3
Anisotropic Conductive Film Adhesive
5363
Technical Data Page September, 2006
Product Description 3M™ Anisotropic Conductive Film (ACF) Adhesive 5363 is a heat-bondable,
electrically conductive adhesive film. It is slightly tacky at room temperature and
consists of a thermoset-thermoplastic adhesive matrix randomly loaded with
conductive particles. These particles allow interconnection of circuit lines through
the adhesive thickness, but are spaced far enough apart for the product to be
electrically insulating in the plane of the adhesive. Application of heat and pressure
causes the adhesive to flow and to bring the circuit pads into contact by trapping the
conductive particles. The adhesive rapidly cures at modest bonding temperature.
ACF 5363 may be used to bond a flexible printed circuit to another flexible printed
circuit or to a printed circuit board.
Construction
General Properties
Property
Adhesive Type Thermosetting Type
Particle Type Gold-Coated Nickel
Particle Size 8 microns
Liner Type Polyester Film with Silicone
Release
Adhesive Thickness 40 microns
Liner Thickness 50 microns
Typical Physical Note: The following technical information and data should be considered
Properties and representative or typical only and should not be used for specification purposes.
Performance
Characteristics
Design Requirements
Property Value Units
Minimum Space 100 Micron
Between Conductors (4) (mil)
200 Micron
Minimum Pitch
(8) (mil)
Temperature Cycling -40 to 85 °C
Range (-4 to 176) (°F)
3M™ Anisotropic Conductive Film Adhesive
5363
Ambient Physical Properties
Property Test Substrates Value Test Method
( 1) (2 ) (3 )
Interconnect Resistance Flex to PC board < 0.10 Ohms 3M TM-2314
(4)
Peel Strength(1) Flex to PC board(2) ≥700 gf/cm 3M TM-2313
Reliability Performance
Test Conditions Interconnect Resistance(2, 5)
(Ω)
3M TM-2314(3)
85°C x 1000 hrs <0.10
125°C x 1000 hrs <0.10
-40°C x 1000 hrs <0.10
85°C/85% RH x 1000hrs <0.10
-40°C to 85°C x 500 cycles <0.10
(1)
For a given application, values may differ depending on particular flex circuit and PC
board materials used.
(2)
Measured for gold/nickel/copper polyimide flex circuits bonded to gold/nickel/copper/FR-4
PC board. Contact overlap area was 0.2 sq. mm. Pad pitch was 200 microns.
(3)
3M internal test method TM-2314 based on test method IPC 650 – Section 2.6.24. The
flex has the shorting strap located in or near the bond-line to approximate a 4-wire test
structure and eliminate extraneous resistance in the measurement due to the circuit lines.
(4)
3M internal test method TM-2313 based on test method IPC 650 – Section 2.4.9.1.
(5)
For a given application, values may differ depending on particular flex circuit and PC
board materials used.
Assembly Process
Techniques Tacking and Bonding Conditions
Procedure Conditions
Tacking Conditions
Temperature(6) 90°C
Pressure 1 - 15 kg/cm2
Time ~1 second
Bonding Conditions
Temperature(6) 190°C
Pressure ~30 kg/cm2
Time(7) 10 seconds
6)
Temperature measured in the adhesive. Thermode set points will be higher and will
depend upon the substrate materials and bond equipment. A typical bonding set-up for a
flex interconnect bond is a thermode temperature of 300°C and a bonding time of 10
seconds (see next note).
7)
The required minimum bonding temperature of 190°C is usually reached within the first 5
seconds of bonding. The adhesive should be bonded so that the temperature is held
above the minimum of 190C for at least an additional 5 seconds. Also, it may be
desirable to hold pressure while cooling to below 100C for maximum performance.
3M™ Anisotropic Conductive Film Adhesive
5363
Assembly Process
A source of heat and pressure, such as a thermo-compression (hot bar) bonder is
required for use of 3M™ Anisotropic Conductive Film Adhesive 5363. Several
commercially available models exist; a list of vendors can be obtained by calling
the toll free number on the back of this technical data sheet.
Bonding of the ACF 5363 requires a three-part procedure:
tacking the film to one substrate (pre-tacking)
removing the release liner
bonding the first substrate to the second substrate.
A pre-tacking temperature of 90°C under a pressure of 10 kg/cm² has been found
to be effective. Cut the adhesive to the size of the flex circuit. Place the adhesive
on the flex and set flex on hot plate at setpoint up to 90°C. Use roller to press
adhesive onto the flex. After allowing flex and adhesive to cool, remove liner.
Final bonding must be done under heat and pressure, with a typical desirable bond
line temperature at or above 190°C, held for 10 seconds, and a pressure of 30
kg/cm². During bonding, electrical contact is typically achieved within the first
second after the bond line reaches 190°C. Additional time at temperature is
necessary to fully cure the epoxy material to generate peel strength and the
ultimate reliability. Bond times may vary depending upon the substrates to be
bonded. For maximum mechanical and electrical performance, the pressure
should be maintained while cooling to below 100ºC. This increases the total bond
time. The time required to drop adhesive bond-line temperature below 100ºC is
highly dependent upon the bonding equipment used.
Repair
Bonds made with 3M™ Anisotropic Conductive Film Adhesive 5363 are
repairable by heating the bond-line to above 170°C (e.g. with a hot plate or rework
tool) and peeling the circuits apart. The bond site then requires cleaning with a
solvent, after which the circuit can be re-bonded using a fresh piece of ACF 5363.
Solvents such as 3M™ Novec™ 72DA Engineered Fluid may be used.
Note: Carefully read and follow the manufacturer’s precautions and directions
for use.
3M™ Anisotropic Conductive Film Adhesive
5363
Storage
3M™ Anisotropic Conductive Film Adhesive 5363 should be kept frozen in the
original airtight shipping bag. The ACF 5363 has a shelf life of at least 6 months
following receipt by the customer when stored at temperatures ≤ 2oC. The product
should be allowed to warm to room temperature for approximately 30 minutes
prior to use to prevent moisture condensation on the film. Whenever possible,
ACF 5363 should be kept away from high humidity environments as absorbed
water can lead to moisture volatilization producing bubbles during heat bonding or
gradual degradation of the product. The ACF 5363 can be held at room
temperature for product utilization provided the cumulative room temperature
shelf life is not exceeded. The room temperature shelf life is 4 weeks.
Shelf Life Data
Storage Environment Shelf Life
Freezer (2oC) 9 months
Room Temperature 4 weeks
3M™ Anisotropic Conductive Film Adhesive Product Selection Guide
Flex Type Connection
Pitch
Type
(≥ 200 micron)
(≤ 100 micron)
Flex to Glass
on Polyimide
Gold/Copper
Gold/Copper
on Polyester
Silver Ink on
Flex to PCB
Flex to Flex
Very Fine
Moderate
Polyester
Product
Fine
5363 x x x x
5460R x x x x
5552R x x x
> 0.50
7303 x x x x* x x
mm
> 0.50
7313 x x x x* x x
mm
† † > 0.76
9703 x x x x
mm
† † > 0.76
9705 x x x x
mm
* Tested only for silver frit traces; not suitable for ITO traces.
†
Requires mechanical backup for lowest electrical resistance.
3M™ Anisotropic Conductive Film Adhesive
5363
Precautionary Refer to Product Label and Material Safety Data Sheet for Health and Safety Information before
using this product. For additional health and safety information, call 1-800-364-3577 or (651) 737-
Information 6501.
For Additional To request additional product information or to arrange for sales assistance, call toll free 1-800-251-
8634. Address correspondence to: 3M Electronics, Building 21-1W-10, 900 Bush Avenue, St. Paul,
Information MN 55144-1000. Our fax number is 651-778-4244. In Canada, phone: 1-800-634-3577. In Puerto
Rico, phone: 1-787-750-3000. In Mexico, phone: 52-70-04-00.
Product Use All statements, technical information and recommendations contained in this document are based
upon tests or experience that 3M believes are reliable. However, many factors beyond 3M’s control
can affect the use and performance of a 3M product in a particular application, including the
conditions under which the product is used and the time and environmental conditions in which the
product is expected to perform. Since these factors are uniquely within the user’s knowledge and
control, it is essential that the user evaluate the 3M product to determine whether it is fit for a
particular purpose and suitable for the user’s method of application.
Warranty and Limited Unless stated otherwise in 3M’s product literature, packaging inserts or product packaging for
individual products, 3M warrants that each 3M product meets the applicable specifications at the
Remedy time 3M ships the product. Individual products may have additional or different warranties as stated
on product literature, packaging inserts or product packages. 3M MAKES NO OTHER
WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, ANY IKMPLIED
WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR ANY
IMPLIED WARRANTY ARISING OUT OF A COURSE OF DEALING, CUSTOM OR USAGE OF
TRADE. User is responsible for determining whether the 3M product is fit for a particular purpose
and suitable for user’s application. If the 3M product is defective within the warranty period, your
exclusive remedy and 3M’s and seller’s sole obligation will be, at 3M’s option, to replace the product
or refund the purchase price.
Limitation of Liability Except where prohibited by law, 3M and seller will not be liable for any loss or damage arising from
the 3M product, whether direct, indirect, special, incidental or consequential, regardless of the legal
theory asserted, including warranty, contract, negligence or strict liability.
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3M Electronics
3M Center, Building 21-1W-10, 900 Bush Avenue
St. Paul, MN 55144-1000
1-800-251-8634 phone Recycled Paper Printed in U.S.A
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www.3M.com/electronics 10% post-consumer 60-5002-0130-0 (9/06)
