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Capabilities 2018

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0% found this document useful (0 votes)
47 views4 pages

Capabilities 2018

789

Uploaded by

kedije6864
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF or read online on Scribd
ADVANCED CIRCUITS Doel UG oary Neuss} ea od ae) 2) MIL-PRF-31032 ie aan) ‘AS9100D ToR Ta] Meares) IPC-6012 CLASS 2/3A UL CERTIFIED SEIN ae ey SOM UT ate Crean ea hed CAPABILITIES OVERVIEW ‘STANDARD FRA. 40 LAYERS MINIMUM CONDUCTOR WIDTH & SPACING: ISOLA FR406, 40 LAYERS INTERNAL STARTING COPPER WEIGHT 1/2 OZ. > 0.00275" LINE / 0.003" SPACE INTERNAL STARTING COPPER WEIGHT 1 OZ. VENTEC VI-441, VT-447. 40 LAYERS > 0.00375" LINE / 0.0045" SPACE ISOLA TERRAGREEN. 40 LAYERS INTERNAL STARTING COPPER WEIGHT 2 OZ. > 0.005" LINE / 0.006" SPACE INTERNAL STARTING COPPER WEIGHT 3 OZ. ITEO I-180A. 30 LAYERS > 0.009" LINE / 0.011" SPACE ISOLA 185HR, 30 LAYERS INTERNAL STARTING COPPER WEIGHT 4 7. ISOLA 370HR, 40 LAYERS » 0.012" LINE / 0.016" SPACE FR4O8HR, 40 LAYERS Se Gun MINIMUM CONDUCTOR WIDTH & SPACING: : EXTERNAL COPPER FINISHED THICKNESS 1.0 07. NELCO 4000-28. 40 LAYERS Ranogys ERICH NELCO 4000-13 & 13SI. 40 LAYERS EXTERNAL COPPER FINISHED THICKNESS 1.5 OZ. NELCO 4000-13EP & EPSI. 40 LAYERS » 0.004" FINISHED POLYIMIDE. 40 LAYERS Ee YANITE ESTER SoTAvERS [irae COR at ecadeees 0 EXTERNAL COPPER FINISHED THICKNESS 3.0 07. » 0,009" FINISHED eee ee EXTERNAL COPPER FINISHED THICKNESS 4.0 OZ. (FR-4W/ RO3000 CAPS) i aDT0 FINISHED neers BCL & Ses Pica EXTERNAL COPPER FINISHED THICKNESS 5.0 OZ. ROGERS 5870/5880. SLAYERS > 0.020" FINISHED PACONIE RE MATERIALS oe EXTERNAL COPPER FINISHED THICKNESS 6.0 OZ. ISOLA 1S680. 40 LAYERS > 0.030" FINISHED Pee ee ee EXTERNAL COPPER FINISHED THICKNESS 7.0 OZ. ISOLA ASTRA MT77 40 LAYERS > 0.045" FINISHED EXTERNAL COPPER FINISHED THICKNESS 8.0 07. » 0,060" FINISHED NELCO 9000 SERIES (PTFE). 2 LAYERS ROGERS 6000 SERIES. 4 LAYERS ROGERS 5000 SERIES. 2 LAYERS ROGERS DICLAD 880, 20 LAYERS COMPONENT HOLES. DRILLED SIZE PLUS 0.006" ROGERS AD3OOA 20 LAYERS VIA HOLES. DRILLED SIZE PLUS 0.006" ROGERS CUCLAD 250 & 233. 20 LAYERS ROGERS CTLE. 20 LAYERS ISOLA I-SPEED. 40 LAYERS ARLON GENCLAD 280. TOLAYERS COMPONENT HOLES. DRILLED SIZE PLUS 0.012" ARLON LX250. TOLAYERS VIAHOLES. DRILLED SIZE PLUS 0.010" ARLON GYN 2.17 DK. TOLAYERS PANASONIC MEGTRON 6. AVAILABLE MINIMUM. DRILLED SIZE PLUS 0.004" 3M ECM. AVAILABLE ‘STANDARD. DRILLED SIZE PLUS 0.008" ROHACELL. 12 LAYERS TTACONIC FASTRISE 27 & 28 BONDPLY. AVAILABLE ISOLA TACHYON 1006. 40 LAYERS ISOLA I-TERA MT4O. 40 LAYERS ROGERS 2929 BONDPLY. AVAILABLE ‘ARLON 6700 & 6250 BONDPLY. AVAILABLE EPOXY FILLED / NON-CONDUCTIVE: EPOXY FILLED THRU HOLE CAPABILITY.......YES EPOXY FILLED THRU HOLE MINIMUM. 0.004" FHS EPOXY FILLED THRU HOLE MAXIMUM. 0.040" FHS MINIMUM BOARD THICKNESS. 0.015" MAXIMUM BOARD THICKNESS. 0.187" HEAVY COPPER up 10 2007 VIA FILL ASPECT RATIO. 10:1 HEATSINKS. AVAILABLE BACKPLATES. AVAILABLE COPPER PLATED/FILLED: 2 LYRS UP TO 37° X 96" W/ NPT'S. AVAILABLE COPPER FILLED pVlA PROCESS. YES ROHACELL FOAM BONDING. AVAILABLE COPPER FILLED pVIA HOLE MIN... 0.003” LASER DRILLED BURIED CHIPS & RESISTORS. AVAILABLE COPPER FILLED pVIA HOLE MAX.....0.010" LASER DRILLED RESISTANCE & CONDUCTANCE TEST. AVAILABLE VIAFILL ASPECT RATIO....0.75:1 STANDARD/1:1 ADVANCED MECHANICAL MACHINING DRILL CAPABILITIES PRIMARY DRILLED HOLE LOCATION TOLERANCE TO DATUM ZERO (DTP). 2ND DRILL HOLE LOCATION TOLERANCE TO DATUM ZERO (OTP). MINIMUM CLEARANCE FROM COPPER CONDUCTOR TO MECHANICAL DRILLED HOLE. MINIMUM CLEARANCE FROM COPPER CONDUCTOR TO A LASER DRILLED HOLE. PLATED THROUGH HOLES ‘SMALLEST PLATED THROUGH HOLE SIZE WITH 0.001" MINIMUM AVERAGE COPPER REQUIREMENT FINISHED PANEL THICKNESS < 0.020". 0.003" FINISHED HOLE FINISHED PANEL THICKNESS 0.031”... nnn svn.003" FINISHED HOLE FINISHED PANEL THICKNESS 0.062"... nnn -vn.004" FINISHED HOLE FINISHED PANEL THICKNESS 0.093”... nnn snn(0,008" FINISHED HOLE FINISHED PANEL THICKNESS 0.125"... enn s.n0.010" FINISHED HOLE FINISHED PANEL THICKNESS 0.187”... = 0.012" FINISHED HOLE FINISHED PANEL THICKNESS 0.250". 0,018" FINISHED HOLE (EXCLUDING HAL FINISH) PLATED HOLE SIZE TOLERANCE... ee ssnmnneen #1 0,003" STANDARD ; 4/- 0.002" SPECIAL PLATED HOLE SIZE PRESS FIT APPLICATIONS. 0.0. smn smnn#f 0,002" TYPICAL ASPECT RATIO (WITH 0.010" DRILL)... ieee ee 510007 NSH pio 12ogrHc) PLATED HOLE SPACING MIN. (DRILLED HOLE TO HOLE)... : a 7 0.008" NON-PLATED THROUGH HOLES SMALLEST NON-PLATED HOLE SIZE... 0.006" LARGEST NON-PLATED HOLE SIZE ROUTED............NO LIMIT NON-PLATED ROUTED HOLE TOLERANCE... sosnsnsonsnt= 0,005" TYPICAL; +/- 0,003" SPECIAL MINIMUM NPTH TO EDGE OF BOARD SPACING. 0.010" BLIND / BURIED VIAS (sequeNTiAL LAMINATION) MIN. FINISHED VIA HOLE DIAMETER (EPOXY FILLED)....0.006" MAX. FINISHED VIA HOLE DIAMETER (EPOXY FILLED).....0.04" MAX, ASPECT RATIO FOR EPOXY FILLED VIA HOLES. 10:1 AVAILABLE EPOXY FILL TYPES. CONDUCTIVE & NON-CONDUCTIVE HDI / LASER MICROVIA (uVIA) CAPABILITIES ‘SMALLEST (AS ABLATED) LASER VIA. 0,003" LARGEST (AS ABLATED) LASER VIA. 0.010" VIA ASPECT RATIO (DEPTH TO DIAMETER). ee snnnsnee O.5:1 STANDARD; 1:1 ADVANCED CAPTURE PAD SIZE... a VIA +0.008" STANDARD; pVIA +0.006" ADVANCED LANDING PAD SIZE....renn oe : .. HIA +0,008" STANDARD; wa 40.006" ADVANCED STACKED VIA coossnsnsnsnsnsnnenennnncannane¥ES COPPER FILLED MICROVIA, 0.2 sone YES, TYPE | CAPABILITIES. YES ‘TYPE II CAPABILITIES. YES TYPE III CAPABILITIES... oe DESION DEPENDENT, CONTROL DEPTH / BACK DRILLING CAPABILITIES BACKDRILL - PTH STUB REMOVAL. PTH + 0.010" DIAMETER (TYPICAL) MINIMUM BACKSIDE DIELECTRIC SEPARATION. .......00::esse a soniininsnennsesnnnsernnnsees 0.005" CONTROL DEPTH DRILL DEPTH TOLERANCE. = = a w». +- 0,004" EDGE MILLING AVAILABLE... 7 essen 7 7 a YES MINIMUM BACK DRILL DIAMETER... sessnenssnnesn onstennesnnns a vee 0.014" DRILLED HOLE OVER FINISHED HOLE SIZE.........- Ss = : 0.010" DRILL DEPTH TOLERANCE. .005" TYPICAL; 0.004” MINIMUM SCORING CAPABILITIES ANGLES. ‘STANDARD 30°; AVAILABLE 20°, 45°, & 60" OFFSET TOLERANCE. +/-0.005" OPTIMUM REMAINING WEB THICKNESS. TYPICAL MAX. 1/3 OF THICKNESS REMAINING WEB TOLERANCE. +/-0.005" ‘TRUE POSITION TOLERANCE. +/-0.005" EDGE CONNECTOR BEVEL CAPABILITIES FINGER TIP ANGLE. 15°, 20°, 30°, 45° BEVEL DEPTH TOLERANCE. +4#/-0.005" PROFILE CAPABILITIES STANDARD ROUTER BIT DIAMETER.......0.000 .».» 0,093", 0,062", 0.031" (ROUTER BITS); 0.021" SPECIAL ROUTED PROFILE TOLERANCE. +/-0.005" STANDARD; +/-0.004" SPECIAL MINIMUM INTERNAL ROUT RADIUS. 0.0105" MINIMUM ROUTED PTH SLOT WIDTH. 0.022" TYPICAL W/ 0.008" MIN. CONTROLLED DEPTH MILLING. YES LASER ROUTING. 0.001" MIN. RADIUS MIN. LPI SOLDER MASK CLEARANCE (FLOOD) » 0.002" / SIDE (PAD SIZE + 0.004") MIN. LPI SOLDER MASK CLEARANCE (LD! IMAGED) » 1:1 (DESIGN DEPENDENT) PAD SIZE LARGER THAN NPTH » 0,005" / SIDE (PAD SIZE + 0.010") WEB BETWEEN SURFACE MOUNT PADS > 0.004" PREFERRED, 0.002” MINIMUM (GREEN) LEW PROCESSING » 0,005" MIN. LEW /CLEAR UNDERCOAT SOLDER MASK COLORS » GREEN, MATTE GREEN, BLUE, RED, BLACK, MATTE BLACK, YELLOW, LEW WHITE, WHITE, ORANGE, PURPLE, PINK, BROWN, CLEAR SOLDER MASK TYPE » LIQUID PHOTO IMAGEABLE (LPI) > LASER DIRECT IMAGING (LD!) SPECIAL MIN. MASK DEFINED PAD DIAMETER SOLDER MASK PLUGGED VIAS. PRINTED LEGEND MINIMUM STROKE/WIDTH. LPI LEGEND CAPABILITY. LPI LEGEND MINIMUM STROKE/WIDTH. SCREENED / LPI LEGEND COLORS > WHITE, BLACK, YELLOW, RED, BLUE SERIALIZATION / UNIQUE SERIALIZATION. HOT AIR SOLDER LEVEL (LEAD-FREE, LEAD BASED). IMMERSION SILVER. Yes YES osp. YES (OUTSOURCED) ELECTROLESS NICKEL IMMERSION GOLD. ENEPIG. IMMERSION TIN, FULL BODY GOLD. BONDABLE GOLD. PLATED NICKEL. ELECTROLESS NICKEL. COPPER, HOT OIL REFLOW. HASL WITH SELECTIVE GOLD. DUAL GOLD PLATING. IMMERSION GOLD W/ HARD GOLD ON FINGERS. RECESSED FINGERS. FOR 12" X 18" PANEL. FOR 18" X 24” PANEL. FOR 18" X 27" PANEL. FOR 18" X 32" PANEL. FOR 18" X 36" PANEL. FOR 18" X 42" PANEL. FOR 18" X 54" PANEL. FOR 21" X 24” PANEL. FOR 21" X 60" PANEL. FOR 24" X 30" PANEL. 10" X16" 16" X 25" 16" X30" 19° X22" 18" X58” 22" X28" YES YES YES (OUTSOURCED) YES YES (OUTSOURCED) YES Yes YES YES (UP TO 40 LAYERS) 16.6" X 22" (UP TO 40 LAYERS) (UP TO 8 LAYERS) (UP TO 8 LAYERS) (UP TO 8 LAYERS) (UP TO 8 LAYERS) (UP TO 8 LAYERS) (UP TO 30 LAYERS) (UP TO 8 LAYERS) (UP TO 8 LAYERS) OVERALL BOARD THICKNESS. 0,010" - 0,250" OVERALL BOARD TOLERANCES: <0.020". STANDARD +/-0.004" SPECIAL +/-0.003" 0.031" STANDARD +/-0.004" SPECIAL +/-0.003" 0.062" STANDARD +/-0.006" SPECIAL +/-0.003" 0.093" STANDARD +/-0.009" SPECIAL +/-0.006" 0.125" STANDARD +/-0.012" SPECIAL +/-0.009" 0.187" STANDARD +/-0.018" SPECIAL +/-0.014" 0.250" STANDARD +/-0.025" SPECIAL +/-0.018" THINNEST DIELECTRIC FINISHED: OVERALL THICKNESS......0.010" 2 LAYER / 0.015" 4 LAYER THINNEST PLATED CORE. 0.008" TDR TEST TOLERANCE (PRINT & ETCH) > STANDARD 10% / ADVANCED 5% TDR TEST TOLERANCE (PLATED COPPER) > STANDARD 10% / ADVANCED 5% TDR TEST TOLERANCE DIFFERENTIAL MEASUREMENTS > STANDARD 10% / ADVANCED 5% TDR TOLERANCE SINGLE ENDED TOLERANCE > STANDARD 10% / ADVANCED 5% HIPOT TESTING (AC & DC) FILM DATA FORMATS. » DXF; RS-274-X; RS-274-D; ODB++ DRILL DATA FORMATS » ASCII, EXCELLON FORMAT; RS-274-X; RS-274-D ELECTRICAL TEST FORMATS Ipc-D356 NETLIST COMPARE FORMATS. » IPC-D356; IPC-D356A COMPRESSION FORMATS » ZIP; TAR; TGZ ‘SECURED DATA TRANSFER METHODS > SECURE DATA TRANSFER; PGP IPC CLASS 3 ETCHBACK SPECIFICATION......0.0002"-0.002" MIN. TEST CONTINUITY RESISTANCE. MAX. TEST VOLTAGE. MAX. TEST ISOLATED RESISTANCE, LARGEST TEST - FIXTURED. LARGEST TEST - FLYING PROBE, E-TEST PITCH (FIXTURE TEST), 0.020" E-TEST PITCH (FLYING PROBE TEST)......0.004” DC LINE RESISTANCE TESTING. YES 0.1 OHMS 1000 voLTs 25 MOHM-2G0HM 16" X22" 27" X24"

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