< ECN3297TF Product Specifications > Page 1 of 18

IC-SP-12006 R6

16-channel High Voltage analog switch IC

ECN3297TF Product Specification Rev.6
ECN3297 is 16-channel High Voltage analog switching IC with bleed resistors on which
latch-up free is realized by dielectric isolation technology.
High voltage and low ON-resistance MOS switches are used as output devices controlled
by a 3.3V or 5V signal. The ECN3297 is most suited to Ultrasound Imaging applications.

Functions
* High voltage and low on-resistance MOS switches integrated.
* 16bit shift resister integrated.
* Integrated bleed resistors on the outputs.
* Integrated clamping diodes for overvoltage protection positive overshoot.
Features
* Switch on-resistance: 19  typ. ( VPP=100V,VNN=-100V,ISIG=5mA, 25oC)
* Switch breakdown voltage: 220V
* Latch-up free CMOS and High-Voltage drive circuit.
* Power up/down sequence of power supply is free.
* 48-pin LQFP Package (RoHS compliant)
VPP
LEVEL OUTPUT
LATCHES SWITCHES
SHIFTERS
SW0A
D VPP
LE
DIN CL
VNN
SW0B

CLK
VNN

16 BIT
SHIFT
REGISTER

VPP

Dout
SW15A
D
LE VPP
CL
VNN
SW15B

VNN
VDD LE CL VNN VPP RGND

Fig.1 Block diagram

This datasheet has been downloaded from [Link] at this page

< ECN3297TF Product Specifications > Page 2 of 18
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1. General
This Specification shall be applied to the following semiconductor integrated circuit.

1) Parts name : ECN3297TF

2) Application : Ultrasound imaging scanner and others
3) Structure : Monolithic IC
4) Package : LQFP48

2. Absolute Maximum Ratings

Table 1 Absolute Maximum Ratings
No. Items Symbol Terminal Values Unit Note
1 Logic power supply voltage VDD VDD -0.5 to +7.0 V Ta＝25oC
2 VPP-VNN supply voltage - VPP，VNN 220 V Ta＝25oC
3 VPP Positive high voltage supply VPP VPP -0.5 to VNN+200 V Ta＝25oC
4 VNN negative high voltage supply VNN VNN -200 to +0.5 V Ta＝25oC
DIN, CLK, CL,
5 Logic input voltages VDD -0.5 to VDD+0.3 V Ta＝25oC
LE
6 Analog signal range - SW0 to SW15 VNN to VPP V Ta＝25oC
o
7 Operating junction temperature Tjop - -20 to +125 C
o
8 Storage temperature Tstg - -55 to +150 C
LQFP48
9 Power dissipation Pw - 1.0 W
Ta＝70oC
< ECN3297TF Product Specifications > Page 3 of 18
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3. Electrical Characteristics
3.1 DC Characteristics
Table 2 DC Characteristics Ta=25oC VDD=5V
Spec
No. Items Symbol Unit Test conditions
Min Typ Max
 24 38 I SIG=5mA VPP=40V,
 17 27 I SIG=200mA VNN=-160V
Small signal switch on  19 27 I SIG=5mA VPP=100V,
1 RONS 
resistance  15 24 I SIG=200mA VNN=-100V
 19 25 I SIG=5mA VPP=160V,
 15 25 I SIG=200mA VNN=-40V
Small signal switch on VPP=100V, VNN=-100V
2 ΔRONS  5 20 %
resistance matching ISW=5mA
Large signal switch on VPP=100V I SIG=1A
3 RONL  16 － 
resistance VNN=-100V
Value of output bleed Output switch to RGND
4 RINT 20 35 50 k
resistance IRINT=0.5mA
Switch off leakage per VSIG=VPP-10V,
5 ISOL  1.0 10 A
switch or VNN+10V
6 DC offset switch (off) DCOFF  10 100 mV No load
7 DC offset switch (on) DCON  10 100 mV No load
8 Positive HV supply current IPPQ1  10 50 A All SWs off
Negative HV supply
9 INNQ1  -10 -50 A All SWs off
current
10 Positive HV supply current IPPQ2  10 50 A All SWs on, ISW=5mA
Negative HV supply
11 INNQ2  -10 -50 A All SWs on, ISW=5mA
current
VPP=40V
  7.0
VNN=-160V 50kHz output
VPP=100V switching
12 IPP Supply current IPP   7.0 mA
VNN=-100V frequency
VPP=160V without load
  8.0
VNN=-40V
VPP=40V
  7.0
VNN=-160V 50kHz output
VPP=100V switching
13 INN Supply current INN   7.0 mA
VNN=-100V frequency
VPP=160V without load
  8.0
VNN=-40V
14 Logic supply average current IDD   4.0 mA fCLK=5MHz,VDD=5.0V
Logic supply quiescent
15 IDDQ   10 A
current
16 Data out source current ISOR 0.45 0.70  mA VOUT=ＶDD-0.7V
17 Data out sink current ISINK 0.45 0.70  mA VOUT=0.7V
< ECN3297TF Product Specifications > Page 4 of 18
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3.2 AC Characteristics
Table 3 AC Characteristics Ta=25oC VDD=5V
Spec
No. Items Symbol Unit Test conditions
Min Typ Max
1 SW Turn on time tON   5.0 s VSIG=VPP-10V, RL=10kΩ
2 SW Turn off time tOFF   5.0 s VSIG=VPP-10V, RL=10kΩ
50% duty cycle, fData=fCLK/2
  30 MHz
VDD= 5.0V
3 Clock frequency fCLK
50% duty cycle, fData=fCLK/2
  20 MHz
VDD=3.3V
Clock delay time to
4 tDO 16  55 ns DOUT terminal,VDD=3.3V
data out
12  42 ns DOUT terminal,VDD=5.0V
+VSPK   150 VPP=40V, VNN=-160V,
-VSPK   -150 RL=50
+VSPK   150 VPP=100V, VNN=-100V,
5 Output voltage spike mV
-VSPK   -150 RL=50
+VSPK   150 VPP=160V, VNN=-40V,
-VSPK   -150 RL=50

Table 4 AC Characteristics (for reference purpose only) Ta=25oC VDD=5V

Spec
No. Items Symbol Unit Condition
Min Typ Max
Off capacitance SW
1 CSG (off)  6  pF 0V, 1MHz
to GND
On Capacitance SW
2 CSG (on)  15  pF 0V, 1MHz
to GND
-30 -33  dB fsw=5MHz, 1k//15pF load
3 SW off isolation KO
-54 -60  dB fsw=5MHz, 50 load
4 SW Crosstalk KCR -54 -60  dB fsw=5MHz, 50 load

Note: These items are not tested when shipped.

< ECN3297TF Product Specifications > Page 5 of 18
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4. Recommended Operating Conditions
Please operate in use within the limit of recommended operating conditions detailed in Table 5.

Table 5 Recommended Operating Conditions

No Items Symbol Recommended Value
1 Logic power supply voltage VDD 3.0V to 5.5V
2 Positive high voltage supply VPP 40V to 160V
3 Negative high voltage supply VNN -160V to 0V
4 VPP-VNN supply voltage - 40V to 200V
5 High-level input voltage VIH 0.9VDD to VDD
6 Low-level input voltage VIL 0V to 0.1VDD
7 Analog signal voltage peak to peak VSIG VNN to VPP
8 Operating free air-temperature Ta 0oC to 70oC
9 Switching frequency Fsw 50kHz max, Duty Cycle=50%
10 Set up time for LE TSD Min.60ns
11 Pulse width of LE TWLE Min.40ns
12 Time width of CL TWCL Min.40ns
13 Set up time DATA to Clock TSU Min.10ns
14 Hold time DATA from Clock Th Min.10ns
15 Maximum VSIG Slew Rate dV/dt Max.30V/ns

Attention ;
1) Power up/down sequence of power supply is arbitrary except GND terminal of IC must be powered-up first and
powered-down last.
2) It is indispensable to make there are not to exceed a maximum rated voltage by the occurrence of the excessive
voltage in case of investing and cutting of the power supply.
< ECN3297TF Product Specifications > Page 6 of 18
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5. Test Circuit

Ｖ PP-10V
ＩＣ ＩＣ ＩＣ
ＲL
10KΩ
Ｖ PP-10V Ｉ SOL
Ｖ OUT Ｖ OUT

OPEN

RGND
OPEN RGND RGND
Ｖ DD Ｖ DD 5V Ｖ DD 5V
Ｖ PP Ｖ PP 5V Ｖ PP Ｖ PP Ｖ PP Ｖ PP
GND GND GND GND GND
Ｖ NN Ｖ NN GND Ｖ NN Ｖ NN Ｖ NN Ｖ NN

a) Switch OFF Leakage b) DC Offset ON/OFF c) ＴON/TOFF

ＩＣ ＩＣ ＩＣ
Ｖ IN=10Vp-p Ｖ IN=10Vp-p
@5MHz @5MHz Ｖ OUT +Ｖ spk
Ｖ OUT
～ ～
50Ω
50Ω -Ｖ spk
Ｖ OUT
NC
ＲL
ＲL
1KΩ
RGND RGND
RGND
Ｖ DD 5V Ｖ DD 5V Ｖ DD 5V
Ｖ PP Ｖ PP Ｖ PP Ｖ PP
Ｖ PP Ｖ PP
GND GND GND GND GND GND
Ｖ NN Ｖ NN Ｖ NN Ｖ NN Ｖ NN Ｖ NN
Ｋ o=20log(Ｖ OUT/Ｖ IN) Ｋ cr=20log(Ｖ OUT/Ｖ IN)

d) Off Isolation e) Crosstalk f) Output Voltage Spike

Fig. 2 Test Circuit

< ECN3297TF Product Specifications > Page 7 of 18
IC-SP-12006 R6
6. Timing Waveforms

DATA
DN+1 50% DN 50% DN-1
IN

LE 50% 50%

tWLE
tSD

50% 50%
CLOCK
tSU th
tDO

DATA
50% 50%
OUT
tOFF tON

OFF
90%
VOUT
(typ) 10%
ON

CLR
tWCL

Fig. 3 Timing Waveforms

Note
1. Serial data is clocked in on the rising edge of CLK.
2. The switches go to a state retaining their present condition on the rising edge of LE.

tWLE

LE
tSD

CLK

tSU tW

D15 D14 D13 D1 D0

DIN
MSB LSB

tDO

D15 D14 D13 D1 D0 D15

DOUT

Data from previous data byte ( power up : unknown )

Fig. 4 LATCH ENABLE Timing waveform

< ECN3297TF Product Specifications > Page 8 of 18
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7. Truth Table
Table 6 Truth table
D0 D1 D2 D3 D4 D5 D6 D7 LE CL SW0 SW1 SW2 SW3 SW4 SW5 SW6 SW7
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
X X X X X X X X H L HOLD PREVIOUS STATE
X X X X X X X X X H OFF OFF OFF OFF OFF OFF OFF OFF

D8 D9 D10 D11 D12 D13 D14 D15 LE CL SW8 SW9 SW10 SW11 SW12 SW13 SW14 SW15
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
L L L OFF
H L L ON
X X X X X X X X H L HOLD PREVIOUS STATE
X X X X X X X X X H OFF OFF OFF OFF OFF OFF OFF OFF
X = Don’t care

Note
1. The 16 Switches operate independently.
2. When LE is low, the shift register data flows through the latch.
3. Shift register clocking has no effect on the switch states if LE is high.
4. When switch 15 is ON, DOUT is high.
5. The clear input overrides all other inputs.
< ECN3297TF Product Specifications > Page 9 of 18
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8. Pin Configuration
ECN3297TF LQFP48（48Pin LQFP）
Table7．Pin Configuration
Pin Name Functions Note
1 N/C No connection. *1
2 N/C No connection. *1
3 SW4B Analog Switch 4
4 SW4A Analog Switch 4
5 SW3B Analog Switch 3
6 SW3A Analog Switch 3
7 SW2B Analog Switch 2
8 SW2A Analog Switch 2
9 SW1B Analog Switch 1
10 SW1A Analog Switch 1
11 SW0B Analog Switch 0
12 SW0A Analog Switch 0
13 VNN Negative High Voltage Supply. *2
14 N/C No connection. *1
15 VPP Positive High Voltage Supply. *2
16 N/C No connection. *1
17 GND Ground
18 VDD Logic Supply Voltage
19 DIN Serial Data Input
20 CLK Serial Clock Input
21 LE Latch-Enable Input
22 CLR Latch-Clear Input
23 DOUT Serial Data Output
24 RGND Ground. Connect to Bleed Resister. *3
25 SW15B Analog Switch 15
26 SW15A Analog Switch 15
27 SW14B Analog Switch 14
28 SW14A Analog Switch 14
29 SW13B Analog Switch 13
30 SW13A Analog Switch 13
31 SW12B Analog Switch 12
32 SW12A Analog Switch 12
33 SW11B Analog Switch 11
34 SW11A Analog Switch 11
35 N/C No connection. *1
36 N/C No connection. *1
37 SW10B Analog Switch 10
38 SW10A Analog Switch 10
39 SW9B Analog Switch 9
40 SW9A Analog Switch 9
41 SW8B Analog Switch 8
42 SW8A Analog Switch 8
43 SW7B Analog Switch 7
44 SW7A Analog Switch 7
45 SW6B Analog Switch 6
46 SW6A Analog Switch 6
47 SW5B Analog Switch 5
48 SW5A Analog Switch 5
Note 1. NOT connected on chip internal.
2. High voltage supply.
3. Connected all analog switches with bleed resistor on chip internal.
< ECN3297TF Product Specifications > Page 10 of 18
IC-SP-12006 R6

36 35 34 33 32 31 30 29 28 27 26 25

37 24
38 23
39 22
40 21
41 20
42 19
43
ECN3297TF 18
44 17
45 16
46 15
47 14
48 13

1 2 3 4 5 6 7 8 9 10 11 12
48pin Package
< ECN3297TF Product Specifications > Page 11 of 18
IC-SP-12006 R6

9. Package Outline

Units：mm

９．００±０．２０
７．００TYP

０．５０
９．００±０．２０
７．００TYP

１．７０Ｍａｘ
０．１９±０．０５
０．１７±０．０５

１．００TYP
０．１0 ±０．07

０．５０±０．１０
０．１０
< ECN3297TF Product Specifications > Page 12 of 18
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10. Marking spec

(a) (b) (c) (d) (e)

E C N 3 2
Blank
9 7 T F

INDEX pin

Lot numbering rule

(a) :Year code (Least significant digit of Assembled year (A.D.))

(b) :Month code (Refer to following table.)

Month 1 2 3 4 5 6 7 8 9 10 11 12
Month
A B C D E K L M N X Y Z
code

(c),(d),(e) :Serial number within year/month code

< ECN3297TF Product Specifications > Page 13 of 18
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11. Packing Form

Packaging details are as shown below.
Label Carton tape Dry pack.
[Link] and IC type No. and Label
inner Quantity IC type No. andtity
(max 2500 IC/box)
packing

Inner

Outer box (cardboard box)

Tray Specifications
[Link] Orientation of IC

Enlargement

IC Index

Tray Index
Tray dimension
(322.6)
3.8 315 3.8 Unit: mm
11.1 292.8
11.25

12.2
31.1
ＴＱＦＰ７×７ｍｍ［Ａ２＝１．４］
9×12.6=(113.4)
Mark

* * *
135.9

* * * *
92.1

* * * *
12.6

* * *
１０×２５＝２５０

１５０℃ＭＡＸ

C3
12.7
11.25

14 positions without holes (*)

7.62
1.27

34.3 25.4 25.4

255.3

(1) Material of tray is PPE containing carbon and static proof.

(2) Packing quantity is max 250 IC/Tray.
(3) Maximum heat resistant temperature is 150deg.
< ECN3297TF Product Specifications > Page 14 of 18
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12. Inspection
Hundred percent inspections shall be conducted on electric characteristics.

13. Precautions for use

13.1 Countermeasures against Electrostatic Discharge (ESD)
(a) Customers need to take precautions to protect ICs from electrostatic discharge (ESD). The material
of the container or any other device used to carry ICs should be free from ESD, which can be
caused by vibration during transportation. Use of electrically conductive containers is
recommended as an effective countermeasure.
(b) Everything that touches ICs, such as the work platform, machine, measuring equipment, and test
equipment, should be grounded.
(c) Workers should be high-impedance grounded (100kΩ to 1MΩ) while working with ICs, to avoid
damaging the ICs by ESD.
(d) Friction with other materials, such as high polymers, should be avoided.
(e) When carrying a PCB with a mounted IC, ensure that the electric potential is maintained at a
constant level using the short-circuit terminals and that there is no vibration or friction.
(f) The humidity at an assembly line where ICs are mounted on circuit boards should be kept around 45
to 75 percent using humidifiers or such. If the humidity cannot be controlled effectively, using ionized
air blowers (ionizers) is effective.

13.2 Maximum ratings

Regardless of changes in external conditions during use IC (the product of Hitachi Power
Semiconductor Device, hereinafter called “HPSD’s IC”), the “maximum ratings” described in this
document should never be exceeded when designing electronic circuits that employ HPSD’s IC. If
maximum ratings are exceeded, HPSD’s IC may be damaged or destroyed. In no event shall Hitachi
Power Semiconductor Device (hereinafter called “HPSD”) be liable for any failure in HPSD’s IC or any
secondary damage resulting from use at a value exceeding the maximum ratings.

13.3 Derating Design

Continuous high-load operation (high temperatures, high voltages, large currents) should be avoided
and derating design should be applied, even within the ranges of the maximum ratings, to ensure
reliability.

13.4 Safe Design

The HPSD’s IC may fail due to accidents or unexpected surge voltages. Accordingly, adopt safe design
features, such as redundancy and measures to prevent misuse, in order to avoid extensive damage in
the event of a failure.

13.5 Application
If HPSD’s IC is applied to the following uses where high reliability is required, obtain the document of
permission from HPSD in advance.
・Automobile, Train, Vessel, etc.
Do not apply HPSD’s IC to the following uses where extremely high reliability is required.
・Nuclear power control system, Aerospace instrument, Life-support-related medical equipment, etc.

13.6 Soldering
Lead-free solder is used for coating pins and the tab of this IC.
Refer to "Precautions for Use of High Voltage Monolithic Ics” for soldering conditions.

13.7 Others
See “Instructions for Use of Hitachi High-Voltage Monolithic ICs” for other precautions and instructions
on how to deal with these kinds of products.
< ECN3297TF Product Specifications > Page 15 of 18
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14. Usage
(1) HPSD warrants that the HPSD products have the specified performance according to the respective
specifications at the time of its sale. Testing and other quality control techniques of the HPSD products
by HPSD are utilized to the extent HPSD needs to meet the specifications described in this document.
Not every device of the HPSD products is specifically tested on all parameters, except those mandated
by relevant laws and/or regulations.

(2) Following any claim regarding the failure of a product to meet the performance described in this document
made within one month of product delivery, all the products in relevant lot(s) shall be re-tested and re-
delivered. The HPSD products delivered more than one month before such a claim shall not be counted
for such response.

(3) HPSD assumes no obligation nor makes any promise of compensation for any fault which should be
found in a customer’s goods incorporating the products in the market. If a product failure occurs for
reasons obviously attributable to HPSD and a claim is made within six months of product delivery,
HPSD shall offer free replacement or payment of compensation. The maximum compensation shall be
the amount paid for the products, and HPSD shall not assume responsibility for any other
compensation.

(4) HPSD reserves the right to make changes in this document and to discontinue mass production of the
relevant products without notice. Customers are advised to confirm specification of the product of
inquiry before purchasing of the products that the customer desired. Customers are further advised to
confirm before purchasing of such above products that the product of inquiry is the latest version and
that the relevant product is in mass production status if the purchasing of the products by the customer
is suspended for one year or more.

(5) When you dispose of HPSD products and/or packing materials, comply with the laws and regulations of
each country and/or local government. Conduct careful preliminary studies about environmental laws
applying to your products such as RoHS, REACH. HPSD shall not assume responsibility for
compensation due to contravention of laws and/or regulations.

(6) HPSD shall not be held liable in any way for damages and infringement of patent rights, copyright or
other intellectual property rights arising from or related to the use of the information, products, and
circuits in this document.

(7) No license is granted by this document of any patents, copyright or other intellectual property rights of
any third party or of HPSD.

(8) This document may not be reprinted, reproduced or duplicated, in any form, in whole or in part without
the express written permission of HPSD.

(9) You shall not use the HPSD products (technologies) described in this document and any other products
(technologies) manufactured or developed by using them (hereinafter called “END Products”) or
supply the HPSD products (technologies) and END Products for the purpose of disturbing international
peace and safety, including (ⅰ) the design, development, production, stockpiling or any use of
weapons of mass destruction such as nuclear, chemical or biological weapons or missiles, (ⅱ) the
other military activities, or (ⅲ) any use supporting these activities. You shall not sell, export, dispose
of, license, rent, transfer, disclose or otherwise provide the HPSD products (technologies) and END
Products to any third party whether directly or indirectly with knowledge or reason to know that the
third party or any other party will engage in the activities described above.
When exporting, re-export transshipping or otherwise transferring the HPSD products (technologies)
and END Products, all necessary procedures are to be taken in accordance with Foreign Exchange
and Foreign Trade Act (Foreign Exchange Act) of Japan, Export Administration Regulations (EAR) of
US, and any other applicable export control laws and regulations promulgated and administered by the
governments of the countries asserting jurisdictions over the parties or transaction.
< ECN3297TF Product Specifications > Page 16 of 18
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◆Appendix-Supplementary Data

Please read below contents before using this product.

Function Discription

1. Bleed resistor
ECN3297TF feature integrated 35kΩ bleed resistor to discharge capacitive Loads such as
piezoelectric transducers. Each analog switch terminal is coneccted RGND with a bleed resistor.

2. Overvoltage Protection
ECN3297TF feature clamping diodes to protect circuit against the overvoltage exceed VPP or
VNN. ALL analog switches connect VPP and VNN terminals with clamping diode.
Normaly, switch input voltage must not exceed VNN and VPP, and maximum current flows
through the clamping diode should be less than 1A.

3. Power supply seaquence

ECN3297TF doesn’t require special sequencing of the VPP, VNN, and VDD supply
[Link], logic state is unsettled when power-up. After power-up, please refer to the truth
table (Page.7 Table.7) and set the data of shift register.
 Precautions for Safe Use and Notices
If semiconductor devices are handled in an inappropriate manner, failures may result. For this reason, be
sure to read the latest version of “Instructions for Use of Hitachi High-Voltage Monolithic ICs” before use.

 ! This mark indicates an item requiring caution.

 CAUTION
!
This mark indicates a potentially hazardous situation which, if not avoided, may result
in minor or moderate injury and damage to property.

 CAUTION
!

(1) Regardless of changes in external conditions during use of semiconductor devices, the “maximum ratings” and “safe
operating area(SOA)” should never be exceeded when designing electronic circuits that employ semiconductor devices.
(2) Semiconductor devices may fail due to accidents or unexpected surge voltages. Accordingly, adopt safe design features,
such as redundancy and measures to prevent misuse, in order to avoid extensive damage in the event of a failure.
(3) If semiconductor devices are applied to uses where high reliability is required, obtain the document of permission from
HPSD in advance (Automobile, Train, Vessel, etc.). Do not apply semiconductor devices to uses where extremely high
reliability is required (Nuclear power control system, Aerospace instrument, Life-support-related medical equipment, etc.).
(If a semiconductor device fails, there may be cases in which the semiconductor device, wiring or wiring pattern will emit
smoke or cause a fire or in which the semiconductor device will burst.)

NOTICES
1. This Data Sheet contains the specifications, characteristics, etc. concerning power semiconductor products (hereinafter
called “products”).
2. All information included in this document such as product data, diagrams, charts, algorithms, and application circuit
examples, is current as of the date this document is issued. Such information, specifications of products, etc. are subject to
change without prior notice. Before purchasing or using any of the HPSD products listed in this document, please confirm
the latest product information with a HPSD sales office.
3. HPSD shall not be held liable in any way for damages and infringement of patent rights, copyright or other intellectual
property rights arising from or related to the use of the information, products, and circuits in this document.
4. No license is granted by this document of any patents, copyright or other intellectual property rights of any third party or of
HPSD.
5. This document may not be reprinted, reproduced or duplicated, in any form, in whole or in part without the express written
permission of HPSD.
6. You shall not use the HPSD products (technologies) described in this document and any other products (technologies)
manufactured or developed by using them (hereinafter called “END Products”) or supply the HPSD products (technologies)
and END Products for the purpose of disturbing international peace and safety, including (ⅰ) the design, development,
production, stockpiling or any use of weapons of mass destruction such as nuclear, chemical or biological weapons or
missiles, (ⅱ) the other military activities, or (ⅲ) any use supporting these activities. You shall not sell, export, dispose of,
license, rent, transfer, disclose or otherwise provide the HPSD products (technologies) and END Products to any third party
whether directly or indirectly with knowledge or reason to know that the third party or any other party will engage in the
activities described above.
When exporting, re-export transshipping or otherwise transferring the HPSD products (technologies) and END Products, all
necessary procedures are to be taken in accordance with Foreign Exchange and Foreign Trade Act (Foreign Exchange Act)
of Japan, Export Administration Regulations (EAR) of US, and any other applicable export control laws and regulations
promulgated and administered by the governments of the countries asserting jurisdictions over the parties or transaction.
7. In no event shall HPSD be liable for any failure in HPSD products or any secondary damage resulting from use at a value
exceeding the maximum ratings.

Refer to the following website for the latest information. Contact a HPSD sales office if you have any questions.

[Link]