25°C hysteresis function).
external controller about the speed and phase of the
motor. The FG pin is an open-drain output, connecting Thermal Shutdown
to a logical voltage level through an external pull-up
resistor. When a lock (or out-of-sync) situation is
detected by the driver, this output is set to high
impedance until the motor is restarted. Leave the pin
open when not used. The FG signal can be used to
compute the motor speed in rotations per minute Normal operation
(RPM). Typically, for a four-pole BLDC fan (4P/6S), the
speed in RPMs is 30 x FG frequency (Hz). TSD
+145°C +170°C
EQUATION 1-1: FIGURE 4-1: Thermal Protection
Hysteresis.
FG  720
----------------------- = Rotor speed RPM
P  S  4.6 Internal Voltage Regulator
VBIAS voltage is generated internally and is used to
Where: supply internal logical blocks. The VBIAS pin is used to
connect an external decoupling capacitor (1 µF or
P = Total number of poles in the motor
higher). Notice that this pin is for IC internal use and is
S = Total number of slots in the motor not designed to supply DC current to external blocks.

4.7 Overvoltage Shutdown

The MCP8063 device has an overvoltage protection
function which detects when the VDD voltage exceeds
VOV = +18.5V. When this temperature is reached, the
circuit enters Thermal Shutdown mode, and outputs
OUT1, OUT2 and OUT3 are disabled (high impedance).

 2014 Microchip Technology Inc. DS20005257B-page 9

MCP8063
5.0 PACKAGING INFORMATION

5.1 Package Marking Information

8-Lead DFN (4x4x0.9 mm) Example

XXXXXX 8063
XXXXXX 300EMD
YYWW 1442
256
NNN
PIN 1 PIN 1

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
e3 Pb-free JEDEC® designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

DS20005257B-page 10  2014 Microchip Technology Inc.

 MCP8063

8-Lead Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

Microchip Technology Drawing C04-131E Sheet 1 of 2

 2014 Microchip Technology Inc. DS20005257B-page 11

MCP8063

8-Lead Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

Microchip Technology Drawing C04-131E Sheet 2 of 2

DS20005257B-page 12  2014 Microchip Technology Inc.

 MCP8063

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

 2014 Microchip Technology Inc. DS20005257B-page 13

MCP8063
NOTES:

DS20005257B-page 14  2014 Microchip Technology Inc.

 MCP8063
APPENDIX A: REVISION HISTORY

Revision B (November 2014)

The following is the list of modifications:
1. Changed FG Maximum Output Voltage values
under Absolute Maximum Ratings† section
2. Changed Power Supply Voltage value under
Absolute Maximum Ratings† section.
3. Added Input Overvoltage Value in Electrical
Characteristics table.
4. Minor typographical corrections.

Revision A (February 2014)

• Original Release of this Document.

 2014 Microchip Technology Inc. DS20005257B-page 15

MCP8063
NOTES:

DS20005257B-page 16  2014 Microchip Technology Inc.

 MCP8063
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. X -X /XX Examples:

Device Tube/Tape and Reel Temperature Package a) MCP8063-E/MD: Extended temperature,
8LD 4x4 DFN package
Range
b) MCP8063T-E/MD: Extended temperature,
8LD 4x4 DFN package,
Device: MCP8063: 3-Phase BLDC Sinusoidal Sensorless Motor Driver Tape and Reel
MCP8063T: 3-Phase BLDC Sinusoidal Sensorless Motor Driver
(Tape and Reel)

Temperature E = -40°C to +125°C (Extended)

Range:

Package: MD = 8-Lead Plastic Dual Flat, No Lead – 4x4x0.9 mm Body (DFN)

 2014 Microchip Technology Inc. DS20005257B-page 17

MCP8063
NOTES:

DS20005257B-page 18  2014 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
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and may be superseded by updates. It is your responsibility to
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All other trademarks mentioned herein are property of their
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© 2014, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-63276-791-2

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CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California
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== ISO/TS 16949 ==
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

 2014 Microchip Technology Inc. DS20005257B-page 19

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Novi, MI Tel: 86-21-5407-5533 Fax: 65-6334-8850 Tel: 44-118-921-5800
Tel: 248-848-4000 Fax: 86-21-5407-5066
Taiwan - Hsin Chu Fax: 44-118-921-5820
Houston, TX
China - Shenyang Tel: 886-3-5778-366
Tel: 281-894-5983
Tel: 86-24-2334-2829 Fax: 886-3-5770-955
Indianapolis Fax: 86-24-2334-2393
Noblesville, IN Taiwan - Kaohsiung
Tel: 317-773-8323
China - Shenzhen Tel: 886-7-213-7830
Tel: 86-755-8864-2200
Fax: 317-773-5453 Taiwan - Taipei
Fax: 86-755-8203-1760 Tel: 886-2-2508-8600
Los Angeles
China - Wuhan Fax: 886-2-2508-0102
Mission Viejo, CA
Tel: 86-27-5980-5300
Tel: 949-462-9523 Thailand - Bangkok
Fax: 86-27-5980-5118 Tel: 66-2-694-1351
Fax: 949-462-9608
China - Xian Fax: 66-2-694-1350
New York, NY
Tel: 631-435-6000 Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
San Jose, CA
Tel: 408-735-9110 China - Xiamen
Tel: 86-592-2388138
Canada - Toronto
Fax: 86-592-2388130
Tel: 905-673-0699
Fax: 905-673-6509 China - Zhuhai
Tel: 86-756-3210040
03/25/14
Fax: 86-756-3210049

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