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ADVANCED
CIRCUITS
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MIL-PRF-31032
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‘AS9100D
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IPC-6012 CLASS 2/3A
UL CERTIFIED
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SOM UT ate
Crean ea hed
CAPABILITIES OVERVIEW‘STANDARD FRA. 40 LAYERS MINIMUM CONDUCTOR WIDTH & SPACING:
ISOLA FR406, 40 LAYERS INTERNAL STARTING COPPER WEIGHT 1/2 OZ.
> 0.00275" LINE / 0.003" SPACE
INTERNAL STARTING COPPER WEIGHT 1 OZ.
VENTEC VI-441, VT-447. 40 LAYERS > 0.00375" LINE / 0.0045" SPACE
ISOLA TERRAGREEN. 40 LAYERS INTERNAL STARTING COPPER WEIGHT 2 OZ.
> 0.005" LINE / 0.006" SPACE
INTERNAL STARTING COPPER WEIGHT 3 OZ.
ITEO I-180A. 30 LAYERS > 0.009" LINE / 0.011" SPACE
ISOLA 185HR, 30 LAYERS INTERNAL STARTING COPPER WEIGHT 4 7.
ISOLA 370HR, 40 LAYERS » 0.012" LINE / 0.016" SPACE
FR4O8HR, 40 LAYERS
Se Gun MINIMUM CONDUCTOR WIDTH & SPACING:
: EXTERNAL COPPER FINISHED THICKNESS 1.0 07.
NELCO 4000-28. 40 LAYERS Ranogys ERICH
NELCO 4000-13 & 13SI. 40 LAYERS
EXTERNAL COPPER FINISHED THICKNESS 1.5 OZ.
NELCO 4000-13EP & EPSI. 40 LAYERS » 0.004" FINISHED
POLYIMIDE. 40 LAYERS
Ee YANITE ESTER SoTAvERS [irae COR at ecadeees 0
EXTERNAL COPPER FINISHED THICKNESS 3.0 07.
» 0,009" FINISHED
eee ee EXTERNAL COPPER FINISHED THICKNESS 4.0 OZ.
(FR-4W/ RO3000 CAPS) i aDT0 FINISHED
neers BCL & Ses Pica EXTERNAL COPPER FINISHED THICKNESS 5.0 OZ.
ROGERS 5870/5880. SLAYERS > 0.020" FINISHED
PACONIE RE MATERIALS oe EXTERNAL COPPER FINISHED THICKNESS 6.0 OZ.
ISOLA 1S680. 40 LAYERS > 0.030" FINISHED
Pee ee ee EXTERNAL COPPER FINISHED THICKNESS 7.0 OZ.
ISOLA ASTRA MT77 40 LAYERS > 0.045" FINISHED
EXTERNAL COPPER FINISHED THICKNESS 8.0 07.
» 0,060" FINISHED
NELCO 9000 SERIES (PTFE). 2 LAYERS
ROGERS 6000 SERIES. 4 LAYERS
ROGERS 5000 SERIES. 2 LAYERS
ROGERS DICLAD 880, 20 LAYERS COMPONENT HOLES. DRILLED SIZE PLUS 0.006"
ROGERS AD3OOA 20 LAYERS VIA HOLES. DRILLED SIZE PLUS 0.006"
ROGERS CUCLAD 250 & 233. 20 LAYERS
ROGERS CTLE. 20 LAYERS
ISOLA I-SPEED. 40 LAYERS
ARLON GENCLAD 280. TOLAYERS COMPONENT HOLES. DRILLED SIZE PLUS 0.012"
ARLON LX250. TOLAYERS VIAHOLES. DRILLED SIZE PLUS 0.010"
ARLON GYN 2.17 DK. TOLAYERS
PANASONIC MEGTRON 6. AVAILABLE MINIMUM. DRILLED SIZE PLUS 0.004"
3M ECM. AVAILABLE ‘STANDARD. DRILLED SIZE PLUS 0.008"
ROHACELL. 12 LAYERS
TTACONIC FASTRISE 27 & 28 BONDPLY. AVAILABLE
ISOLA TACHYON 1006. 40 LAYERS
ISOLA I-TERA MT4O. 40 LAYERS
ROGERS 2929 BONDPLY. AVAILABLE
‘ARLON 6700 & 6250 BONDPLY. AVAILABLE EPOXY FILLED / NON-CONDUCTIVE:
EPOXY FILLED THRU HOLE CAPABILITY.......YES
EPOXY FILLED THRU HOLE MINIMUM. 0.004" FHS
EPOXY FILLED THRU HOLE MAXIMUM. 0.040" FHS
MINIMUM BOARD THICKNESS. 0.015"
MAXIMUM BOARD THICKNESS. 0.187"
HEAVY COPPER up 10 2007 VIA FILL ASPECT RATIO. 10:1
HEATSINKS. AVAILABLE
BACKPLATES. AVAILABLE COPPER PLATED/FILLED:
2 LYRS UP TO 37° X 96" W/ NPT'S. AVAILABLE COPPER FILLED pVlA PROCESS. YES
ROHACELL FOAM BONDING. AVAILABLE COPPER FILLED pVIA HOLE MIN... 0.003” LASER DRILLED
BURIED CHIPS & RESISTORS. AVAILABLE COPPER FILLED pVIA HOLE MAX.....0.010" LASER DRILLED
RESISTANCE & CONDUCTANCE TEST. AVAILABLE VIAFILL ASPECT RATIO....0.75:1 STANDARD/1:1 ADVANCEDMECHANICAL
MACHINING DRILL CAPABILITIES
PRIMARY DRILLED HOLE LOCATION TOLERANCE TO DATUM ZERO (DTP).
2ND DRILL HOLE LOCATION TOLERANCE TO DATUM ZERO (OTP).
MINIMUM CLEARANCE FROM COPPER CONDUCTOR TO MECHANICAL DRILLED HOLE.
MINIMUM CLEARANCE FROM COPPER CONDUCTOR TO A LASER DRILLED HOLE.
PLATED THROUGH HOLES
‘SMALLEST PLATED THROUGH HOLE SIZE WITH 0.001" MINIMUM AVERAGE COPPER REQUIREMENT
FINISHED PANEL THICKNESS < 0.020". 0.003" FINISHED HOLE
FINISHED PANEL THICKNESS 0.031”... nnn svn.003" FINISHED HOLE
FINISHED PANEL THICKNESS 0.062"... nnn -vn.004" FINISHED HOLE
FINISHED PANEL THICKNESS 0.093”... nnn snn(0,008" FINISHED HOLE
FINISHED PANEL THICKNESS 0.125"... enn s.n0.010" FINISHED HOLE
FINISHED PANEL THICKNESS 0.187”... = 0.012" FINISHED HOLE
FINISHED PANEL THICKNESS 0.250". 0,018" FINISHED HOLE (EXCLUDING HAL FINISH)
PLATED HOLE SIZE TOLERANCE... ee ssnmnneen #1 0,003" STANDARD ; 4/- 0.002" SPECIAL
PLATED HOLE SIZE PRESS FIT APPLICATIONS. 0.0. smn smnn#f 0,002" TYPICAL
ASPECT RATIO (WITH 0.010" DRILL)... ieee ee 510007 NSH pio 12ogrHc)
PLATED HOLE SPACING MIN. (DRILLED HOLE TO HOLE)... : a 7 0.008"
NON-PLATED THROUGH HOLES
SMALLEST NON-PLATED HOLE SIZE... 0.006" LARGEST NON-PLATED HOLE SIZE ROUTED............NO LIMIT
NON-PLATED ROUTED HOLE TOLERANCE... sosnsnsonsnt= 0,005" TYPICAL; +/- 0,003" SPECIAL
MINIMUM NPTH TO EDGE OF BOARD SPACING. 0.010"
BLIND / BURIED VIAS (sequeNTiAL LAMINATION)
MIN. FINISHED VIA HOLE DIAMETER (EPOXY FILLED)....0.006" MAX. FINISHED VIA HOLE DIAMETER (EPOXY FILLED).....0.04"
MAX, ASPECT RATIO FOR EPOXY FILLED VIA HOLES. 10:1
AVAILABLE EPOXY FILL TYPES. CONDUCTIVE & NON-CONDUCTIVE
HDI / LASER MICROVIA (uVIA) CAPABILITIES
‘SMALLEST (AS ABLATED) LASER VIA. 0,003" LARGEST (AS ABLATED) LASER VIA. 0.010"
VIA ASPECT RATIO (DEPTH TO DIAMETER). ee snnnsnee O.5:1 STANDARD; 1:1 ADVANCED
CAPTURE PAD SIZE... a VIA +0.008" STANDARD; pVIA +0.006" ADVANCED
LANDING PAD SIZE....renn oe : .. HIA +0,008" STANDARD; wa 40.006" ADVANCED
STACKED VIA coossnsnsnsnsnsnnenennnncannane¥ES COPPER FILLED MICROVIA, 0.2 sone YES,
TYPE | CAPABILITIES. YES
‘TYPE II CAPABILITIES. YES
TYPE III CAPABILITIES... oe DESION DEPENDENT,
CONTROL DEPTH / BACK DRILLING CAPABILITIES
BACKDRILL - PTH STUB REMOVAL. PTH + 0.010" DIAMETER (TYPICAL)
MINIMUM BACKSIDE DIELECTRIC SEPARATION. .......00::esse a soniininsnennsesnnnsernnnsees 0.005"
CONTROL DEPTH DRILL DEPTH TOLERANCE. = = a w». +- 0,004"
EDGE MILLING AVAILABLE... 7 essen 7 7 a YES
MINIMUM BACK DRILL DIAMETER... sessnenssnnesn onstennesnnns a vee 0.014"
DRILLED HOLE OVER FINISHED HOLE SIZE.........- Ss = : 0.010"
DRILL DEPTH TOLERANCE. .005" TYPICAL; 0.004” MINIMUM
SCORING CAPABILITIES
ANGLES. ‘STANDARD 30°; AVAILABLE 20°, 45°, & 60"
OFFSET TOLERANCE. +/-0.005"
OPTIMUM REMAINING WEB THICKNESS. TYPICAL MAX. 1/3 OF THICKNESS
REMAINING WEB TOLERANCE. +/-0.005" ‘TRUE POSITION TOLERANCE. +/-0.005"
EDGE CONNECTOR BEVEL CAPABILITIES
FINGER TIP ANGLE. 15°, 20°, 30°, 45°
BEVEL DEPTH TOLERANCE. +4#/-0.005"
PROFILE CAPABILITIES
STANDARD ROUTER BIT DIAMETER.......0.000 .».» 0,093", 0,062", 0.031" (ROUTER BITS); 0.021" SPECIAL
ROUTED PROFILE TOLERANCE. +/-0.005" STANDARD; +/-0.004" SPECIAL
MINIMUM INTERNAL ROUT RADIUS. 0.0105"
MINIMUM ROUTED PTH SLOT WIDTH. 0.022" TYPICAL W/ 0.008" MIN.
CONTROLLED DEPTH MILLING. YES
LASER ROUTING. 0.001" MIN. RADIUSMIN. LPI SOLDER MASK CLEARANCE (FLOOD)
» 0.002" / SIDE (PAD SIZE + 0.004")
MIN. LPI SOLDER MASK CLEARANCE (LD! IMAGED)
» 1:1 (DESIGN DEPENDENT)
PAD SIZE LARGER THAN NPTH
» 0,005" / SIDE (PAD SIZE + 0.010")
WEB BETWEEN SURFACE MOUNT PADS
> 0.004" PREFERRED, 0.002” MINIMUM (GREEN)
LEW PROCESSING
» 0,005" MIN. LEW /CLEAR UNDERCOAT
SOLDER MASK COLORS
» GREEN, MATTE GREEN, BLUE, RED, BLACK, MATTE
BLACK, YELLOW, LEW WHITE, WHITE, ORANGE,
PURPLE, PINK, BROWN, CLEAR
SOLDER MASK TYPE
» LIQUID PHOTO IMAGEABLE (LPI)
> LASER DIRECT IMAGING (LD!) SPECIAL
MIN. MASK DEFINED PAD DIAMETER
SOLDER MASK PLUGGED VIAS.
PRINTED LEGEND MINIMUM STROKE/WIDTH.
LPI LEGEND CAPABILITY.
LPI LEGEND MINIMUM STROKE/WIDTH.
SCREENED / LPI LEGEND COLORS
> WHITE, BLACK, YELLOW, RED, BLUE
SERIALIZATION / UNIQUE SERIALIZATION.
HOT AIR SOLDER LEVEL (LEAD-FREE, LEAD BASED).
IMMERSION SILVER.
Yes
YES
osp. YES (OUTSOURCED)
ELECTROLESS NICKEL IMMERSION GOLD.
ENEPIG.
IMMERSION TIN,
FULL BODY GOLD.
BONDABLE GOLD.
PLATED NICKEL.
ELECTROLESS NICKEL.
COPPER,
HOT OIL REFLOW.
HASL WITH SELECTIVE GOLD.
DUAL GOLD PLATING.
IMMERSION GOLD W/ HARD GOLD ON FINGERS.
RECESSED FINGERS.
FOR 12" X 18" PANEL.
FOR 18" X 24” PANEL.
FOR 18" X 27" PANEL.
FOR 18" X 32" PANEL.
FOR 18" X 36" PANEL.
FOR 18" X 42" PANEL.
FOR 18" X 54" PANEL.
FOR 21" X 24” PANEL.
FOR 21" X 60" PANEL.
FOR 24" X 30" PANEL.
10" X16"
16" X 25"
16" X30"
19° X22"
18" X58”
22" X28"
YES
YES
YES (OUTSOURCED)
YES
YES (OUTSOURCED)
YES
Yes
YES
YES
(UP TO 40 LAYERS)
16.6" X 22" (UP TO 40 LAYERS)
(UP TO 8 LAYERS)
(UP TO 8 LAYERS)
(UP TO 8 LAYERS)
(UP TO 8 LAYERS)
(UP TO 8 LAYERS)
(UP TO 30 LAYERS)
(UP TO 8 LAYERS)
(UP TO 8 LAYERS)
OVERALL BOARD THICKNESS. 0,010" - 0,250"
OVERALL BOARD TOLERANCES:
<0.020". STANDARD +/-0.004" SPECIAL +/-0.003"
0.031" STANDARD +/-0.004" SPECIAL +/-0.003"
0.062" STANDARD +/-0.006" SPECIAL +/-0.003"
0.093" STANDARD +/-0.009" SPECIAL +/-0.006"
0.125" STANDARD +/-0.012" SPECIAL +/-0.009"
0.187" STANDARD +/-0.018" SPECIAL +/-0.014"
0.250" STANDARD +/-0.025" SPECIAL +/-0.018"
THINNEST DIELECTRIC FINISHED:
OVERALL THICKNESS......0.010" 2 LAYER / 0.015" 4 LAYER
THINNEST PLATED CORE. 0.008"
TDR TEST TOLERANCE (PRINT & ETCH)
> STANDARD 10% / ADVANCED 5%
TDR TEST TOLERANCE (PLATED COPPER)
> STANDARD 10% / ADVANCED 5%
TDR TEST TOLERANCE DIFFERENTIAL MEASUREMENTS
> STANDARD 10% / ADVANCED 5%
TDR TOLERANCE SINGLE ENDED TOLERANCE
> STANDARD 10% / ADVANCED 5%
HIPOT TESTING (AC & DC)
FILM DATA FORMATS.
» DXF; RS-274-X; RS-274-D; ODB++
DRILL DATA FORMATS
» ASCII, EXCELLON FORMAT; RS-274-X; RS-274-D
ELECTRICAL TEST FORMATS
Ipc-D356
NETLIST COMPARE FORMATS.
» IPC-D356; IPC-D356A
COMPRESSION FORMATS
» ZIP; TAR; TGZ
‘SECURED DATA TRANSFER METHODS
> SECURE DATA TRANSFER; PGP
IPC CLASS 3 ETCHBACK SPECIFICATION......0.0002"-0.002"
MIN. TEST CONTINUITY RESISTANCE.
MAX. TEST VOLTAGE.
MAX. TEST ISOLATED RESISTANCE,
LARGEST TEST - FIXTURED.
LARGEST TEST - FLYING PROBE,
E-TEST PITCH (FIXTURE TEST), 0.020"
E-TEST PITCH (FLYING PROBE TEST)......0.004”
DC LINE RESISTANCE TESTING. YES
0.1 OHMS
1000 voLTs
25 MOHM-2G0HM
16" X22"
27" X24"